TWI563579B - Method and apparatus for supplying resin material of compression molding apparatus - Google Patents

Method and apparatus for supplying resin material of compression molding apparatus

Info

Publication number
TWI563579B
TWI563579B TW103134722A TW103134722A TWI563579B TW I563579 B TWI563579 B TW I563579B TW 103134722 A TW103134722 A TW 103134722A TW 103134722 A TW103134722 A TW 103134722A TW I563579 B TWI563579 B TW I563579B
Authority
TW
Taiwan
Prior art keywords
resin material
compression molding
supplying resin
molding apparatus
supplying
Prior art date
Application number
TW103134722A
Other languages
English (en)
Chinese (zh)
Other versions
TW201521125A (zh
Inventor
Hiroki Owari
Naoki Takada
Original Assignee
Towa Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Towa Corp filed Critical Towa Corp
Publication of TW201521125A publication Critical patent/TW201521125A/zh
Application granted granted Critical
Publication of TWI563579B publication Critical patent/TWI563579B/zh

Links

TW103134722A 2013-11-28 2014-10-06 Method and apparatus for supplying resin material of compression molding apparatus TWI563579B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013246069A JP6057880B2 (ja) 2013-11-28 2013-11-28 圧縮成形装置の樹脂材料供給方法及び供給装置

Publications (2)

Publication Number Publication Date
TW201521125A TW201521125A (zh) 2015-06-01
TWI563579B true TWI563579B (en) 2016-12-21

Family

ID=53377194

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103134722A TWI563579B (en) 2013-11-28 2014-10-06 Method and apparatus for supplying resin material of compression molding apparatus

Country Status (4)

Country Link
JP (1) JP6057880B2 (ja)
KR (1) KR101704884B1 (ja)
CN (1) CN104708752B (ja)
TW (1) TWI563579B (ja)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6049597B2 (ja) * 2013-11-28 2016-12-21 Ｔｏｗａ株式会社 圧縮成形装置の樹脂材料供給方法及び供給機構、並びに圧縮成形方法及び圧縮成形装置
JP6456254B2 (ja) * 2015-06-16 2019-01-23 アピックヤマダ株式会社 フィルム搬送装置及びフィルム搬送方法並びに樹脂モールド装置
JP6080907B2 (ja) * 2015-06-25 2017-02-15 Ｔｏｗａ株式会社 圧縮成形装置の樹脂材料供給装置及び方法、圧縮成形装置、並びに樹脂成形品製造方法
JP6672103B2 (ja) * 2016-08-01 2020-03-25 Ｔｏｗａ株式会社 樹脂成形装置及び樹脂成形品製造方法
JP6423399B2 (ja) * 2016-09-27 2018-11-14 アピックヤマダ株式会社 樹脂成形方法、フィルム搬送装置および樹脂成形装置
JP6298871B1 (ja) * 2016-10-21 2018-03-20 Ｔｏｗａ株式会社 樹脂材料供給装置、樹脂材料供給方法、樹脂成形装置、及び樹脂成形品製造方法
JP6270969B2 (ja) * 2016-11-22 2018-01-31 Ｔｏｗａ株式会社 圧縮成形装置の樹脂材料供給方法及び供給機構、並びに圧縮成形方法及び圧縮成形装置
JP6774865B2 (ja) * 2016-12-13 2020-10-28 アピックヤマダ株式会社 枠体治具、樹脂供給治具及びその計量方法、モールド樹脂の計量装置及び方法、樹脂供給装置、樹脂供給計量装置及び方法、並びに樹脂モールド装置及び方法
JP6236561B1 (ja) * 2017-04-27 2017-11-22 信越エンジニアリング株式会社 ワーク貼り合わせ装置及びワーク貼り合わせ方法
JP6165372B1 (ja) * 2017-01-10 2017-07-19 信越エンジニアリング株式会社 ワーク搬送装置及びワーク搬送方法
CN109230725B (zh) * 2017-11-01 2024-06-04 郑州大学 一种矩形单元张膜装置
KR102504837B1 (ko) 2018-07-23 2023-02-28 삼성전자 주식회사 이형 필름 공급 장치를 포함하는 수지 성형 장치
RU2707898C1 (ru) * 2019-04-26 2019-12-02 Линар Салихзанович Сабитов Трехгранная решетчатая опора

