TWI548513B - 積層體及其製造方法、印刷配線基板、以及底層形成用組成物 - Google Patents

積層體及其製造方法、印刷配線基板、以及底層形成用組成物 Download PDF

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Publication number
TWI548513B
TWI548513B TW102103783A TW102103783A TWI548513B TW I548513 B TWI548513 B TW I548513B TW 102103783 A TW102103783 A TW 102103783A TW 102103783 A TW102103783 A TW 102103783A TW I548513 B TWI548513 B TW I548513B
Authority
TW
Taiwan
Prior art keywords
underlayer
metal
polymer
oxide particles
layer
Prior art date
Application number
TW102103783A
Other languages
English (en)
Chinese (zh)
Other versions
TW201343380A (zh
Inventor
安居院綾子
塚本直樹
河野貴胤
Original Assignee
富士軟片股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
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Application filed by 富士軟片股份有限公司 filed Critical 富士軟片股份有限公司
Publication of TW201343380A publication Critical patent/TW201343380A/zh
Application granted granted Critical
Publication of TWI548513B publication Critical patent/TWI548513B/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H05K3/387—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive for electroless plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2073—Multistep pretreatment
    • C23C18/2086—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inorganic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
TW102103783A 2012-02-06 2013-01-31 積層體及其製造方法、印刷配線基板、以及底層形成用組成物 TWI548513B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012023388 2012-02-06
JP2012136089 2012-06-15
JP2012212604A JP5756444B2 (ja) 2012-02-06 2012-09-26 積層体およびその製造方法、並びに、下地層形成用組成物

Publications (2)

Publication Number Publication Date
TW201343380A TW201343380A (zh) 2013-11-01
TWI548513B true TWI548513B (zh) 2016-09-11

Family

ID=48947369

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102103783A TWI548513B (zh) 2012-02-06 2013-01-31 積層體及其製造方法、印刷配線基板、以及底層形成用組成物

Country Status (5)

Country Link
JP (1) JP5756444B2 (ko)
KR (1) KR101634469B1 (ko)
CN (1) CN103998650B (ko)
TW (1) TWI548513B (ko)
WO (1) WO2013118603A1 (ko)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6388558B2 (ja) * 2015-05-29 2018-09-12 富士フイルム株式会社 導電性フィルム、タッチパネルセンサー、および、タッチパネル
WO2017169612A1 (ja) * 2016-03-31 2017-10-05 富士フイルム株式会社 導電性積層体の製造方法、積層体および導電性積層体
CN113809509B (zh) * 2020-06-11 2023-07-18 华为技术有限公司 一种天线成型方法、盖板组件及终端设备

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050241949A1 (en) * 2004-04-30 2005-11-03 Kenneth Crouse Selective catalytic activation of non-conductive substrates
US20100143732A1 (en) * 2008-12-10 2010-06-10 Xerox Corporation Composite Containing Polymer, Filler and Metal Plating Catalyst, Method of Making Same, and Article Manufactured Therefrom
US20110281135A1 (en) * 2009-12-17 2011-11-17 Byd Company Limited Surface metallizing method, method for preparing plastic article and plastic article made therefrom

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58157877A (ja) * 1982-03-15 1983-09-20 Hitachi Ltd 無電解めっき用接着剤
JPS6233779A (ja) * 1985-08-05 1987-02-13 Canon Inc 無電解メツキ用接着剤
JPS62250086A (ja) 1986-04-22 1987-10-30 Nippon Soda Co Ltd 無電解メツキ用下地接着剤
JPS63213676A (ja) * 1987-03-02 1988-09-06 Nippon Mining Co Ltd 無電解めつき用接着剤
JP2602992B2 (ja) * 1990-11-15 1997-04-23 日立化成工業株式会社 化学めつき用接着剤組成物，化学めつき用接着剤フイルムおよび印刷配線板の製造法
JPH1135909A (ja) * 1997-07-14 1999-02-09 Hitachi Chem Co Ltd 無電解めっき用接着剤、無電解めっき用フィルム状接着剤及び多層プリント配線板の製造方法
EP2033756A1 (en) * 2007-09-05 2009-03-11 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO A process for preparing a moulded product
EP2314734A1 (en) * 2009-10-20 2011-04-27 Technische Universität Berlin Method of producing porous metal oxide films using template assisted electrostatic spray deposition

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050241949A1 (en) * 2004-04-30 2005-11-03 Kenneth Crouse Selective catalytic activation of non-conductive substrates
US20100143732A1 (en) * 2008-12-10 2010-06-10 Xerox Corporation Composite Containing Polymer, Filler and Metal Plating Catalyst, Method of Making Same, and Article Manufactured Therefrom
US20110281135A1 (en) * 2009-12-17 2011-11-17 Byd Company Limited Surface metallizing method, method for preparing plastic article and plastic article made therefrom

Also Published As

Publication number Publication date
CN103998650B (zh) 2015-12-09
KR20140117382A (ko) 2014-10-07
TW201343380A (zh) 2013-11-01
JP5756444B2 (ja) 2015-07-29
KR101634469B1 (ko) 2016-06-28
WO2013118603A1 (ja) 2013-08-15
JP2014015672A (ja) 2014-01-30
CN103998650A (zh) 2014-08-20

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