TWI560027B - Method and apparatus of symmetrically chamfering substrate - Google Patents
Method and apparatus of symmetrically chamfering substrateInfo
- Publication number
- TWI560027B TWI560027B TW103118707A TW103118707A TWI560027B TW I560027 B TWI560027 B TW I560027B TW 103118707 A TW103118707 A TW 103118707A TW 103118707 A TW103118707 A TW 103118707A TW I560027 B TWI560027 B TW I560027B
- Authority
- TW
- Taiwan
- Prior art keywords
- symmetrically
- substrate
- chamfering substrate
- symmetrically chamfering
- chamfering
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
- B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
- B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
- B24B9/08—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
- B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
- B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
- B24B9/08—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass
- B24B9/10—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass of plate glass
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
- Surface Treatment Of Glass (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020130060306A KR101452250B1 (ko) | 2013-05-28 | 2013-05-28 | 기판 대칭 면취 방법 및 장치 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201515773A TW201515773A (zh) | 2015-05-01 |
TWI560027B true TWI560027B (en) | 2016-12-01 |
Family
ID=51985634
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW103118707A TWI560027B (en) | 2013-05-28 | 2014-05-28 | Method and apparatus of symmetrically chamfering substrate |
Country Status (5)
Country | Link |
---|---|
US (2) | US20140357160A1 (ja) |
JP (2) | JP6451004B2 (ja) |
KR (1) | KR101452250B1 (ja) |
CN (1) | CN104209836B (ja) |
TW (1) | TWI560027B (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101452250B1 (ko) * | 2013-05-28 | 2014-10-22 | 코닝정밀소재 주식회사 | 기판 대칭 면취 방법 및 장치 |
KR101395055B1 (ko) * | 2013-05-28 | 2014-05-14 | 삼성코닝정밀소재 주식회사 | 면취 작업대 평탄도 측정 방법 |
US10543576B2 (en) * | 2015-07-08 | 2020-01-28 | Corning Incorporated | Glass substrate support apparatuses and methods of providing flexible glass substrate support |
CN113211235A (zh) * | 2021-05-10 | 2021-08-06 | 山西光兴光电科技有限公司 | 研磨设备以及研磨方法 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006026845A (ja) * | 2004-07-20 | 2006-02-02 | Nakamura Tome Precision Ind Co Ltd | 面取機の工具位置の調整方法 |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08243891A (ja) * | 1995-03-07 | 1996-09-24 | Kao Corp | 基板のチャンファ加工装置 |
JPH10289413A (ja) * | 1997-04-10 | 1998-10-27 | Fujitsu Ltd | 磁気ヘッドの製造方法 |
JP3625685B2 (ja) * | 1999-04-15 | 2005-03-02 | 富士通株式会社 | ラッピング装置及びラッピング方法 |
JP2001246539A (ja) * | 2000-03-03 | 2001-09-11 | Inst Of Physical & Chemical Res | 非軸対称非球面ミラーの研削加工方法 |
JP4441823B2 (ja) * | 2003-11-26 | 2010-03-31 | 株式会社東京精密 | 面取り砥石のツルーイング方法及び面取り装置 |
KR101203505B1 (ko) * | 2005-04-19 | 2012-11-21 | 가부시키가이샤 에바라 세이사꾸쇼 | 기판 처리 장치 및 기판 처리 방법 |
JP4742845B2 (ja) * | 2005-12-15 | 2011-08-10 | 信越半導体株式会社 | 半導体ウエーハの面取り部の加工方法及び砥石の溝形状の修正方法 |
JP4915146B2 (ja) * | 2006-06-08 | 2012-04-11 | 信越半導体株式会社 | ウェーハの製造方法 |
WO2008093584A1 (ja) * | 2007-01-31 | 2008-08-07 | Hoya Corporation | 磁気ディスク用ガラス基板の製造方法および磁気ディスク用ガラス基板の製造システム |
WO2008093488A1 (ja) * | 2007-01-31 | 2008-08-07 | Shin-Etsu Handotai Co., Ltd. | シリコンウエーハの面取り装置およびシリコンウエーハの製造方法ならびにエッチドシリコンウエーハ |
JP5301818B2 (ja) * | 2007-11-26 | 2013-09-25 | 中村留精密工業株式会社 | ガラス基板の側辺加工装置における補正値の登録方法 |
JP2009283650A (ja) * | 2008-05-22 | 2009-12-03 | Sumco Corp | 半導体ウェーハの再生方法 |
JP5352331B2 (ja) * | 2009-04-15 | 2013-11-27 | ダイトエレクトロン株式会社 | ウェーハの面取り加工方法 |
JP5439066B2 (ja) * | 2009-07-06 | 2014-03-12 | 中村留精密工業株式会社 | 硬質脆性板の面取加工方法及び装置 |
CN102947238B (zh) * | 2010-06-21 | 2016-01-20 | 旭硝子株式会社 | 玻璃基板及玻璃基板的制造方法 |
WO2012005019A1 (ja) * | 2010-07-08 | 2012-01-12 | 旭硝子株式会社 | ガラス基板端面の評価方法及びガラス基板端面の加工方法並びにガラス基板 |
US8986072B2 (en) * | 2011-05-26 | 2015-03-24 | Corning Incorporated | Methods of finishing an edge of a glass sheet |
CN202212831U (zh) * | 2011-08-18 | 2012-05-09 | 北京京东方光电科技有限公司 | 磨边装置 |
JP6050086B2 (ja) * | 2012-10-30 | 2016-12-21 | AvanStrate株式会社 | ガラス基板の製造方法 |
CN103111922B (zh) * | 2013-01-31 | 2015-04-01 | 广东富山玻璃机械有限公司 | 一种多功能快速四边磨边机 |
KR101452250B1 (ko) * | 2013-05-28 | 2014-10-22 | 코닝정밀소재 주식회사 | 기판 대칭 면취 방법 및 장치 |
JP6007889B2 (ja) * | 2013-12-03 | 2016-10-19 | 信越半導体株式会社 | 面取り加工装置及びノッチレスウェーハの製造方法 |
-
2013
- 2013-05-28 KR KR1020130060306A patent/KR101452250B1/ko active IP Right Grant
-
2014
- 2014-05-27 JP JP2014109285A patent/JP6451004B2/ja active Active
- 2014-05-27 US US14/287,799 patent/US20140357160A1/en not_active Abandoned
- 2014-05-28 CN CN201410230538.1A patent/CN104209836B/zh active Active
- 2014-05-28 TW TW103118707A patent/TWI560027B/zh active
-
2018
- 2018-01-05 JP JP2018000615A patent/JP2018100216A/ja active Pending
- 2018-06-29 US US16/023,291 patent/US20180304430A1/en not_active Abandoned
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006026845A (ja) * | 2004-07-20 | 2006-02-02 | Nakamura Tome Precision Ind Co Ltd | 面取機の工具位置の調整方法 |
Also Published As
Publication number | Publication date |
---|---|
JP2018100216A (ja) | 2018-06-28 |
TW201515773A (zh) | 2015-05-01 |
JP2014231471A (ja) | 2014-12-11 |
US20140357160A1 (en) | 2014-12-04 |
KR101452250B1 (ko) | 2014-10-22 |
US20180304430A1 (en) | 2018-10-25 |
JP6451004B2 (ja) | 2019-01-16 |
CN104209836B (zh) | 2017-01-11 |
CN104209836A (zh) | 2014-12-17 |
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