TWI552237B - A semiconductor wafer bonding method, a semiconductor wafer bonding method, a semiconductor device manufacturing method, and a semiconductor device - Google Patents

A semiconductor wafer bonding method, a semiconductor wafer bonding method, a semiconductor device manufacturing method, and a semiconductor device Download PDF

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Publication number
TWI552237B
TWI552237B TW100112384A TW100112384A TWI552237B TW I552237 B TWI552237 B TW I552237B TW 100112384 A TW100112384 A TW 100112384A TW 100112384 A TW100112384 A TW 100112384A TW I552237 B TWI552237 B TW I552237B
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Taiwan
Prior art keywords
semiconductor wafer
bonding
semiconductor
wafer bonding
semiconductor device
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TW100112384A
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English (en)
Chinese (zh)
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TW201140721A (en
Inventor
Kohei Takeda
Hideaki Ishizawa
Chizuru Kim
Munehiro Hatai
Yoshio Nishimura
Hisatoshi Okayama
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Sekisui Chemical Co Ltd
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Publication of TW201140721A publication Critical patent/TW201140721A/zh
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Publication of TWI552237B publication Critical patent/TWI552237B/zh

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    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
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TW100112384A 2010-04-13 2011-04-11 A semiconductor wafer bonding method, a semiconductor wafer bonding method, a semiconductor device manufacturing method, and a semiconductor device TWI552237B (zh)

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JP6128837B2 (ja) * 2012-02-21 2017-05-17 東京応化工業株式会社 接着剤組成物の製造方法、接着剤組成物及び接着フィルム
JP6033841B2 (ja) * 2012-03-07 2016-11-30 住友電気工業株式会社 印刷型接着剤及びこれを用いた接合体の製造方法
CN104508798B (zh) * 2012-07-26 2017-03-08 古河电气工业株式会社 半导体晶片加工用胶带的制造方法以及半导体晶片加工用胶带
JP2014077122A (ja) * 2012-09-24 2014-05-01 Sekisui Chem Co Ltd 電子部品用接着剤及び半導体チップ実装体の製造方法
JP6364239B2 (ja) * 2014-05-23 2018-07-25 株式会社Adeka 一液型熱硬化性エポキシ樹脂組成物
JP5967629B2 (ja) 2014-11-17 2016-08-10 インターナショナル・ビジネス・マシーンズ・コーポレーションＩｎｔｅｒｎａｔｉｏｎａｌ Ｂｕｓｉｎｅｓｓ Ｍａｃｈｉｎｅｓ Ｃｏｒｐｏｒａｔｉｏｎ 回路モジュール及びその製造方法
JP6460896B2 (ja) * 2015-04-21 2019-01-30 積水化学工業株式会社 半導体装置の製造方法
CN110461938A (zh) * 2017-03-31 2019-11-15 日立化成株式会社 环氧树脂组合物和电子部件装置
WO2019142423A1 (fr) * 2018-01-17 2019-07-25 セメダイン株式会社 Corps de montage
CN111630640B (zh) * 2018-01-30 2023-04-28 日立化成株式会社 半导体装置的制造方法、膜状粘接剂及粘接片材
KR102553619B1 (ko) * 2018-01-30 2023-07-10 가부시끼가이샤 레조낙 접착제 조성물, 필름형 접착제, 접착 시트 및 반도체 장치의 제조 방법
SG11202109364TA (en) * 2019-03-29 2021-10-28 Mitsui Mining & Smelting Co Bonded body and method for manufacturing same

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JP2008159755A (ja) * 2006-12-22 2008-07-10 Sekisui Chem Co Ltd 半導体装置の製造方法

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