TWI553881B - 薄膜電晶體基板 - Google Patents

薄膜電晶體基板 Download PDF

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TWI553881B
TWI553881B TW103119692A TW103119692A TWI553881B TW I553881 B TWI553881 B TW I553881B TW 103119692 A TW103119692 A TW 103119692A TW 103119692 A TW103119692 A TW 103119692A TW I553881 B TWI553881 B TW I553881B
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thin film
film transistor
pixel electrode
predetermined height
slope
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TW103119692A
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TW201547028A (zh
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徐旭寬
邱國豪
朱夏青
黃鵬丞
孫銘謙
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群創光電股份有限公司
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Priority to TW103119692A priority Critical patent/TWI553881B/zh
Priority to CN201410354713.8A priority patent/CN105321955B/zh
Priority to CN201420410804.4U priority patent/CN204243040U/zh
Priority to CN201811462508.8A priority patent/CN109585458B/zh
Priority to US14/462,232 priority patent/US9362314B2/en
Priority to JP2014004756U priority patent/JP3194341U/ja
Publication of TW201547028A publication Critical patent/TW201547028A/zh
Priority to US15/147,610 priority patent/US9716179B2/en
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Publication of TWI553881B publication Critical patent/TWI553881B/zh

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    • H01L29/78618Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device characterised by the drain or the source properties, e.g. the doping structure, the composition, the sectional shape or the contact structure
