TWI560762B - - Google Patents

Info

Publication number
TWI560762B
TWI560762B TW102104619A TW102104619A TWI560762B TW I560762 B TWI560762 B TW I560762B TW 102104619 A TW102104619 A TW 102104619A TW 102104619 A TW102104619 A TW 102104619A TW I560762 B TWI560762 B TW I560762B
Authority
TW
Taiwan
Application number
TW102104619A
Other versions
TW201351494A (zh
Inventor
Kazuya Sato
Yuki Tanaka
Syuichi Kobayashi
Original Assignee
Shinetsu Handotai Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinetsu Handotai Kk filed Critical Shinetsu Handotai Kk
Publication of TW201351494A publication Critical patent/TW201351494A/zh
Application granted granted Critical
Publication of TWI560762B publication Critical patent/TWI560762B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002—Preparing wafers
    • H01L21/02005—Preparing bulk and homogeneous wafers
    • H01L21/02008—Multistep processes
    • H01L21/0201—Specific process step
    • H01L21/02024—Mirror polishing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
TW102104619A 2012-02-15 2013-02-06 晶圓的雙面研磨方法 TW201351494A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012030929 2012-02-15
JP2012059341A JP5741497B2 (ja) 2012-02-15 2012-03-15 ウェーハの両面研磨方法

Publications (2)

Publication Number Publication Date
TW201351494A TW201351494A (zh) 2013-12-16
TWI560762B true TWI560762B (zh) 2016-12-01

Family

ID=48983858

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102104619A TW201351494A (zh) 2012-02-15 2013-02-06 晶圓的雙面研磨方法

Country Status (8)

Country Link
US (1) US9266215B2 (zh)
JP (1) JP5741497B2 (zh)
KR (1) KR101846926B1 (zh)
CN (1) CN104114322B (zh)
DE (1) DE112013000613B4 (zh)
SG (1) SG11201403886VA (zh)
TW (1) TW201351494A (zh)
WO (1) WO2013121718A1 (zh)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5967040B2 (ja) * 2013-09-11 2016-08-10 信越半導体株式会社 鏡面研磨ウェーハの製造方法
CN104551961A (zh) * 2013-10-23 2015-04-29 有研新材料股份有限公司 一种12英寸硅片的双面抛光方法
DE102015220090B4 (de) * 2015-01-14 2021-02-18 Siltronic Ag Verfahren zum Abrichten von Poliertüchern
JP6444785B2 (ja) * 2015-03-19 2018-12-26 株式会社荏原製作所 研磨装置およびその制御方法ならびにドレッシング条件出力方法
JP6330735B2 (ja) * 2015-06-11 2018-05-30 信越半導体株式会社 ウェーハの両面研磨方法
KR101759875B1 (ko) * 2015-06-24 2017-07-20 주식회사 엘지실트론 웨이퍼 연마장치의 스캔장치 및 스캔시스템
JP6707831B2 (ja) * 2015-10-09 2020-06-10 株式会社Sumco 研削装置および研削方法
DE102015220924B4 (de) * 2015-10-27 2018-09-27 Siltronic Ag Suszeptor zum Halten einer Halbleiterscheibe mit Orientierungskerbe, Verfahren zum Abscheiden einer Schicht auf einer Halbleiterscheibe und Halbleiterscheibe
CN105538131A (zh) * 2015-12-02 2016-05-04 珠海东精大电子科技有限公司 蓝宝石窗口片加工工艺
JP6949504B2 (ja) 2017-02-20 2021-10-13 三菱鉛筆株式会社 塗布具用ペン芯
JP6451825B1 (ja) * 2017-12-25 2019-01-16 株式会社Sumco ウェーハの両面研磨方法
US20240253173A1 (en) * 2023-01-26 2024-08-01 Globalwafers Co., Ltd. Methods of processing semiconductor wafers using double side grinding operations

Citations (3)

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Publication number Priority date Publication date Assignee Title
JP2002333528A (ja) * 2001-05-08 2002-11-22 Sumitomo Electric Ind Ltd 光コネクタの端面研磨方法および光コネクタ
WO2010140595A1 (ja) * 2009-06-04 2010-12-09 旭硝子株式会社 板状体の研磨方法
JP2011067901A (ja) * 2009-09-25 2011-04-07 Hoya Corp 磁気ディスク用ガラス基板の製造方法