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200406293A (en) * 2002-09-06 2004-05-01 Towa Corp Resin encapsulation molding method of electronic part and resin encapsulation molding apparatus used therefor
TW200737371A (en) * 2006-03-20 2007-10-01 Towa Corp Resin sealing/molding apparatus
JP2010036542A (ja) * 2008-08-08 2010-02-18 Towa Corp 電子部品の圧縮成形方法及び金型装置
JP2013180461A (ja) * 2012-03-01 2013-09-12 Towa Corp 圧縮成形用型、圧縮成形装置及び圧縮成形方法
TW201338063A (zh) * 2012-03-07 2013-09-16 Towa Corp 樹脂封裝電子零件之製造方法及樹脂封裝電子零件之製造裝置

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JPH0785899B2 (ja) * 1989-02-20 1995-09-20 積水化学工業株式会社 熱成形性複合シートのプレス方法
JP3413356B2 (ja) * 1997-12-25 2003-06-03 住友化学工業株式会社 多層成形品の製造に用いる金型装置
JP4253393B2 (ja) * 1999-03-10 2009-04-08 Ｔｏｗａ株式会社 半導体ウェーハの樹脂被覆方法及び金型
JP4479063B2 (ja) * 2000-06-15 2010-06-09 トヨタ自動車株式会社 車両のフードヒンジ構造
JP4262468B2 (ja) * 2002-10-30 2009-05-13 アピックヤマダ株式会社 樹脂モールド方法、樹脂モールド装置およびこれに用いる支持治具
JP4336499B2 (ja) * 2003-01-09 2009-09-30 Ｔｏｗａ株式会社 電子部品の樹脂封止成形方法及び装置
JP5004410B2 (ja) * 2004-04-26 2012-08-22 Ｔｏｗａ株式会社 光素子の樹脂封止成形方法および樹脂封止成形装置
JP2009083438A (ja) * 2007-10-03 2009-04-23 Towa Corp 電子部品の圧縮成形方法
KR101000776B1 (ko) * 2008-07-24 2010-12-15 세크론 주식회사 전자 부품 몰딩 장치
JP5877083B2 (ja) * 2012-02-14 2016-03-02 住友重機械工業株式会社 樹脂封止装置及び樹脂封止方法
JP6071216B2 (ja) * 2012-02-28 2017-02-01 Ｔｏｗａ株式会社 樹脂封止用材料の製造方法及び樹脂封止装置
JP6049597B2 (ja) * 2013-11-28 2016-12-21 Ｔｏｗａ株式会社 圧縮成形装置の樹脂材料供給方法及び供給機構、並びに圧縮成形方法及び圧縮成形装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200406293A (en) * 2002-09-06 2004-05-01 Towa Corp Resin encapsulation molding method of electronic part and resin encapsulation molding apparatus used therefor
TW200737371A (en) * 2006-03-20 2007-10-01 Towa Corp Resin sealing/molding apparatus
JP2010036542A (ja) * 2008-08-08 2010-02-18 Towa Corp 電子部品の圧縮成形方法及び金型装置
JP2013180461A (ja) * 2012-03-01 2013-09-12 Towa Corp 圧縮成形用型、圧縮成形装置及び圧縮成形方法
TW201338063A (zh) * 2012-03-07 2013-09-16 Towa Corp 樹脂封裝電子零件之製造方法及樹脂封裝電子零件之製造裝置

Also Published As

Publication number Publication date
CN104708752A (zh) 2015-06-17
KR101704884B1 (ko) 2017-02-08
KR20150062125A (ko) 2015-06-05
CN104708752B (zh) 2017-06-06
TW201521125A (zh) 2015-06-01
JP6057880B2 (ja) 2017-01-11
JP2015101083A (ja) 2015-06-04

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