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    • G02F1/136227Through-hole connection of the pixel electrode to the active element through an insulation layer
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    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362Active matrix addressed cells
    • G02F1/1368Active matrix addressed cells in which the switching element is a three-electrode device
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    • H01L23/522Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
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    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
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    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/78Field effect transistors with field effect produced by an insulated gate
    • H01L29/786Thin film transistors, i.e. transistors with a channel being at least partly a thin film
    • H01L29/7869Thin film transistors, i.e. transistors with a channel being at least partly a thin film having a semiconductor body comprising an oxide semiconductor material, e.g. zinc oxide, copper aluminium oxide, cadmium stannate
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Description

薄膜電晶體基板
本發明係關於一種薄膜電晶體基板,尤指一種可改善顯示面板漏光情形之薄膜電晶體基板。
隨著顯示器技術不斷進步,所有的裝置均朝體積小、厚度薄、重量輕等趨勢發展,故目前市面上主流之顯示器裝置已由以往之陰極射線管發展成液晶顯示裝置。特別是,液晶顯示裝置可應用的領域相當多,舉凡日常生活中使用之手機、筆記型電腦、攝影機、照相機、音樂播放器、行動導航裝置、電視等顯示裝置,大多數均使用液晶顯示面板。
於現今所使用之液晶顯示面板中,主要結構不外乎是透過設置於一薄膜電晶體基板上之薄膜電晶體單元控制液晶的轉動,而達到顯示面板呈現亮暗態之功效。然而,於薄膜電晶體單元上之汲極接觸孔,卻會因光線在孔內的反射,導致漏光的情形產生;而此漏光的情形卻是造成顯示面板顯示效果降低的因素之一。
因此,為了達到提升顯示面板顯示效果之目的,各家廠商無不積極開發一種可減少漏光之顯示面板,以符合消費者對於顯示品質之要求。據此,目前亟需發展 一種薄膜電晶體基板,當其應用於顯示面板上時,可降低漏光的情形發生,而達到提升顯示品質的目的。
本發明之主要目的係在提供一種薄膜電晶體基板,俾能減少以此所製備之顯示面板之漏光情形。
