TWI545860B - 用於積體電路裝置之插座 - Google Patents

用於積體電路裝置之插座 Download PDF

Info

Publication number
TWI545860B
TWI545860B TW101103129A TW101103129A TWI545860B TW I545860 B TWI545860 B TW I545860B TW 101103129 A TW101103129 A TW 101103129A TW 101103129 A TW101103129 A TW 101103129A TW I545860 B TWI545860 B TW I545860B
Authority
TW
Taiwan
Prior art keywords
conductive
layer
substrate
contact pins
conductive contact
Prior art date
Application number
TW101103129A
Other languages
English (en)
Chinese (zh)
Other versions
TW201246728A (en
Inventor
川手良尚
椿裕一
Original Assignee
３Ｍ新設資產公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ３Ｍ新設資產公司 filed Critical ３Ｍ新設資產公司
Publication of TW201246728A publication Critical patent/TW201246728A/zh
Application granted granted Critical
Publication of TWI545860B publication Critical patent/TWI545860B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/66—Structural association with built-in electrical component
    • H01R13/6608—Structural association with built-in electrical component with built-in single component
    • H01R13/6625—Structural association with built-in electrical component with built-in single component with capacitive component
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0441—Details
    • G01R1/045—Sockets or component fixtures for RF or HF testing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0483—Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07371—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate card or back card with apertures through which the probes pass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Connecting Device With Holders (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
TW101103129A 2011-02-01 2012-01-31 用於積體電路裝置之插座 TWI545860B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011019951A JP6157048B2 (ja) 2011-02-01 2011-02-01 Ｉｃデバイス用ソケット

Publications (2)

Publication Number Publication Date
TW201246728A TW201246728A (en) 2012-11-16
TWI545860B true TWI545860B (zh) 2016-08-11

Family

ID=45554867

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101103129A TWI545860B (zh) 2011-02-01 2012-01-31 用於積體電路裝置之插座

Country Status (3)

Country Link
JP (1) JP6157048B2 (enExample)
TW (1) TWI545860B (enExample)
WO (1) WO2012106103A1 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105137132B (zh) * 2015-09-28 2018-05-15 国网浙江省电力公司丽水供电公司 高压电容器外保护用熔断器监测支架及在线监视方法
US20180184517A1 (en) * 2016-12-22 2018-06-28 Google Llc Multi-layer ic socket with an integrated impedance matching network
US20200003802A1 (en) * 2018-07-02 2020-01-02 Powertech Technology Inc. Testing socket and testing apparatus
JP7452317B2 (ja) * 2020-08-05 2024-03-19 オムロン株式会社 ソケット、ソケットユニット、検査治具および検査治具ユニット

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06297634A (ja) * 1993-04-19 1994-10-25 Toshiba Chem Corp 銅張積層板及び多層銅張積層板
JPH1141812A (ja) * 1997-07-23 1999-02-12 Hitachi Ltd 電力系統用自励式変換器の制御装置
JP3792445B2 (ja) * 1999-03-30 2006-07-05 日本特殊陶業株式会社 コンデンサ付属配線基板
US6558181B2 (en) * 2000-12-29 2003-05-06 Intel Corporation System and method for package socket with embedded power and ground planes
TWI277992B (en) * 2002-10-30 2007-04-01 Matsushita Electric Industrial Co Ltd Sheet capacitor, IC socket using the same, and manufacturing method of sheet capacitor
JPWO2004068922A1 (ja) * 2003-01-31 2006-05-25 富士通株式会社 多層プリント基板、電子機器、および実装方法
JP4259928B2 (ja) 2003-06-11 2009-04-30 株式会社リコー 移送物体検出装置，原稿読取装置および画像形成装置
JP2005310814A (ja) * 2004-04-16 2005-11-04 Alps Electric Co Ltd キャパシタ内蔵基板
JP2006165289A (ja) * 2004-12-08 2006-06-22 Alps Electric Co Ltd 中継基板
US7438581B1 (en) * 2005-05-16 2008-10-21 Myoungsoo Jeon Socket having printed circuit board body portion
US7663387B2 (en) * 2007-09-27 2010-02-16 Yokowo Co., Ltd. Test socket
JP4659087B2 (ja) * 2008-12-17 2011-03-30 パナソニック株式会社 差動平衡信号伝送基板

Also Published As

Publication number Publication date
WO2012106103A1 (en) 2012-08-09
TW201246728A (en) 2012-11-16
JP2012159425A (ja) 2012-08-23
JP6157048B2 (ja) 2017-07-05

Similar Documents

Publication Publication Date Title
TWI521815B (zh) 用於積體電路裝置之插座
US11971449B2 (en) Probe head for a testing apparatus of electronic devices with enhanced filtering properties
JP5960383B2 (ja) 接触子ホルダ
TWI556362B (zh) 嵌入被動元件之基板
JP6116112B2 (ja) Ｉｃデバイス用ソケット
KR20010049257A (ko) 다층 커패시터, 배선기판, 감결합 회로 및 고주파 회로
TWI545860B (zh) 用於積體電路裝置之插座
TWM472195U (zh) 半導體晶片的測試裝置
KR20030063433A (ko) 확장 표면 랜드를 갖는 커패시터 및 그 제조 방법
WO2005006003A1 (ja) Ｂｇａ用ｌｓｉテストソケット
US8957693B2 (en) IC device testing socket
TWI284393B (en) Capacitor-related systems for addressing package/motherboard resonance
JP5124087B2 (ja) 容量性結合された集積回路チップ間の通信を改良するための方法及び装置
CN1630820A (zh) 用于测试电子器件的方法和装置
JP2018021914A (ja) Ｉｃデバイス用ソケット
JP2016026295A (ja) Ｉｃデバイス用ソケット
JP2011146342A (ja) コンタクトピンホルダ
TWI413777B (zh) Multi - power circuit board and its application probe card
JP6109247B2 (ja) Ｉｃデバイス用ソケット
JP6484532B2 (ja) Ｉｃデバイス用ソケット
JP2016153796A (ja) Ｉｃデバイス検査用ソケット
JP2018009994A (ja) Ｉｃデバイス用ソケット

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees