TWI563278B - - Google Patents

Info

Publication number
TWI563278B
TWI563278B TW102100382A TW102100382A TWI563278B TW I563278 B TWI563278 B TW I563278B TW 102100382 A TW102100382 A TW 102100382A TW 102100382 A TW102100382 A TW 102100382A TW I563278 B TWI563278 B TW I563278B
Authority
TW
Taiwan
Application number
TW102100382A
Other versions
TW201337307A (zh
Inventor
Yosuke Morita
Original Assignee
Panasonic Ip Man Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Ip Man Co Ltd filed Critical Panasonic Ip Man Co Ltd
Publication of TW201337307A publication Critical patent/TW201337307A/zh
Application granted granted Critical
Publication of TWI563278B publication Critical patent/TWI563278B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01V—GEOPHYSICS; GRAVITATIONAL MEASUREMENTS; DETECTING MASSES OR OBJECTS; TAGS
    • G01V8/00—Prospecting or detecting by optical means
    • G01V8/10—Detecting, e.g. by using light barriers
    • G01V8/20—Detecting, e.g. by using light barriers using multiple transmitters or receivers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/14—Measuring arrangements characterised by the use of optical techniques for measuring distance or clearance between spaced objects or spaced apertures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J1/00—Photometry, e.g. photographic exposure meter
    • G01J1/42—Photometry, e.g. photographic exposure meter using electric radiation detectors
    • G01J1/429—Photometry, e.g. photographic exposure meter using electric radiation detectors applied to measurement of ultraviolet light
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/0022—Radiation pyrometry, e.g. infrared or optical thermometry for sensing the radiation of moving bodies
    • G01J5/0025—Living bodies
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G01J5/08—Optical arrangements
    • G01J5/0808—Convex mirrors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G01J5/08—Optical arrangements
    • G01J5/0868—Means for illuminating a slit or a surface efficiently, e.g. entrance slit of a pyrometer or entrance face of a fiber
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G01J5/08—Optical arrangements
    • G01J5/0896—Optical arrangements using a light source, e.g. for illuminating a surface
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S17/00—Systems using the reflection or reradiation of electromagnetic waves other than radio waves, e.g. lidar systems
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S17/00—Systems using the reflection or reradiation of electromagnetic waves other than radio waves, e.g. lidar systems
    • G01S17/02—Systems using the reflection of electromagnetic waves other than radio waves
    • G01S17/04—Systems determining the presence of a target
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
    • G01S7/48—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S17/00
    • G01S7/481—Constructional features, e.g. arrangements of optical elements
    • G01S7/4811—Constructional features, e.g. arrangements of optical elements common to transmitter and receiver
    • G01S7/4813—Housing arrangements
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
    • G01S7/48—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S17/00
    • G01S7/481—Constructional features, e.g. arrangements of optical elements
    • G01S7/4814—Constructional features, e.g. arrangements of optical elements of transmitters alone
    • G01S7/4815—Constructional features, e.g. arrangements of optical elements of transmitters alone using multiple transmitters
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/0304—Detection arrangements using opto-electronic means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/033—Pointing devices displaced or positioned by the user, e.g. mice, trackballs, pens or joysticks; Accessories therefor
    • G06F3/0354—Pointing devices displaced or positioned by the user, e.g. mice, trackballs, pens or joysticks; Accessories therefor with detection of 2D relative movements between the device, or an operating part thereof, and a plane or surface, e.g. 2D mice, trackballs, pens or pucks
    • G06F3/03547—Touch pads, in which fingers can move on a surface
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03K—PULSE TECHNIQUE
    • H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
    • H03K17/94—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the way in which the control signals are generated
    • H03K17/941—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the way in which the control signals are generated using an optical detector
    • H03K17/943—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the way in which the control signals are generated using an optical detector using a plurality of optical emitters or detectors, e.g. keyboard
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0284—Details of three-dimensional rigid printed circuit boards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H01L2924/15155—Shape the die mounting substrate comprising a recess for hosting the device the shape of the recess being other than a cuboid
    • H01L2924/15156—Side view
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03K—PULSE TECHNIQUE
    • H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
    • H03K17/94—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the way in which the control signals are generated
    • H03K17/945—Proximity switches
    • H03K2017/9455—Proximity switches constructional details
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03K—PULSE TECHNIQUE
    • H03K2217/00—Indexing scheme related to electronic switching or gating, i.e. not by contact-making or -breaking covered by H03K17/00
    • H03K2217/94—Indexing scheme related to electronic switching or gating, i.e. not by contact-making or -breaking covered by H03K17/00 characterised by the way in which the control signal is generated
    • H03K2217/941—Indexing scheme related to electronic switching or gating, i.e. not by contact-making or -breaking covered by H03K17/00 characterised by the way in which the control signal is generated using an optical detector
    • H03K2217/94111—Indexing scheme related to electronic switching or gating, i.e. not by contact-making or -breaking covered by H03K17/00 characterised by the way in which the control signal is generated using an optical detector having more than one emitter
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0338—Layered conductor, e.g. layered metal substrate, layered finish layer, layered thin film adhesion layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2054—Light-reflecting surface, e.g. conductors, substrates, coatings, dielectrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Remote Sensing (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Electromagnetism (AREA)
  • Human Computer Interaction (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Geophysics (AREA)
  • General Life Sciences & Earth Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Switches Operated By Changes In Physical Conditions (AREA)
  • Geophysics And Detection Of Objects (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Measurement Of Optical Distance (AREA)
  • Photometry And Measurement Of Optical Pulse Characteristics (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
TW102100382A 2012-01-13 2013-01-07 近接感測器 TW201337307A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012005554A JP2013145174A (ja) 2012-01-13 2012-01-13 近接センサ

