TWI560027B - Method and apparatus of symmetrically chamfering substrate - Google Patents

Method and apparatus of symmetrically chamfering substrate

Info

Publication number
TWI560027B
TWI560027B TW103118707A TW103118707A TWI560027B TW I560027 B TWI560027 B TW I560027B TW 103118707 A TW103118707 A TW 103118707A TW 103118707 A TW103118707 A TW 103118707A TW I560027 B TWI560027 B TW I560027B
Authority
TW
Taiwan
Prior art keywords
symmetrically
substrate
chamfering substrate
symmetrically chamfering
chamfering
Prior art date
Application number
TW103118707A
Other languages
English (en)
Chinese (zh)
Other versions
TW201515773A (zh
Inventor
Myeongbo Han
Original Assignee
Corning Prec Materials Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Corning Prec Materials Co Ltd filed Critical Corning Prec Materials Co Ltd
Publication of TW201515773A publication Critical patent/TW201515773A/zh
Application granted granted Critical
Publication of TWI560027B publication Critical patent/TWI560027B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/08—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/08—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass
    • B24B9/10—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass of plate glass

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Surface Treatment Of Glass (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
TW103118707A 2013-05-28 2014-05-28 Method and apparatus of symmetrically chamfering substrate TWI560027B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020130060306A KR101452250B1 (ko) 2013-05-28 2013-05-28 기판 대칭 면취 방법 및 장치

Publications (2)

Publication Number Publication Date
TW201515773A TW201515773A (zh) 2015-05-01
TWI560027B true TWI560027B (en) 2016-12-01

Family

ID=51985634

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103118707A TWI560027B (en) 2013-05-28 2014-05-28 Method and apparatus of symmetrically chamfering substrate

Country Status (5)

Country Link
US (2) US20140357160A1 (ja)
JP (2) JP6451004B2 (ja)
KR (1) KR101452250B1 (ja)
CN (1) CN104209836B (ja)
TW (1) TWI560027B (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101452250B1 (ko) * 2013-05-28 2014-10-22 코닝정밀소재 주식회사 기판 대칭 면취 방법 및 장치
KR101395055B1 (ko) * 2013-05-28 2014-05-14 삼성코닝정밀소재 주식회사 면취 작업대 평탄도 측정 방법
CN107848863B (zh) * 2015-07-08 2021-02-26 康宁股份有限公司 玻璃基材支承设备及提供挠性玻璃基材支承的方法
CN113211235A (zh) * 2021-05-10 2021-08-06 山西光兴光电科技有限公司 研磨设备以及研磨方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006026845A (ja) * 2004-07-20 2006-02-02 Nakamura Tome Precision Ind Co Ltd 面取機の工具位置の調整方法

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JPH08243891A (ja) * 1995-03-07 1996-09-24 Kao Corp 基板のチャンファ加工装置
JPH10289413A (ja) * 1997-04-10 1998-10-27 Fujitsu Ltd 磁気ヘッドの製造方法
JP3625685B2 (ja) * 1999-04-15 2005-03-02 富士通株式会社 ラッピング装置及びラッピング方法
JP2001246539A (ja) * 2000-03-03 2001-09-11 Inst Of Physical & Chemical Res 非軸対称非球面ミラーの研削加工方法
JP4441823B2 (ja) * 2003-11-26 2010-03-31 株式会社東京精密 面取り砥石のツルーイング方法及び面取り装置
JP4916890B2 (ja) * 2005-04-19 2012-04-18 株式会社荏原製作所 基板処理装置及び基板処理方法
JP4742845B2 (ja) * 2005-12-15 2011-08-10 信越半導体株式会社 半導体ウエーハの面取り部の加工方法及び砥石の溝形状の修正方法
JP4915146B2 (ja) * 2006-06-08 2012-04-11 信越半導体株式会社 ウェーハの製造方法
WO2008093488A1 (ja) * 2007-01-31 2008-08-07 Shin-Etsu Handotai Co., Ltd. シリコンウエーハの面取り装置およびシリコンウエーハの製造方法ならびにエッチドシリコンウエーハ
US8640497B2 (en) * 2007-01-31 2014-02-04 Hoya Corporation Method of manufacturing glass substrate for magnetic disk and system for manufacturing glass substrate for magnetic disk
JP5301818B2 (ja) * 2007-11-26 2013-09-25 中村留精密工業株式会社 ガラス基板の側辺加工装置における補正値の登録方法
JP2009283650A (ja) * 2008-05-22 2009-12-03 Sumco Corp 半導体ウェーハの再生方法
JP5352331B2 (ja) * 2009-04-15 2013-11-27 ダイトエレクトロン株式会社 ウェーハの面取り加工方法
JP5439066B2 (ja) * 2009-07-06 2014-03-12 中村留精密工業株式会社 硬質脆性板の面取加工方法及び装置
JP5817722B2 (ja) * 2010-06-21 2015-11-18 旭硝子株式会社 ガラス基板及びガラス基板の製造方法
KR101811903B1 (ko) * 2010-07-08 2017-12-22 아사히 가라스 가부시키가이샤 유리 기판 단부면의 평가 방법 및 유리 기판 단부면의 가공 방법 및 유리 기판
US8986072B2 (en) * 2011-05-26 2015-03-24 Corning Incorporated Methods of finishing an edge of a glass sheet
CN202212831U (zh) * 2011-08-18 2012-05-09 北京京东方光电科技有限公司 磨边装置
JP6050086B2 (ja) * 2012-10-30 2016-12-21 ＡｖａｎＳｔｒａｔｅ株式会社 ガラス基板の製造方法
CN103111922B (zh) * 2013-01-31 2015-04-01 广东富山玻璃机械有限公司 一种多功能快速四边磨边机
KR101452250B1 (ko) * 2013-05-28 2014-10-22 코닝정밀소재 주식회사 기판 대칭 면취 방법 및 장치
JP6007889B2 (ja) * 2013-12-03 2016-10-19 信越半導体株式会社 面取り加工装置及びノッチレスウェーハの製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006026845A (ja) * 2004-07-20 2006-02-02 Nakamura Tome Precision Ind Co Ltd 面取機の工具位置の調整方法

Also Published As

Publication number Publication date
CN104209836B (zh) 2017-01-11
JP6451004B2 (ja) 2019-01-16
US20180304430A1 (en) 2018-10-25
US20140357160A1 (en) 2014-12-04
CN104209836A (zh) 2014-12-17
JP2014231471A (ja) 2014-12-11
JP2018100216A (ja) 2018-06-28
TW201515773A (zh) 2015-05-01
KR101452250B1 (ko) 2014-10-22

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