為達成上述目的,本發明之一實施態樣係提供一種薄膜電晶體基板,包括:一基板、複數薄膜電晶體單元、一絕緣層、一畫素電極、以及一配向膜。其中,薄膜電晶體單元係設置於基板上且分別包括:一閘極絕緣層、一主動層、一源極及一汲極。此外,絕緣層則設置於該等薄膜電晶體單元上具有複數接觸孔以分別顯露該等薄膜電晶體單元之該汲極;畫素電極係設置於絕緣層上且向該等接觸孔延伸以與汲極電性連接;而配向膜則覆蓋該畫素電極。其中,該等接觸孔之側壁在一第一方向上分別具有一第一傾斜部且在一第二方向上分別具有一第二傾斜部,第一方向與第二方向不同,且畫素電極位於至少一第一傾斜部之坡度與位於至少一第二傾斜部之坡度不同。
於本發明之另一實施態樣係提供另一薄膜電晶體基板,包括:一基板、複數薄膜電晶體單元、一絕緣層、一畫素電極、以及一配向膜。其中,薄膜電晶體單元係設置於該基板上且分別包括:一閘極絕緣層、一主動層、一源極及一汲極。此外,一絕緣層係設置於薄膜電晶體單元上具有複數接觸孔以分別顯露薄膜電晶體單元之汲極;一畫素電極則設置於絕緣層上且向接觸孔延伸以與汲極電 性連接;而一配向膜係覆蓋畫素電極。其中,該等接觸孔分別具有一中間底部,且設於至少一中間底部之配向膜具有一多孔性結構。於本實施態樣中,主動層之材料並無特殊限制,可為本技術領域已知之半導體材料,如非晶矽、金屬氧化物(如,IGZO)等。
於本發明之再一實施態樣係提供另一薄膜電晶體基板,其同時包括前述兩個實施態樣之技術特徵。
於本發明前述實施態樣所提供之薄膜電晶體基板中,第一方向可與第二方向不同;較佳為第一方向與第二方向間之夾角係介於85至90度之間;且更佳為第一方向與第二方向實質上垂直。
於本發明前述實施態樣所提供之薄膜電晶體基板中,第一方向與和薄膜電晶體單元電性連接之一掃描線間之夾角係介於0至5度之間,而第二方向與和薄膜電晶體單元電性連接之一資料線間之夾角係介於0至5度之間;較佳為,第一方向與掃描線實質上平行,而第二方向與資料線實質上平行。於此情形下,畫素電極位於至少一第一傾斜部之坡度大於位於至少一第二傾斜部之坡度。
於本發明前述實施態樣中,在此,所謂之「坡度」可以「斜率」方式定義;更具體而言,絕緣層之一絕緣層表面之延伸線於第一方向及第二方向上分別與位於接觸孔之畫素電極之一電極表面形成一第一接觸點及一第二接觸點,於畫素電極及汲極間之一第一預定高度上位於第一傾斜部與第二傾斜部之畫素電極之電極表面分別具有一 第一相交點及一第二相交點,位於至少一第一傾斜部上之畫素電極之斜率為第一接觸點與第一相交點之連線,而位於至少一第二傾斜部上之畫素電極之斜率為第二接觸點與第二相交點之連線。於本發明前述實施態樣所提供之薄膜電晶體基板中,畫素電極位於至少一第一傾斜部與至少一第二傾斜部之斜率不同;較佳為,當第一方向與和薄膜電晶體單元電性連接之一掃描線間之夾角係介於0至5度之間或第一方向與掃描線實質上平行,而第二方向與和薄膜電晶體單元電性連接之一資料線間之夾角係介於0至5度之間或第二方向與資料線實質上平行時,該畫素電極位於至少一第一傾斜部之斜率大於位於至少一第二傾斜部之斜率。
於本發明前述實施態樣中,在此,所謂之「坡度」也可以「曲率半徑」方式定義;更具體而言,於畫素電極及汲極間之一第一預定高度及一第二預定高度上,且第二預定高度前述之第一預定高度不同,位於至少一該第一傾斜部在第一預定高度及第二預定高度下之畫素電極之曲率半徑與位於至少一第二傾斜部在第一預定高度及第二預定高度下之畫素電極之曲率半徑不同。較佳為,當第一方向與和薄膜電晶體單元電性連接之一掃描線間之夾角係介於0至5度之間或第一方向與掃描線實質上平行,而第二方向與和薄膜電晶體單元電性連接之一資料線間之夾角係介於0至5度之間或第二方向與資料線實質上平行時,位於至少一第一傾斜部在第一預定高度及第二預定高度下 之畫素電極之曲率半徑均小於位於至少一第二傾斜部在第一預定高度及第二預定高度下之畫素電極之曲率半徑。
更佳為,於本發明前述實施態樣中,第一傾斜部及第二傾斜部上之畫素電極同時符合前述以「斜率」及「曲率半徑」方式定義之相對關係。
