TWI562253B - Bonding device and bonding method - Google Patents

Bonding device and bonding method

Info

Publication number
TWI562253B
TWI562253B TW104107673A TW104107673A TWI562253B TW I562253 B TWI562253 B TW I562253B TW 104107673 A TW104107673 A TW 104107673A TW 104107673 A TW104107673 A TW 104107673A TW I562253 B TWI562253 B TW I562253B
Authority
TW
Taiwan
Prior art keywords
bonding
bonding method
bonding device
Prior art date
Application number
TW104107673A
Other languages
English (en)
Other versions
TW201601228A (zh
Inventor
Mitsuteru Sakamoto
Masayoshi Kubo
Original Assignee
Shinkawa Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2014052569A external-priority patent/JP6118967B2/ja
Priority claimed from JP2015007602A external-priority patent/JP5849163B1/ja
Application filed by Shinkawa Kk filed Critical Shinkawa Kk
Publication of TW201601228A publication Critical patent/TW201601228A/zh
Application granted granted Critical
Publication of TWI562253B publication Critical patent/TWI562253B/zh

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    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/788—Means for moving parts
    • H01L2224/78821—Upper part of the bonding apparatus, i.e. bonding head, e.g. capillary or wedge
    • H01L2224/78824—Translational mechanism
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    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/81053—Bonding environment
    • H01L2224/81054—Composition of the atmosphere
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    • H01L2224/81053—Bonding environment
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    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
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    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/83053—Bonding environment
    • H01L2224/83091—Under pressure
    • H01L2224/83093—Transient conditions, e.g. gas-flow
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    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85053—Bonding environment
    • H01L2224/85054—Composition of the atmosphere
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    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85053—Bonding environment
    • H01L2224/85054—Composition of the atmosphere
    • H01L2224/85075—Composition of the atmosphere being inert
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    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85053—Bonding environment
    • H01L2224/85091—Under pressure
    • H01L2224/85093—Transient conditions, e.g. gas-flow
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    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Die Bonding (AREA)
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JP2015007602A JP5849163B1 (ja) 2015-01-19 2015-01-19 ボンディング装置およびボンディング方法

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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH104118A (ja) * 1996-06-17 1998-01-06 Matsushita Electric Ind Co Ltd ワイヤボンディング装置
TWI278945B (en) * 2001-07-25 2007-04-11 Sanyo Electric Co Bonding apparatus and method of manufacturing semiconductor device

Family Cites Families (10)

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JPS4918619Y1 (zh) * 1970-10-20 1974-05-17
JPH0793335B2 (ja) * 1988-08-29 1995-10-09 松下電器産業株式会社 共晶ダイボンダーによる電子部品の実装方法
JPH0350789A (ja) * 1989-07-18 1991-03-05 Murata Mfg Co Ltd 電子部品装置の半田付け方法
JPH0793335A (ja) 1993-06-07 1995-04-07 Internatl Business Mach Corp <Ibm> テキストの言語機能を提供する方法
JP3392254B2 (ja) * 1995-02-14 2003-03-31 ローム株式会社 ワイヤボンダ
JP2003007759A (ja) * 2001-06-27 2003-01-10 Sanyo Electric Co Ltd 認識装置、ボンディング装置および回路装置の製造方法
JP4711549B2 (ja) * 2001-06-27 2011-06-29 三洋電機株式会社 半導体装置の製造方法
JP5016816B2 (ja) * 2005-12-27 2012-09-05 株式会社東芝 ボンディング装置及び半導体装置の製造方法
JP2010032387A (ja) * 2008-07-29 2010-02-12 Yamabun Denki:Kk 温度測定方法、温度測定装置、温度制御方法、温度制御装置、補正方法、及び補正装置
CN103489805A (zh) * 2012-06-12 2014-01-01 苏州美图半导体技术有限公司 晶圆键合系统

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH104118A (ja) * 1996-06-17 1998-01-06 Matsushita Electric Ind Co Ltd ワイヤボンディング装置
TWI278945B (en) * 2001-07-25 2007-04-11 Sanyo Electric Co Bonding apparatus and method of manufacturing semiconductor device

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KR20160132077A (ko) 2016-11-16
CN106463414B (zh) 2019-01-15

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