Publications (2)

Publication Number Publication Date
TW201337307A TW201337307A (zh) 2013-09-16
TWI563278B true TWI563278B (zh) 2016-12-21

Family

ID=48781459

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102100382A TW201337307A (zh) 2012-01-13 2013-01-07 近接感測器

Country Status (7)

Country Link
US (1) US9223054B2 (zh)
EP (1) EP2804022A4 (zh)
JP (1) JP2013145174A (zh)
KR (1) KR20140105566A (zh)
CN (1) CN104054008B (zh)
TW (1) TW201337307A (zh)
WO (1) WO2013105510A1 (zh)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102138510B1 (ko) * 2013-08-27 2020-07-28 엘지전자 주식회사 근접 터치 기능을 구비한 전자 장치 및 그 제어 방법
JP6247121B2 (ja) * 2014-03-17 2017-12-13 アルプス電気株式会社 入力装置
JP2015179054A (ja) * 2014-03-20 2015-10-08 京セラディスプレイ株式会社 表示装置
US9525770B2 (en) * 2014-03-26 2016-12-20 Google Technology Holdings LLC Portable electronic device with dual, diagonal proximity sensors and mode switching functionality
KR101655810B1 (ko) 2014-04-22 2016-09-22 엘지전자 주식회사 차량용 디스플레이 장치
KR102279790B1 (ko) 2015-03-10 2021-07-19 엘지전자 주식회사 차량용 디스플레이 장치
US9945948B2 (en) * 2015-06-18 2018-04-17 Nokia Technologies Oy Method and apparatus for providing time-of-flight calculations using distributed light sources
EP3429181A4 (en) * 2016-03-12 2019-09-18 Ningbo Sunny Opotech Co., Ltd. NETWORK CAMERA MODULE, MOLDED PHOTOSENSITIVE ASSEMBLY, METHOD FOR MANUFACTURING SAME, AND ELECTRONIC DEVICE
KR102511622B1 (ko) * 2016-06-09 2023-03-17 엘지전자 주식회사 냉장고
US11357112B2 (en) 2016-07-07 2022-06-07 Molex, Llc Molded interconnect device
JP2019002794A (ja) * 2017-06-15 2019-01-10 日本精工株式会社 近接覚センサの制御方法
CN107884066A (zh) * 2017-09-29 2018-04-06 深圳奥比中光科技有限公司 基于泛光功能的光传感器及其3d成像装置
KR102523975B1 (ko) 2017-10-11 2023-04-20 삼성전자주식회사 광원 일체형 광 센싱 시스템 및 이를 포함하는 전자 기기
CN108132138A (zh) * 2017-11-23 2018-06-08 矽力杰半导体技术(杭州)有限公司 光学检测组件
JP2019174125A (ja) * 2018-03-26 2019-10-10 パイオニア株式会社 測距装置
JP2019174126A (ja) * 2018-03-26 2019-10-10 パイオニア株式会社 測距装置
TWI685670B (zh) * 2018-05-07 2020-02-21 新加坡商光寶科技新加坡私人有限公司 具有雙發射器的近接感應模組
JP7300850B2 (ja) * 2019-03-07 2023-06-30 アズビル株式会社 検出装置及びクランプ装置
EP4198554A1 (en) * 2021-12-15 2023-06-21 STMicroelectronics (Research & Development) Limited Assembly comprising a display screen and a proximity sensor