於本發明前述實施態樣所提供之薄膜電晶體基板中,位於接觸孔中間底部之配向膜可具有一多孔性結構。其中,多孔性結構中之孔洞孔徑並無特別限制,而較佳係介於50nm至1000nm之間。
此外,於本發明前述實施態樣所提供之薄膜電晶體基板中,配向膜係設於接觸孔中,且設於接觸孔側壁上之配向膜與設於中間底部之配向膜具有不同粗糙度。
再者,本發明更提供一液晶顯示面板,其包括前述之薄膜電晶體基板。
1‧‧‧薄膜電晶體基板
10‧‧‧基板
11‧‧‧掃描線
111‧‧‧閘極
12‧‧‧閘極絕緣層
121‧‧‧第一閘極絕緣層
122‧‧‧第二閘極絕緣層
13‧‧‧主動層
14‧‧‧資料線
142‧‧‧汲極
15‧‧‧第一絕緣層
151‧‧‧第一保護絕緣層
1511,1521‧‧‧絕緣層開孔
152‧‧‧第二保護絕緣層
16‧‧‧第二絕緣層
16a‧‧‧絕緣層表面
161‧‧‧接觸孔
161a‧‧‧中間底部
1611‧‧‧第一傾斜部
1612‧‧‧第二傾斜部
17‧‧‧畫素電極
17a‧‧‧電極表面
18‧‧‧配向膜
181‧‧‧孔洞
2‧‧‧彩色濾光基板
3‧‧‧液晶層
4‧‧‧間隔物
5‧‧‧框膠
A‧‧‧區域
H1‧‧‧第一預定高度
H2‧‧‧第二預定高度
P1‧‧‧第一接觸點
P2‧‧‧第二接觸點
Q1‧‧‧第一相交點
Q2‧‧‧第二相交點
R1‧‧‧第三相交點
R4‧‧‧第四相交點
X‧‧‧第一方向
Y‧‧‧第二方向
圖1係本發明實施例1之液晶顯示面板示意圖。
圖2係本發明實施例1之汲極接觸孔結構示意圖。
圖3A及圖3B係分別為本發明實施例1之汲極接觸孔結構沿圖2之A-A’與B-B’剖面線之剖面示意圖。
圖4A及圖4B係分別為本發明實施例1之圖3A及圖3B之區域A之放大圖。
圖5A及圖5B係分別為本發明實施例2之汲極接觸孔 結構沿圖2之A-A’與B-B’剖面線之剖面示意圖。
圖6A及圖6B係分別為本發明實施例2之圖4A及圖4B之區域A之放大圖。
以下係藉由特定的具體實施例說明本發明之實施方式,熟習此技藝之人士可由本說明書所揭示之內容輕易地了解本發明之其他優點與功效。本發明亦可藉由其他不同的具體實施例加以施行或應用,本說明書中的各項細節亦可針對不同觀點與應用,在不悖離本創作之精神下進行各種修飾與變更。
實施例1
如圖1所示,本實施例之液晶顯示面板之包括:一薄膜電晶體基板1;一彩色濾光基板2,與薄膜電晶體基板1相對設置;複數間隔物4,設於薄膜電晶體基板1及彩色濾光基板2間;一框膠5,設於薄膜電晶體基板1及彩色濾光基板2間且位於設於薄膜電晶體基板1及彩色濾光基板2外周圍;以及一液晶層3,設於薄膜電晶體基板1及彩色濾光基板2所形成之空間中。接下來,將描述本實施例之薄膜電晶體基板之結構。
如圖2所示,其係為本實施例之汲極接觸孔結構示意圖;且如圖3A所示,其為本實施例之汲極接觸孔結構沿圖2之A-A’剖面線之剖面示意圖。請同時參照圖2及圖3A,本實施例之薄膜電晶體基板包括:一基板10,其上方設置有一由第一金屬層形成之掃描線11及閘極111、 一閘極絕緣層12、一主動層13、一由第二金屬層形成之資料線14及源極(圖未示)與汲極142、一第一絕緣層15、一第二絕緣層16、一畫素電極17及一配向膜18;且閘極111、閘極絕緣層12、主動層13、源極(圖未示)與汲極142係組成本實施例之薄膜電晶體單元。其中,如圖2所示,掃描線11係沿第一方向X配置;更具體而言,第一方向X與和薄膜電晶體單元電性連接之掃描線11間之夾角係介於0至5度之間,且較佳為實質上平行。此外,資料線14則沿第二方向Y配置;更具體而言,第二方向Y與和薄膜電晶體單元電性連接之一資料線14間之夾角係介於0至5度之間,且較佳為實質上平行。此外,第一方向X與第二方向Y係不相同;於本實施例中,第一方向X與第二方向Y間之夾角係介於85至90度之間;較佳為,第一方向X與第二方向Y係實質上垂直。
