TWI561582B - - Google Patents

Info

Publication number
TWI561582B
TWI561582B TW102125550A TW102125550A TWI561582B TW I561582 B TWI561582 B TW I561582B TW 102125550 A TW102125550 A TW 102125550A TW 102125550 A TW102125550 A TW 102125550A TW I561582 B TWI561582 B TW I561582B
Authority
TW
Taiwan
Application number
TW102125550A
Other versions
TW201420679A (zh
Inventor
Tomoyuki Mizunashi
Tsutomu Kashiwagi
Kinya Kodama
Original Assignee
Shinetsu Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinetsu Chemical Co filed Critical Shinetsu Chemical Co
Publication of TW201420679A publication Critical patent/TW201420679A/zh
Application granted granted Critical
Publication of TWI561582B publication Critical patent/TWI561582B/zh

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/04—Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of organic materials, e.g. plastics
    • G02B1/041—Lenses
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/06—Preparatory processes
    • C08G77/08—Preparatory processes characterised by the catalysts used

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Silicon Polymers (AREA)
TW102125550A 2012-07-19 2013-07-17 硬化性聚矽氧樹脂組成物 TW201420679A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012160123A JP5819787B2 (ja) 2012-07-19 2012-07-19 硬化性シリコーン樹脂組成物

Publications (2)

Publication Number Publication Date
TW201420679A TW201420679A (zh) 2014-06-01
TWI561582B true TWI561582B (zh) 2016-12-11

Family

ID=49947090

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102125550A TW201420679A (zh) 2012-07-19 2013-07-17 硬化性聚矽氧樹脂組成物

Country Status (5)

Country Link
US (1) US8791213B2 (zh)
JP (1) JP5819787B2 (zh)
KR (1) KR101913869B1 (zh)
CN (1) CN103571208B (zh)
TW (1) TW201420679A (zh)

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* Cited by examiner, † Cited by third party
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JP6256780B2 (ja) * 2013-04-04 2018-01-10 エルジー・ケム・リミテッド 硬化性組成物
KR101772859B1 (ko) 2013-08-28 2017-08-30 다우 코닝 도레이 캄파니 리미티드 경화성 실리콘 조성물, 이의 경화물, 및 광반도체 장치
CN104130705B (zh) * 2014-06-29 2016-05-25 惠州市永卓科技有限公司 一种高残余粘着率的溶剂型纸张隔离剂及其制备方法
CN104130704B (zh) * 2014-06-29 2016-08-31 惠州市永卓科技有限公司 一种低剥离力的溶剂型纸张隔离剂及其制备方法
JP2016030823A (ja) * 2014-07-30 2016-03-07 富士フイルム株式会社 硬化性シリコーン組成物、易剥離性接着材、易剥離性接着材層付支持体及び剥離方法
JP6678388B2 (ja) * 2014-12-25 2020-04-08 信越化学工業株式会社 硬化性シリコーン樹脂組成物
JP6348446B2 (ja) * 2015-04-15 2018-06-27 信越化学工業株式会社 分岐状オルガノポリシロキサン及びその製造方法
JP6313722B2 (ja) * 2015-04-15 2018-04-18 信越化学工業株式会社 付加硬化型シリコーン組成物および半導体装置
EP3184589B1 (en) 2015-12-22 2019-05-01 Shin-Etsu Chemical Co., Ltd. Addition-curable silicone resin composition and a semiconductor device
JP6657037B2 (ja) * 2015-12-22 2020-03-04 信越化学工業株式会社 付加硬化性シリコーン樹脂組成物および半導体装置
JP6447557B2 (ja) * 2016-03-24 2019-01-09 日亜化学工業株式会社 発光装置の製造方法
EP3533837B1 (en) * 2016-10-31 2024-05-15 Dow Toray Co., Ltd. One-pack curable type thermally conductive silicone grease composition and electronic/electrical component
JP6751370B2 (ja) * 2017-05-10 2020-09-02 信越化学工業株式会社 硬化性シリコーン樹脂組成物、光半導体素子封止材料及び光半導体装置
CN107189447B (zh) * 2017-07-12 2020-05-19 广州惠利电子材料有限公司 耐湿热的led封装硅胶及其制备方法和应用
WO2019021826A1 (ja) * 2017-07-24 2019-01-31 東レ・ダウコーニング株式会社 多成分硬化型熱伝導性シリコーンゲル組成物、熱伝導性部材および放熱構造体
TWI791554B (zh) * 2017-07-31 2023-02-11 美商陶氏有機矽公司 可固化有機聚矽氧烷組成物及光學半導體裝置
JP7457450B2 (ja) * 2017-10-20 2024-03-28 信越化学工業株式会社 シリコーン組成物、シリコーンゴム硬化物、及び電力ケーブル
TWI787444B (zh) 2018-02-07 2022-12-21 日商陶氏東麗股份有限公司 可固化聚矽氧組成物、其固化產物、及光學半導體裝置
CN108795055A (zh) * 2018-05-15 2018-11-13 苏州市贝特利高分子材料股份有限公司 一种可固化的有机硅组合物
JP7170450B2 (ja) * 2018-07-31 2022-11-14 信越化学工業株式会社 付加硬化型シリコーン樹脂組成物及び半導体装置
CN112513218B (zh) * 2018-08-01 2023-02-03 信越化学工业株式会社 有机硅压敏粘合剂组合物和使用其的压敏粘合带或压敏粘合膜
JP6657340B2 (ja) * 2018-08-21 2020-03-04 信越化学工業株式会社 硬化性シリコーン樹脂組成物
JP2023535412A (ja) * 2020-07-22 2023-08-17 ワッカー ケミー アクチエンゲゼルシャフト アルキルシリケート
JP7456964B2 (ja) * 2021-03-26 2024-03-27 信越化学工業株式会社 複合フィルム

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101529277A (zh) * 2006-08-28 2009-09-09 道康宁公司 光学器件和有机硅组合物以及制造光学器件的方法
TW201005040A (en) * 2008-03-27 2010-02-01 Shinetsu Chemical Co Curable silicone rubber composition and photosemiconductor device using the same as sealing material

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DE19531568A1 (de) * 1995-08-28 1997-03-06 Bayer Ag Flüssige Organopolysiloxan-Harze, ein Verfahren zu deren Herstellung, niedrigviskose Polydiorganosiloxan-Zusammensetzungen, enthaltend flüssige Organopolysiloxan-Harze und deren Verwendung
US6124407A (en) 1998-10-28 2000-09-26 Dow Corning Corporation Silicone composition, method for the preparation thereof, and silicone elastomer
TWI373150B (en) * 2003-07-09 2012-09-21 Shinetsu Chemical Co Silicone rubber composition, light-emitting semiconductor embedding/protecting material and light-emitting semiconductor device
JP4180474B2 (ja) 2003-09-03 2008-11-12 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 付加硬化型シリコーン組成物
JP4841846B2 (ja) 2005-02-02 2011-12-21 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 硬化性オルガノポリシロキサン組成物及び半導体装置
JP4965111B2 (ja) 2005-11-09 2012-07-04 東レ・ダウコーニング株式会社 硬化性シリコーン組成物
JP5202822B2 (ja) * 2006-06-23 2013-06-05 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物および半導体装置
JP5148088B2 (ja) * 2006-08-25 2013-02-20 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物および半導体装置
JP5014774B2 (ja) 2006-12-26 2012-08-29 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 付加反応硬化型シリコーン組成物および半導体装置
CN102197092A (zh) * 2008-10-31 2011-09-21 道康宁东丽株式会社 可固化的有机基聚硅氧烷组合物，光学半导体元件密封剂和光学半导体器件
CN101717584B (zh) * 2009-11-20 2012-01-25 陈俊光 大功率led的有机硅凝胶封装料及其制备方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101529277A (zh) * 2006-08-28 2009-09-09 道康宁公司 光学器件和有机硅组合物以及制造光学器件的方法
TW201005040A (en) * 2008-03-27 2010-02-01 Shinetsu Chemical Co Curable silicone rubber composition and photosemiconductor device using the same as sealing material

Also Published As

Publication number Publication date
KR20140011960A (ko) 2014-01-29
JP5819787B2 (ja) 2015-11-24
TW201420679A (zh) 2014-06-01
US8791213B2 (en) 2014-07-29
US20140024796A1 (en) 2014-01-23
CN103571208B (zh) 2017-08-11
KR101913869B1 (ko) 2018-10-31
CN103571208A (zh) 2014-02-12
JP2014019798A (ja) 2014-02-03

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