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Publication number Priority date Publication date Assignee Title
JP2000075046A (ja) * 1998-08-31 2000-03-14 Rohm Co Ltd 反射型センサおよび回転動作検出器
JP2001188087A (ja) * 1999-12-28 2001-07-10 Bandai Co Ltd センサー手段と、これを利用した認識装置
JP2002131051A (ja) * 2000-10-26 2002-05-09 Stanley Electric Co Ltd 距離検出装置
JP2008059200A (ja) * 2006-08-30 2008-03-13 Matsushita Electric Works Ltd 指紋像入力装置
US20090266582A1 (en) * 2006-01-13 2009-10-29 Daisuke Sakurai Three-dimensional circuit board and its manufacturing method
TW201111740A (en) * 2009-04-29 2011-04-01 Intersil Inc Long range proximity and/or motion detector with ambient light detection capabilities
US20120294938A1 (en) * 2006-07-10 2012-11-22 Dr. R. Pflefger Chemische Fabrik GmbH Pharmaceutical preparation for oral administration with controlled active ingredient release in the small intestine and method for its production

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JPS633474A (ja) 1986-06-23 1988-01-08 Toshiba Corp 反射型光結合素子
JPH01171053A (ja) 1987-12-25 1989-07-06 Fujitsu Ltd 端末装置制御方式
JP3265449B2 (ja) * 1996-01-25 2002-03-11 シャープ株式会社 測距センサ
JP3240941B2 (ja) * 1996-11-18 2001-12-25 松下電器産業株式会社 手振り検出方法及び装置
JP4769859B2 (ja) 2006-02-28 2011-09-07 富士通株式会社 反射光検出装置、並びに、反射特性判断装置、及び、物体検出装置
JP5294757B2 (ja) 2007-09-28 2013-09-18 京セラ株式会社 受発光一体型素子アレイを用いたセンサ装置
US8217482B2 (en) * 2007-12-21 2012-07-10 Avago Technologies General Ip (Singapore) Pte. Ltd. Infrared proximity sensor package with reduced crosstalk
US8304733B2 (en) * 2009-05-22 2012-11-06 Motorola Mobility Llc Sensing assembly for mobile device
KR101091515B1 (ko) * 2009-09-14 2011-12-08 대성전기공업 주식회사 차량의 원격 터치 패드 장치 및 그 제어 방법

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000075046A (ja) * 1998-08-31 2000-03-14 Rohm Co Ltd 反射型センサおよび回転動作検出器
JP2001188087A (ja) * 1999-12-28 2001-07-10 Bandai Co Ltd センサー手段と、これを利用した認識装置
JP2002131051A (ja) * 2000-10-26 2002-05-09 Stanley Electric Co Ltd 距離検出装置
US20090266582A1 (en) * 2006-01-13 2009-10-29 Daisuke Sakurai Three-dimensional circuit board and its manufacturing method
US20120294938A1 (en) * 2006-07-10 2012-11-22 Dr. R. Pflefger Chemische Fabrik GmbH Pharmaceutical preparation for oral administration with controlled active ingredient release in the small intestine and method for its production
JP2008059200A (ja) * 2006-08-30 2008-03-13 Matsushita Electric Works Ltd 指紋像入力装置
TW201111740A (en) * 2009-04-29 2011-04-01 Intersil Inc Long range proximity and/or motion detector with ambient light detection capabilities

Also Published As

Publication number Publication date
US9223054B2 (en) 2015-12-29
TW201337307A (zh) 2013-09-16
WO2013105510A1 (ja) 2013-07-18
KR20140105566A (ko) 2014-09-01
CN104054008B (zh) 2016-11-23
EP2804022A4 (en) 2015-07-15
EP2804022A1 (en) 2014-11-19
CN104054008A (zh) 2014-09-17
US20150001414A1 (en) 2015-01-01
JP2013145174A (ja) 2013-07-25

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