如圖3A所示,本實施例之薄膜電晶體基板包括:一基板10、複數薄膜電晶體單元、一包括第一絕緣層15及第二絕緣層16之絕緣層、一畫素電極17、以及一配向膜18。其中,薄膜電晶體單元係設置於基板10上且分別包括:一閘極111;一閘極絕緣層12,設置於閘極111及基板10上;一主動層(圖未示),設置於閘極絕緣層12上;以及一源極(圖未示)及一汲極142,設置於主動層(圖未示)上。此外,包括第一絕緣層15及第二絕緣層16之絕緣層則設置於薄膜電晶體單元上且分別具有一絕緣層開孔1521及一接觸孔161以顯露薄膜電晶體單元之汲極142;畫素電極17 係設置第一絕緣層15及第二絕緣層16上且向接觸孔161延伸以與汲極142電性連接;而配向膜18則覆蓋畫素電極17。
於本實施例中,係以下閘極式薄膜電晶體單元作為示例,於本發明之其他實施例中,也可為其他類型之薄膜電晶體單元,如上閘極式薄膜電晶體單元。
在此,第一金屬層及第二金屬層材料可使用本技術領域常用之導電材料,如金屬、合金、金屬氧化物、金屬氮氧化物、或其他本技術領域常用之電極材料;且較佳為金屬材料。於本實施例中,第一金屬層可為由Ta及W依序層疊之複合金屬層,而第二金屬層可為由Ti、Al及Ti依序層疊之複合金屬層。此外,閘極絕緣層12之材料可為本技術領域常用之絕緣材料;於本實施例中,閘極絕緣層12為由氮化矽所形成之第一閘極絕緣層121及由氧化矽所形成之第二閘極絕緣層122依序層疊形成之絕緣層。再者,主動層13之材料可為本技術領域常用之半導體材料;於本實施例中,主動層13之材料為IGZO。同時,於本實施例中,設於第二金屬層上之絕緣層係由第一絕緣層15及第二絕緣層16層疊形成;其中,第一絕緣層15之材料可為本技術領域常用之絕緣層材料,在此,第一絕緣層15係由氧化矽所形成之第一保護絕緣層151及由氮化矽所形成之第二保護絕緣層152依序層疊形成,且第一保護絕緣層151與第二保護絕緣層152分別具有一絕緣層開孔1511,1521以顯露薄膜電晶體單元之汲極142;至於第二絕緣層16之材料可為本 技術領域常用之平坦層材料,且具有一接觸孔161以顯露薄膜電晶體單元之汲極142。於本實施例中,設於第二金屬層上之絕緣層係由第一絕緣層15及第二絕緣層16依序層疊形成;然而,於本發明之其他實施例中,設於第二金屬層上之絕緣層可僅包括第一絕緣層15及第二絕緣層16之其中一者。再者,畫素電極17之材料可使用本技術領域常用之透明導電材料,如ITO、IZO等金屬氧化物之透明電極材料。在此須說明的是,前述之各層材料僅為本發明其中一實施例,但本發明並不僅限於此。
請同時參照圖3A及圖3B,於圖3A中,顯露汲極142之開孔大小係由第二保護絕緣層152之絕緣層開孔1521所決定,而於圖3B中,則由第二絕緣層16之接觸孔161所決定。
請同時參照圖3A及圖3B,其分別為本實施例之汲極接觸孔結構沿圖2之A-A’與B-B’剖面線之剖面示意圖。請同時參照圖2及圖3A及3B,接觸孔161之側壁在第一方向X上具有一第一傾斜部1611且在第二方向Y上具有一第二傾斜部1612,且畫素電極17位於第一傾斜部1611之坡度與位於第二傾斜部1612之坡度不同。
請同時參照圖4A及圖4B,其分別為圖3A及圖3B之區域A之放大圖。請同時參照圖2及圖4A及4B,畫素電極17位於接觸孔161之側壁在第一方向X上之第一傾斜部1611之坡度大於位於接觸孔161之側壁在第二方向Y之第二傾斜部1612之坡度。
更詳細而言,如圖2及圖4A及4B所示,第二絕緣層16之一絕緣層表面16a之延伸線(如虛線所示)於第一方向X及第二方向Y上分別與位於接觸孔161之畫素電極17之一電極表面17a形成一第一接觸點P1及一第二接觸點P2,於畫素電極17及汲極142間之一第一預定高度H1上位於第一傾斜部1611與第二傾斜部1612之畫素電極17之電極表面17a分別具有一第一相交點Q1及一第二相交點Q2,位於第一傾斜部1611上之畫素電極17a之斜率為第一接觸點P1與第一相交點Q1之連線,位於第二傾斜部1612上之畫素電極17之斜率為第二接觸點P2與第二相交點Q2之連線,且畫素電極17位於第一傾斜部1611與第二傾斜部1612之斜率不同。較佳為,於本實施例中,畫素電極17位於第一傾斜部1611之斜率大於位於第二傾斜部1612之斜率。
第一傾斜部1611及第二傾斜部1612間除了有前述斜率關係外,更有曲率半徑關係。如圖2及圖4A及4B所示,於畫素電極17及汲極142間之一第一預定高度H1及一第二預定高度H2上,且第二預定高度H2與第一預定高度H1不同,位於第一傾斜部1611在第一預定高度H1及第二預定高度H2下之畫素電極17之曲率半徑與位於第二傾斜部1612在第一預定高度H1及第二預定高度H2下之畫素電極17之曲率半徑不同。在此,所謂之曲率半徑係指於第一預定高度H1上分別位於第一傾斜部1611與第二傾斜部1612之畫素電極17之電極表面17a之第一相交點Q1及 第二相交點Q2、以及於第二預定高度H2上分別位於第一傾斜部1611與第二傾斜部1612之畫素電極17之電極表面17a之第三相交點R1及第四相交點R4為基準所得到之曲率半徑。較佳為,於本實施例中,位於第一傾斜部1611在第一預定高度H1及第二預定高度H2下之畫素電極17之曲率半徑均小於位於第二傾斜部1612在第一預定高度H1及第二預定高度H2下之畫素電極17之曲率半徑。
於本實施例中,如圖2至圖4B所示,藉由將接觸孔於不同方向上設計不同坡度,更具體而言,藉由將接觸孔之側壁於不同方向上之第一傾斜部及第二傾斜部設計成具有不同坡度(包括斜率及曲率半徑等),則可避免光線於接觸孔中之反射角度相同,藉此可達到降低漏光的效果。
此外,如圖3A及圖3B所示,於本實施例中,接觸孔161分別具有一中間底部161a,配向膜18係設於接觸孔161中,且設於接觸孔161之中間底部161a之配向膜18具有一多孔性結構。其中,多孔性結構中之孔洞181孔徑可介於50nm至1000nm之間。再者,設於接觸孔161之側壁上之配向膜18與設於中間底部161a之配向膜18具有不同粗糙度。在此,配向膜18可使用本技術領域常用之配向膜材料(如PI)製備;且可透過選擇配向膜18材料之單體及聚合程度,進而控制配向膜18是否具有多孔性結構以及控制多孔性結構中之孔洞孔徑大小。
於本實施例中,如圖3A及圖3B所示,藉由將接觸孔中之配向膜設計成具有多孔性結構,而可減少光線 在多孔性結構內反射,以避免於接觸孔中產生漏光的情形。
在此,於圖3A至圖4B中,僅以同一汲極接觸孔之剖面表示,於其他實施例中,圖2之A-A’及B-B’剖面線可位於不同接觸孔,只要符合前述條件即可。
此外,如圖2至圖4B所示,在此僅以接觸孔161於第一方向X及第二方向Y之左側壁之第一傾斜部1611及第二傾斜部1612進行比較;然而,於本發明中,並不限於將接觸孔161之左側壁之傾斜部進行比較,而可將不同接觸孔161於第一方向X之左側壁和右側壁之其中一者的傾斜部與相同或不同接觸孔161於第二方向Y之左側壁和右側壁之其中一者的傾斜部進行比較,只要符合前述條件即可。
實施例2
本實施例之液晶顯示面板及其薄膜電晶體基板結構係與實施例1相同,除了下述不同點。
首先,本實施例之薄膜電晶體元件中之主動層材料為非晶矽。
此外,圖5A及圖5B係分別為本實施例之汲極接觸孔結構沿圖2之A-A’與B-B’剖面線之剖面示意圖。如圖5A及圖5B所示,本實施例之薄膜電晶體基板上,配向膜18不具有多孔性結構。再者,圖6A及圖6B係分別為圖5A及圖5B之區域A之放大圖。請比較圖4A、4B、6A及6B,雖然實施例1之第一傾斜部1611及第二傾斜部1612較本實施例彎曲,但本實施例之薄膜電晶體基板結構仍具 有前述畫素電極17位於接觸孔161之側壁在第一方向X上之第一傾斜部1611之坡度大於位於接觸孔161之側壁在第二方向Y之第二傾斜部1612之坡度之特徵,藉此而可避免光線於接觸孔中之反射角度相同以達到降低漏光的效果。
於前述實施例中,僅以薄膜電晶體基板與彩色濾光基板相對設置之液晶顯示面板加以示例,其他如陣列上彩色濾光膜(COA)顯示面板亦可使用前述本發明所提供之薄膜電晶體基板。
此外,本發明前述實施例所製得之顯示裝置,可應用於本技術領域已知之任何需要顯示螢幕之電子裝置上,如顯示器、手機、筆記型電腦、攝影機、照相機、音樂播放器、行動導航裝置、電視等。
上述實施例僅係為了方便說明而舉例而已,本發明所主張之權利範圍自應以申請專利範圍所述為準,而非僅限於上述實施例。
10‧‧‧基板
111‧‧‧閘極
12‧‧‧閘極絕緣層
121‧‧‧第一閘極絕緣層
122‧‧‧第二閘極絕緣層
142‧‧‧汲極
15‧‧‧第一絕緣層
151‧‧‧第一保護絕緣層
1511,1521‧‧‧絕緣層開孔
152‧‧‧第二保護絕緣層
16‧‧‧第二絕緣層
16a‧‧‧絕緣層表面
161‧‧‧接觸孔
161a‧‧‧中間底部
1611‧‧‧第一傾斜部
17‧‧‧畫素電極
18‧‧‧配向膜
181‧‧‧孔洞
A‧‧‧區域

Claims (22)

  1. 一種薄膜電晶體基板,包括:一基板;複數薄膜電晶體單元,設置於該基板上且分別包括:一閘極絕緣層、一主動層、一源極及一汲極;一絕緣層,設置於該等薄膜電晶體單元上具有複數接觸孔以分別顯露該等薄膜電晶體單元之該汲極;一畫素電極,設置於該絕緣層上且向該等接觸孔延伸以與該汲極電性連接;以及一配向膜,覆蓋該畫素電極;其中該等接觸孔之側壁在一第一方向上分別具有一第一傾斜部且在一第二方向上分別具有一第二傾斜部,該第一方向與該第二方向不同,且該畫素電極位於至少一該等第一傾斜部之坡度與位於至少一該等第二傾斜部之坡度不同。
  2. 如申請專利範圍第1項所述之薄膜電晶體基板,其中該第一方向與該第二方向間之夾角係介於85至90度之間。
  3. 如申請專利範圍第1項所述之薄膜電晶體基板,其中該第一方向與和該薄膜電晶體單元電性連接之一掃描線間之夾角係介於0至5度之間,該第二方向與和該薄膜電晶體單元電性連接之一資料線間之夾角係介於0至5度之間,且該畫素電極位於至少一該等第一傾斜部之坡度大於位於至少一該等第二傾斜部之坡度。
  4. 如申請專利範圍第1項所述之薄膜電晶體基板,其中該等接觸孔分別具有一中間底部,該配向膜係設於該等接觸 孔中,且設於該等接觸孔之至少一該等中間底部之配向膜具有一多孔性結構。
  5. 如申請專利範圍第4項所述之薄膜電晶體基板,其中該多孔性結構中之孔洞孔徑係介於50nm至1000nm之間。
  6. 如申請專利範圍第1項所述之薄膜電晶體基板,其中該配向膜係設於該等接觸孔中,且設於該等接觸孔之側壁上之該配向膜與設於該中間底部之該配向膜具有不同粗糙度。
  7. 如申請專利範圍第1項所述之薄膜電晶體基板,其中該絕緣層之一絕緣層表面之延伸線於該第一方向及該第二方向上分別與位於該等接觸孔之該畫素電極之一電極表面形成一第一接觸點及一第二接觸點,於該畫素電極及該汲極間之一第一預定高度上位於該等第一傾斜部與該等第二傾斜部之該畫素電極之該電極表面分別具有一第一相交點及一第二相交點,位於至少一該等第一傾斜部上之該畫素電極之斜率為該第一接觸點與該第一相交點之連線,位於至少一該等第二傾斜部上之該畫素電極之斜率為該第二接觸點與該第二相交點之連線,且該畫素電極位於至少一該等第一傾斜部與至少一該等第二傾斜部之斜率不同。
  8. 如申請專利範圍第7項所述之薄膜電晶體基板,其中該第一方向與和該薄膜電晶體單元電性連接之一掃描線間之夾角係介於0至5度之間,該第二方向與和該薄膜電晶體單元電性連接之一資料線間之夾角係介於0至5度之間,且該畫素電極位於至少一該等第一傾斜部之斜率大於位於至少一該等第二傾斜部之斜率。
  9. 如申請專利範圍第7項所述之薄膜電晶體基板,其中於該畫素電極及該汲極間之一第二預定高度上,且該第二預定高度與該第一預定高度不同,位於至少一該等第一傾斜部在該第一預定高度及該第二預定高度下之該畫素電極之曲率半徑與位於至少一該等第二傾斜部在該第一預定高度及該第二預定高度下之該畫素電極之曲率半徑不同。
  10. 如申請專利範圍第9項所述之薄膜電晶體基板,其中該第一方向與和該薄膜電晶體單元電性連接之一掃描線間之夾角係介於0至5度之間,該第二方向與和該薄膜電晶體單元電性連接之一資料線間之夾角係介於0至5度之間,且位於至少一該等第一傾斜部在該第一預定高度及該第二預定高度下之該畫素電極之曲率半徑均小於位於至少一該等第二傾斜部在該第一預定高度及該第二預定高度下之該畫素電極之曲率半徑。
