TWI561574B - - Google Patents

Info

Publication number
TWI561574B
TWI561574B TW104102031A TW104102031A TWI561574B TW I561574 B TWI561574 B TW I561574B TW 104102031 A TW104102031 A TW 104102031A TW 104102031 A TW104102031 A TW 104102031A TW I561574 B TWI561574 B TW I561574B
Authority
TW
Taiwan
Application number
TW104102031A
Other languages
Chinese (zh)
Other versions
TW201533144A (zh
Inventor
Tomoya Egawa
Original Assignee
Daicel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Daicel Corp filed Critical Daicel Corp
Publication of TW201533144A publication Critical patent/TW201533144A/zh
Application granted granted Critical
Publication of TWI561574B publication Critical patent/TWI561574B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • Electroluminescent Light Sources (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Sealing Material Composition (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Polymerisation Methods In General (AREA)
TW104102031A 2014-01-23 2015-01-22 密封用組成物 TW201533144A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014010770 2014-01-23

Publications (2)

Publication Number Publication Date
TW201533144A TW201533144A (zh) 2015-09-01
TWI561574B true TWI561574B (enrdf_load_stackoverflow) 2016-12-11

Family

ID=53681329

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104102031A TW201533144A (zh) 2014-01-23 2015-01-22 密封用組成物

Country Status (5)

Country Link
JP (1) JP5914778B2 (enrdf_load_stackoverflow)
KR (1) KR101641480B1 (enrdf_load_stackoverflow)
CN (1) CN105557068B (enrdf_load_stackoverflow)
TW (1) TW201533144A (enrdf_load_stackoverflow)
WO (1) WO2015111525A1 (enrdf_load_stackoverflow)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105246940B (zh) * 2013-05-28 2018-09-04 株式会社大赛璐 光半导体密封用固化性组合物
CN105940767B (zh) * 2014-05-20 2018-02-09 积水化学工业株式会社 有机电致发光显示元件用密封剂
KR102624114B1 (ko) * 2015-11-30 2024-01-12 주식회사 다이셀 밀봉용 조성물
JP6022725B1 (ja) 2016-03-31 2016-11-09 Ｌｕｍｉｏｔｅｃ株式会社 有機ｅｌパネル及びその製造方法
KR101922296B1 (ko) * 2016-06-23 2018-11-26 삼성에스디아이 주식회사 고체상 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 포함하는 봉지재 및 반도체 패키지
KR102272537B1 (ko) 2016-09-07 2021-07-02 린텍 가부시키가이샤 접착제 조성물, 봉지 시트, 및 봉지체
JP6329330B1 (ja) 2016-09-07 2018-05-23 リンテック株式会社 封止シート、及び封止体
CN109715749B (zh) 2016-09-30 2021-04-20 株式会社Lg化学 粘合剂组合物
TWI702241B (zh) * 2016-12-09 2020-08-21 南韓商Ｌｇ化學股份有限公司 封裝組成物
JP6719674B2 (ja) 2016-12-09 2020-07-08 エルジー・ケム・リミテッド シール材組成物
CN109661429B (zh) 2016-12-09 2021-07-13 株式会社Lg化学 封装组合物
CN110050009B (zh) 2016-12-09 2022-05-03 株式会社Lg化学 封装组合物
KR102468900B1 (ko) 2017-05-31 2022-11-18 린텍 가부시키가이샤 시트상 접착제, 가스 배리어성 적층체, 및 봉지체
JP6665136B2 (ja) * 2017-07-28 2020-03-13 株式会社ダイセル モノマー混合物、及びそれを含む硬化性組成物
JP6538774B2 (ja) * 2017-07-28 2019-07-03 株式会社ダイセル モノマー混合物、及びそれを含む硬化性組成物
EP3678203B1 (en) * 2017-09-01 2025-06-18 LG Chem, Ltd. Method for preparing organic electronic device
US11976201B2 (en) 2018-01-31 2024-05-07 Zeon Corporation Resin film and organic electroluminescent device
CN111615536A (zh) * 2018-01-31 2020-09-01 日本瑞翁株式会社 树脂组合物、树脂膜及有机电致发光装置
JP6547110B1 (ja) * 2018-05-08 2019-07-24 ナトコ株式会社 活性エネルギー線硬化性インク組成物
WO2020196669A1 (ja) * 2019-03-27 2020-10-01 デンカ株式会社 組成物
WO2020218065A1 (ja) * 2019-04-23 2020-10-29 デンカ株式会社 組成物
WO2021010226A1 (ja) * 2019-07-17 2021-01-21 積水化学工業株式会社 有機ｅｌ表示素子用封止剤
JP7671842B2 (ja) * 2021-03-31 2025-05-02 デンカ株式会社 組成物、硬化体及び有機ｅｌ表示装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW500791B (en) * 1999-08-12 2002-09-01 Mitsui Chemicals Inc Photo-curable resin composition for sealing material and sealing method
US20090026934A1 (en) * 2006-01-24 2009-01-29 Jun Fujita Adhesive encapsulating composition film and organic electroluminescence device
CN102822731A (zh) * 2010-12-13 2012-12-12 Dic株式会社 阳离子固化型液晶密封剂以及液晶显示元件
JP2013170223A (ja) * 2012-02-21 2013-09-02 Sekisui Chem Co Ltd 蒸着用硬化性樹脂組成物、樹脂保護膜、及び、有機光デバイス