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JPH03251363A (ja) * 1990-03-01 1991-11-08 Tdk Corp ラップ加工方法および両面ラップ盤
JPH07201789A (ja) * 1993-12-28 1995-08-04 Hitachi Cable Ltd 化合物半導体ウェハの両面ラッピング方法
JP2001030164A (ja) * 1999-07-19 2001-02-06 Tsugami Corp 複数回転軸ラップ盤用回転制御方法及び複数回転軸ラップ盤用回転制御装置
TW431434U (en) * 1999-10-22 2001-04-21 Ind Tech Res Inst Carrier for carrying non-circular workpiece
DE10060697B4 (de) * 2000-12-07 2005-10-06 Siltronic Ag Doppelseiten-Polierverfahren mit reduzierter Kratzerrate und Vorrichtung zur Durchführung des Verfahrens
US6398631B1 (en) * 2001-02-02 2002-06-04 Memc Electronic Materials, Inc. Method and apparatus to place wafers into and out of machine
DE10132504C1 (de) * 2001-07-05 2002-10-10 Wacker Siltronic Halbleitermat Verfahren zur beidseitigen Material abtragenden Bearbeitung von Halbleiterscheiben und seine Verwendung
US7008310B2 (en) * 2001-08-01 2006-03-07 Entegris, Inc. Wafer carrier wear indicator
JP3963352B2 (ja) * 2002-04-09 2007-08-22 東芝セラミックス株式会社 研磨装置
JP2004098264A (ja) * 2002-09-12 2004-04-02 Shin Etsu Handotai Co Ltd 研磨布のドレッシング方法及びワークの研磨方法
JP2004141984A (ja) * 2002-10-22 2004-05-20 Hoya Corp マスクブランクス用基板の製造方法
US20050181708A1 (en) 2004-02-17 2005-08-18 Infineon Technologies Richmond, Lp. Removal of embedded particles during chemical mechanical polishing
DE112007002066B4 (de) 2006-09-06 2019-10-17 Nitta Haas Inc. Polierkissen
JP4367494B2 (ja) 2007-02-09 2009-11-18 住友電気工業株式会社 ＧａＡｓウエハの化学機械研磨方法
JP5151800B2 (ja) 2008-08-20 2013-02-27 信越半導体株式会社 両面研磨装置用キャリア及びこれを用いた両面研磨装置並びに両面研磨方法
JP2010152965A (ja) * 2008-12-25 2010-07-08 Toray Ind Inc 研磨布
JP5233888B2 (ja) 2009-07-21 2013-07-10 信越半導体株式会社 両面研磨装置用キャリアの製造方法、両面研磨装置用キャリア及びウェーハの両面研磨方法
KR101209271B1 (ko) * 2009-08-21 2012-12-06 주식회사 엘지실트론 양면 연마 장치와 양면 연마 장치용 캐리어

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002333528A (ja) * 2001-05-08 2002-11-22 Sumitomo Electric Ind Ltd 光コネクタの端面研磨方法および光コネクタ
WO2010140595A1 (ja) * 2009-06-04 2010-12-09 旭硝子株式会社 板状体の研磨方法
JP2011067901A (ja) * 2009-09-25 2011-04-07 Hoya Corp 磁気ディスク用ガラス基板の製造方法

Also Published As

Publication number Publication date
SG11201403886VA (en) 2014-11-27
WO2013121718A1 (ja) 2013-08-22
KR20140129001A (ko) 2014-11-06
KR101846926B1 (ko) 2018-04-10
DE112013000613B4 (de) 2024-01-11
DE112013000613T5 (de) 2015-04-16
US20150147942A1 (en) 2015-05-28
CN104114322B (zh) 2017-04-19
CN104114322A (zh) 2014-10-22
TW201351494A (zh) 2013-12-16
JP5741497B2 (ja) 2015-07-01
JP2013188860A (ja) 2013-09-26
US9266215B2 (en) 2016-02-23

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