  11. 如申請專利範圍第1項所述之薄膜電晶體基板,其中該主動層之材料為IGZO。
  12. 一種薄膜電晶體基板,包括:一基板;複數薄膜電晶體單元,設置於該基板上且分別包括:一閘極絕緣層、一主動層、一源極及一汲極;一絕緣層,設置於該薄膜電晶體單元上具有複數接觸孔以分別顯露該等薄膜電晶體單元之該汲極;一畫素電極,設置於該絕緣層上且向該等接觸孔延伸以與該汲極電性連接;以及 一配向膜,覆蓋該畫素電極,該配向膜的材料為聚醯亞胺(PI);其中該等接觸孔分別具有一中間底部,且設於至少一該等中間底部之該配向膜具有一多孔性結構。
  13. 如申請專利範圍第12項所述之薄膜電晶體基板,其中該多孔性結構中之孔洞孔徑係介於50nm至1000nm之間。
  14. 如申請專利範圍第12項所述之薄膜電晶體基板,其中該配向膜係設於該等接觸孔中,且設於該等接觸孔之側壁上之該配向膜與設於該中間底部之該配向膜具有不同粗糙度。
  15. 如申請專利範圍第12項所述之薄膜電晶體基板,其中該等接觸孔之側壁在一第一方向上分別具有一第一傾斜部且在一第二方向上分別具有一第二傾斜部,該第一方向與該第二方向不同,且該畫素電極位於至少一該等第一傾斜部之坡度與位於至少一該等第二傾斜部之坡度不同。
  16. 如申請專利範圍第15項所述之薄膜電晶體基板,其中該第一方向與該第二方向間之夾角係介於85至90度之間。
  17. 如申請專利範圍第15項所述之薄膜電晶體基板,其中該第一方向與和該薄膜電晶體單元電性連接之一掃描線間之夾角係介於0至5度之間,該第二方向與和該薄膜電晶體單元電性連接之一資料線間之夾角係介於0至5度之間,且該畫素電極位於至少一該等第一傾斜部之坡度大於位於至少一該等第二傾斜部之坡度。
  18. 如申請專利範圍第15項所述之薄膜電晶體基板,其中該絕緣層之一絕緣層表面之延伸線於該第一方向及該第二方 向上分別與位於該等接觸孔之該畫素電極之一電極表面形成一第一接觸點及一第二接觸點,於該畫素電極及該汲極間之一第一預定高度上位於該等第一傾斜部與該等第二傾斜部之該畫素電極之該電極表面分別具有一第一相交點及一第二相交點,位於至少一該等第一傾斜部上之該畫素電極之斜率為該第一接觸點與該第一相交點之連線,位於至少一該等第二傾斜部上之該畫素電極之斜率為該第二接觸點與該第二相交點之連線,且該畫素電極位於至少一該等第一傾斜部與至少一該等第二傾斜部之斜率不同。
  19. 如申請專利範圍第18項所述之薄膜電晶體基板,其中該第一方向與和該薄膜電晶體單元電性連接之一掃描線間之夾角係介於0至5度之間,該第二方向與和該薄膜電晶體單元電性連接之一資料線間之夾角係介於0至5度之間,且該畫素電極位於至少一該等第一傾斜部之斜率大於位於至少一該等第二傾斜部之斜率。
  20. 如申請專利範圍第18項所述之薄膜電晶體基板,其中於該畫素電極及該汲極間之一第二預定高度上,且該第二預定高度與該第一預定高度不同,位於至少一該等第一傾斜部在該第一預定高度及該第二預定高度下之該畫素電極之曲率半徑與位於至少一該等第二傾斜部在該第一預定高度及該第二預定高度下之該畫素電極之曲率半徑不同。
  21. 如申請專利範圍第20項所述之薄膜電晶體基板,其中該第一方向與和該薄膜電晶體單元電性連接之一掃描線間之夾角係介於0至5度之間,該第二方向與和該薄膜電晶體單元 電性連接之一資料線間之夾角係介於0至5度之間,且位於至少一該等第一傾斜部在該第一預定高度及該第二預定高度下之該畫素電極之曲率半徑均小於與位於至少一該等第二傾斜部在該第一預定高度及該第二預定高度下之該畫素電極之曲率半徑。
  22. 如申請專利範圍第12項所述之薄膜電晶體基板,其中該主動層之材料為IGZO。
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