TWI549826B - 疊層體製造裝置及疊層體之製造方法 - Google Patents

疊層體製造裝置及疊層體之製造方法 Download PDF

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Publication number
TWI549826B
TWI549826B TW101128484A TW101128484A TWI549826B TW I549826 B TWI549826 B TW I549826B TW 101128484 A TW101128484 A TW 101128484A TW 101128484 A TW101128484 A TW 101128484A TW I549826 B TWI549826 B TW I549826B
Authority
TW
Taiwan
Prior art keywords
laminate
endless
strip
thickness
belt
Prior art date
Application number
TW101128484A
Other languages
English (en)
Chinese (zh)
Other versions
TW201318860A (zh
Inventor
加藤孝清
笠原純也
高田隆久
Original Assignee
宇部愛科喜模股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 宇部愛科喜模股份有限公司 filed Critical 宇部愛科喜模股份有限公司
Publication of TW201318860A publication Critical patent/TW201318860A/zh
Application granted granted Critical
Publication of TWI549826B publication Critical patent/TWI549826B/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B32B37/1027—Pressing using at least one press band
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/02—Temperature
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/08—Dimensions, e.g. volume
    • B32B2309/10—Dimensions, e.g. volume linear, e.g. length, distance, width
    • B32B2309/105—Thickness
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2311/00—Metals, their alloys or their compounds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2311/00—Metals, their alloys or their compounds
    • B32B2311/12—Copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2311/00—Metals, their alloys or their compounds
    • B32B2311/24—Aluminium
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/16—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating
    • B32B37/20—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of continuous webs only
    • B32B37/203—One or more of the layers being plastic
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
TW101128484A 2011-08-09 2012-08-07 疊層體製造裝置及疊層體之製造方法 TWI549826B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011174050 2011-08-09

Publications (2)

Publication Number Publication Date
TW201318860A TW201318860A (zh) 2013-05-16
TWI549826B true TWI549826B (zh) 2016-09-21

Family

ID=47668403

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101128484A TWI549826B (zh) 2011-08-09 2012-08-07 疊層體製造裝置及疊層體之製造方法

Country Status (5)

Country Link
JP (1) JP5921549B2 (ko)
KR (1) KR101972906B1 (ko)
CN (1) CN103747959B (ko)
TW (1) TWI549826B (ko)
WO (1) WO2013021893A1 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI816886B (zh) * 2018-09-26 2023-10-01 日商松下知識產權經營股份有限公司 積層板的製造方法、印刷配線板的製造方法及積層板製造裝置

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5802849B2 (ja) * 2014-01-14 2015-11-04 株式会社シーエンジ 立体網状構造体の製造方法および立体網状構造体の製造装置
KR101693593B1 (ko) * 2014-10-30 2017-01-09 한국생산기술연구원 열 전달 이송벨트를 이용한 프리프레그 제조장치
JP2017189894A (ja) * 2016-04-12 2017-10-19 宇部エクシモ株式会社 金属積層体及び金属成形体
US10105940B2 (en) * 2016-04-18 2018-10-23 The Boeing Company Formation of composite laminates having one or more divergent flanges
CN111149161B (zh) * 2018-03-09 2021-10-22 Hoya株式会社 间隔件、基板的层积体、基板的制造方法和磁盘用基板的制造方法
JP7383464B2 (ja) * 2019-11-26 2023-11-20 宇部エクシモ株式会社 音響振動板、及び音響振動板の製造方法
TWI740515B (zh) 2019-12-23 2021-09-21 長春人造樹脂廠股份有限公司 液晶高分子膜及包含其之積層板
TWI697549B (zh) * 2019-12-23 2020-07-01 長春人造樹脂廠股份有限公司 液晶高分子膜及包含其之積層板
WO2021193195A1 (ja) * 2020-03-24 2021-09-30 株式会社クラレ 金属張積層体の製造方法
KR20220096774A (ko) * 2020-12-31 2022-07-07 (주)이녹스첨단소재 저유전 방열 시트 및 이의 제조방법

Citations (3)

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Publication number Priority date Publication date Assignee Title
EP0470584A2 (en) * 1990-08-06 1992-02-12 Kanegafuchi Kagaku Kogyo Kabushiki Kaisha Continuous production of metal clad laminates
US6908295B2 (en) * 2000-06-16 2005-06-21 Avery Dennison Corporation Process and apparatus for embossing precise microstructures and embossing tool for making same
WO2009155701A1 (en) * 2008-06-27 2009-12-30 Mario Antonio Rago Continuous press and method for manufacturing composite materials with progressive symmetrical pressure

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Publication number Priority date Publication date Assignee Title
JPH01214436A (ja) 1988-02-20 1989-08-28 Matsushita Electric Works Ltd 電気用積層板の製法
JP2638924B2 (ja) * 1988-05-23 1997-08-06 松下電工株式会社 積層板の製造方法
JPH02293111A (ja) * 1989-05-08 1990-12-04 Hitachi Chem Co Ltd 積層板の製造方法及び製造装置
JPH03150161A (ja) * 1989-11-08 1991-06-26 Hitachi Chem Co Ltd 積層板の製造方法及び装置
JPH0433855A (ja) * 1990-05-30 1992-02-05 Dainippon Ink & Chem Inc 金属箔張り積層板の製法
JPH0491911A (ja) * 1990-08-06 1992-03-25 Kanegafuchi Chem Ind Co Ltd 電気用積層板の連続製造方法
JPH05116165A (ja) 1991-10-28 1993-05-14 Hitachi Chem Co Ltd 積層板の製造方法及び製造装置
JPH09314785A (ja) 1996-05-27 1997-12-09 Matsushita Electric Works Ltd 金属箔張り積層板の製造方法及び製造装置
US7101455B1 (en) * 1999-11-01 2006-09-05 Kaneka Corporation Method and device for manufacturing laminated plate
JP3989145B2 (ja) * 1999-11-01 2007-10-10 株式会社カネカ 積層板の製造方法
JP4457542B2 (ja) 2001-06-22 2010-04-28 宇部興産株式会社 熱圧着性を有する多層ポリイミドフィルム、熱対策銅張り板
JP4718197B2 (ja) 2004-03-23 2011-07-06 宇部日東化成株式会社 フレキシブル金属箔積層体製造装置と該装置を用いた製造方法
JP2008037062A (ja) 2006-08-10 2008-02-21 Kitano:Kk 積層フィルム体の製造装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0470584A2 (en) * 1990-08-06 1992-02-12 Kanegafuchi Kagaku Kogyo Kabushiki Kaisha Continuous production of metal clad laminates
US6908295B2 (en) * 2000-06-16 2005-06-21 Avery Dennison Corporation Process and apparatus for embossing precise microstructures and embossing tool for making same
WO2009155701A1 (en) * 2008-06-27 2009-12-30 Mario Antonio Rago Continuous press and method for manufacturing composite materials with progressive symmetrical pressure

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI816886B (zh) * 2018-09-26 2023-10-01 日商松下知識產權經營股份有限公司 積層板的製造方法、印刷配線板的製造方法及積層板製造裝置

Also Published As

Publication number Publication date
KR20140057563A (ko) 2014-05-13
JP5921549B2 (ja) 2016-05-24
CN103747959A (zh) 2014-04-23
JPWO2013021893A1 (ja) 2015-03-05
WO2013021893A1 (ja) 2013-02-14
KR101972906B1 (ko) 2019-04-26
CN103747959B (zh) 2016-02-17
TW201318860A (zh) 2013-05-16

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