SG11202109364TA - Bonded body and method for manufacturing same - Google Patents
Bonded body and method for manufacturing sameInfo
- Publication number
- SG11202109364TA SG11202109364TA SG11202109364TA SG11202109364TA SG 11202109364T A SG11202109364T A SG 11202109364TA SG 11202109364T A SG11202109364T A SG 11202109364TA SG 11202109364T A SG11202109364T A SG 11202109364TA
- Authority
- SG
- Singapore
- Prior art keywords
- bonded body
- manufacturing same
- manufacturing
- bonded
- same
- Prior art date
Links
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
- B22F7/06—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools
- B22F7/062—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools involving the connection or repairing of preformed parts
- B22F7/064—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools involving the connection or repairing of preformed parts using an intermediate powder layer
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
- B22F1/107—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material containing organic material comprising solvents, e.g. for slip casting
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- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/10—Sintering only
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- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
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- H01L2224/83201—Compression bonding
- H01L2224/83203—Thermocompression bonding, e.g. diffusion bonding, pressure joining, thermocompression welding or solid-state welding
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- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8338—Bonding interfaces outside the semiconductor or solid-state body
- H01L2224/83399—Material
- H01L2224/834—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
- H01L2224/83438—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/83447—Copper [Cu] as principal constituent
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- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
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- Engineering & Computer Science (AREA)
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- Microelectronics & Electronic Packaging (AREA)
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- Manufacturing & Machinery (AREA)
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- Chemical & Material Sciences (AREA)
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JP2019068287 | 2019-03-29 | ||
PCT/JP2020/008653 WO2020202970A1 (en) | 2019-03-29 | 2020-03-02 | Bonded body and method for manufacturing same |
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SG11202109364T SG11202109364TA (en) | 2019-03-29 | 2020-03-02 | Bonded body and method for manufacturing same |
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JP (1) | JPWO2020202970A1 (en) |
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CN (1) | CN113614894A (en) |
SG (1) | SG11202109364TA (en) |
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JPS5361973A (en) * | 1976-11-16 | 1978-06-02 | Fuji Electric Co Ltd | Production of semiconductor element |
WO2011129272A1 (en) * | 2010-04-13 | 2011-10-20 | 積水化学工業株式会社 | Attachment material for semiconductor chip bonding, attachment film for semiconductor chip bonding, semiconductor device manufacturing method, and semiconductor device |
JP2013196936A (en) * | 2012-03-21 | 2013-09-30 | Asahi Glass Co Ltd | Conductive paste, conductor, base material with conductive film, and manufacturing method therefor |
JP2014120639A (en) | 2012-12-18 | 2014-06-30 | Rohm Co Ltd | Power module semiconductor device |
EP3041627A4 (en) * | 2013-09-05 | 2017-05-03 | Henkel IP & Holding GmbH | Metal sintering film compositions |
WO2015060346A1 (en) * | 2013-10-23 | 2015-04-30 | 日立化成株式会社 | Die bond sheet and method for manufacturing semiconductor device |
JP6989242B2 (en) * | 2015-10-07 | 2022-01-05 | 古河電気工業株式会社 | Connection structure |
JP2018111872A (en) * | 2017-01-13 | 2018-07-19 | 古河電気工業株式会社 | Material for joining metal, and junction structure |
JP2018129352A (en) * | 2017-02-07 | 2018-08-16 | 三菱電機株式会社 | Power semiconductor device and power conversion device using the same |
JP2019216183A (en) * | 2018-06-13 | 2019-12-19 | 三菱電機株式会社 | Semiconductor device and method of manufacturing semiconductor device |
JP7123688B2 (en) * | 2018-08-06 | 2022-08-23 | 新光電気工業株式会社 | Semiconductor device and its manufacturing method |
US11931808B2 (en) * | 2018-08-08 | 2024-03-19 | Mitsui Mining & Smelting Co., Ltd. | Bonding composition, conductor bonding structure, and method for producing same |
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CN113614894A (en) | 2021-11-05 |
KR20210144678A (en) | 2021-11-30 |
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