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4384509B2 (ja) 2003-01-09 2009-12-16 積水化学工業株式会社 有機エレクトロルミネッセンス素子の封止方法及び有機エレクトロルミネッセンス素子
JP5457078B2 (ja) * 2009-06-05 2014-04-02 株式会社ダイセル カチオン重合性樹脂組成物、及びその硬化物
JP5651421B2 (ja) * 2010-10-07 2015-01-14 三井化学株式会社 封止用組成物及びそれを用いた封止用シート
JP2013157204A (ja) * 2012-01-30 2013-08-15 Sekisui Chem Co Ltd 有機エレクトロルミネッセンス表示素子用封止剤

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW500791B (en) * 1999-08-12 2002-09-01 Mitsui Chemicals Inc Photo-curable resin composition for sealing material and sealing method
US20090026934A1 (en) * 2006-01-24 2009-01-29 Jun Fujita Adhesive encapsulating composition film and organic electroluminescence device
CN102822731A (zh) * 2010-12-13 2012-12-12 Dic株式会社 阳离子固化型液晶密封剂以及液晶显示元件
JP2013170223A (ja) * 2012-02-21 2013-09-02 Sekisui Chem Co Ltd 蒸着用硬化性樹脂組成物、樹脂保護膜、及び、有機光デバイス

Also Published As

Publication number Publication date
KR20160011228A (ko) 2016-01-29
JP5914778B2 (ja) 2016-05-11
CN105557068A (zh) 2016-05-04
KR101641480B1 (ko) 2016-07-20
WO2015111525A1 (ja) 2015-07-30
TW201533144A (zh) 2015-09-01
CN105557068B (zh) 2017-06-09
JPWO2015111525A1 (ja) 2017-03-23

Similar Documents

Publication Publication Date Title
TWI561574B (enrdf_load_stackoverflow)
BR112016018987A2 (enrdf_load_stackoverflow)
BR112016016341A2 (enrdf_load_stackoverflow)
BR112016015865A2 (enrdf_load_stackoverflow)
BR112016015385A2 (enrdf_load_stackoverflow)
BR112016016421A2 (enrdf_load_stackoverflow)
BR112016016751A2 (enrdf_load_stackoverflow)
BR112016015798A2 (enrdf_load_stackoverflow)
AP2016009666A0 (enrdf_load_stackoverflow)
BR112016019087A2 (enrdf_load_stackoverflow)
BR112016019527A2 (enrdf_load_stackoverflow)
BR112016019867A2 (enrdf_load_stackoverflow)
BR112016020019A2 (enrdf_load_stackoverflow)
BR112016016518A2 (enrdf_load_stackoverflow)
AP2017009684A0 (enrdf_load_stackoverflow)
BR112016015049A2 (enrdf_load_stackoverflow)
BR112016016461A2 (enrdf_load_stackoverflow)
BR112016019086A2 (enrdf_load_stackoverflow)
BR112016019841A2 (enrdf_load_stackoverflow)
BR112016019846A2 (enrdf_load_stackoverflow)
BR112016019085A2 (enrdf_load_stackoverflow)
BR112016015538A2 (enrdf_load_stackoverflow)
BR112016015965A2 (enrdf_load_stackoverflow)
BR112016016453A2 (enrdf_load_stackoverflow)
BR112016012887A2 (enrdf_load_stackoverflow)

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees