JP6157048B2 - Icデバイス用ソケット - Google Patents
Icデバイス用ソケット Download PDFInfo
- Publication number
- JP6157048B2 JP6157048B2 JP2011019951A JP2011019951A JP6157048B2 JP 6157048 B2 JP6157048 B2 JP 6157048B2 JP 2011019951 A JP2011019951 A JP 2011019951A JP 2011019951 A JP2011019951 A JP 2011019951A JP 6157048 B2 JP6157048 B2 JP 6157048B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- conductive
- layer
- power supply
- conductive contact
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/66—Structural association with built-in electrical component
- H01R13/6608—Structural association with built-in electrical component with built-in single component
- H01R13/6625—Structural association with built-in electrical component with built-in single component with capacitive component
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0441—Details
- G01R1/045—Sockets or component fixtures for RF or HF testing
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0483—Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
- G01R1/07371—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate card or back card with apertures through which the probes pass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/64—Impedance arrangements
- H01L23/66—High-frequency adaptations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Connecting Device With Holders (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Description
基材は、上記第1面と、上記第2面と、上記複数の貫通孔を有する。誘電体層は、複数の貫通孔と交差した状態で基材の第1面及び第2面の間に設けられており、該基材よりも高い誘電率を有する。第1及び第2導電層は、基材の第1面から第2面に向かう方向に沿って、誘電体層を挟んでいる。
Claims (3)
- 第1面と、該第1面に対向する第2面と、それぞれが該第1面と該第2面を連絡するとともにその内面に導電材料が設けられた複数の貫通孔と、を有する基板と、
それぞれの一部が前記複数の貫通孔のうちいずれかに挿入された複数の導電性コンタクトピンと、を備えたICデバイス用ソケットであって、
前記基板は、
前記第1面と、前記第2面と、前記複数の貫通孔と、を有する基材と、
前記複数の貫通孔と交差した状態で前記基材の第1面及び第2面の間に設けられた、柔軟性のあるシートからなる誘電体層であって、該基材よりも高い誘電率を有する誘電体層と、
前記基材の第1面から第2面に向かう方向に沿って、前記誘電体層を挟む第1及び第2導電体層と、を備え、
前記複数の導電性コンタクトピンは、
それぞれの一部が前記複数の貫通孔のうちいずれかに挿入され、該一部が対応する導電材料に接触された複数の第1導電性コンタクトピンと、
それぞれの一部が前記複数の貫通孔のうち、前記複数の第1導電性コンタクトピンが挿入された貫通孔以外の貫通孔のいずれかに挿入され、該一部が対応する導電材料に非接触となっているか、又は、該対応する導電材料が前記第1及び第2導電層に非接触となっている複数の第2導電性コンタクトピンと、を含み、
前記第1導電層は、対応する導電材料を介して前記複数の第1導電性コンタクトピンのうち少なくともいずれかに電気的に接続される一方、前記第2導電層は、対応する導電材料を介して前記複数の第1導電性コンタクトピンのうち、前記第1導電層に接続されたコンタクトピン以外のコンタクトピンのいずれかに電気的に接続されており、
前記第1及び第2導電体層のうち少なくともいずれかの、その最外周によって規定される面積は、前記第1面の最外周によって規定される面積よりも小さく、前記第1導電層及び前記第2導電層の少なくとも一方は、前記第1面から前記第2面に向かう方向から見て、前記複数の導電性コンタクトピンが配置される領域の一部のみと重複する、ICデバイス用ソケット。 - 前記第1及び第2導電体層のうち少なくともいずれかの最外周は、前記第1面の最外周よりも25μm以上内側に位置することを特徴とする請求項1記載のICデバイス用ソケット。
- 前記基板を支持するガイドボディであって、検査すべきICデバイスを前記基板上の所定位置に配置するためのガイド部と、前記ICデバイスを検査する検査装置の所定位置に当該ICデバイス用ソケットを配置するための位置決め部とを有するガイドボディを更に備えたことを特徴とする請求項1記載のICデバイス用ソケット。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011019951A JP6157048B2 (ja) | 2011-02-01 | 2011-02-01 | Icデバイス用ソケット |
PCT/US2012/021504 WO2012106103A1 (en) | 2011-02-01 | 2012-01-17 | Socket for ic device |
TW101103129A TWI545860B (zh) | 2011-02-01 | 2012-01-31 | 用於積體電路裝置之插座 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011019951A JP6157048B2 (ja) | 2011-02-01 | 2011-02-01 | Icデバイス用ソケット |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015180989A Division JP2016026295A (ja) | 2015-09-14 | 2015-09-14 | Icデバイス用ソケット |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2012159425A JP2012159425A (ja) | 2012-08-23 |
JP2012159425A5 JP2012159425A5 (ja) | 2014-03-20 |
JP6157048B2 true JP6157048B2 (ja) | 2017-07-05 |
Family
ID=45554867
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011019951A Expired - Fee Related JP6157048B2 (ja) | 2011-02-01 | 2011-02-01 | Icデバイス用ソケット |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP6157048B2 (ja) |
TW (1) | TWI545860B (ja) |
WO (1) | WO2012106103A1 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105137132B (zh) * | 2015-09-28 | 2018-05-15 | 国网浙江省电力公司丽水供电公司 | 高压电容器外保护用熔断器监测支架及在线监视方法 |
US20180184517A1 (en) * | 2016-12-22 | 2018-06-28 | Google Llc | Multi-layer ic socket with an integrated impedance matching network |
US20200003802A1 (en) * | 2018-07-02 | 2020-01-02 | Powertech Technology Inc. | Testing socket and testing apparatus |
JP7452317B2 (ja) * | 2020-08-05 | 2024-03-19 | オムロン株式会社 | ソケット、ソケットユニット、検査治具および検査治具ユニット |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06297634A (ja) * | 1993-04-19 | 1994-10-25 | Toshiba Chem Corp | 銅張積層板及び多層銅張積層板 |
JPH1141812A (ja) * | 1997-07-23 | 1999-02-12 | Hitachi Ltd | 電力系統用自励式変換器の制御装置 |
JP3792445B2 (ja) * | 1999-03-30 | 2006-07-05 | 日本特殊陶業株式会社 | コンデンサ付属配線基板 |
US6558181B2 (en) * | 2000-12-29 | 2003-05-06 | Intel Corporation | System and method for package socket with embedded power and ground planes |
US7023685B2 (en) * | 2002-10-30 | 2006-04-04 | Matsushita Electric Industrial Co., Ltd. | Sheet capacitor, IC socket using the same, and manufacturing method of sheet capacitor |
JPWO2004068922A1 (ja) * | 2003-01-31 | 2006-05-25 | 富士通株式会社 | 多層プリント基板、電子機器、および実装方法 |
JP4259928B2 (ja) | 2003-06-11 | 2009-04-30 | 株式会社リコー | 移送物体検出装置,原稿読取装置および画像形成装置 |
JP2005310814A (ja) * | 2004-04-16 | 2005-11-04 | Alps Electric Co Ltd | キャパシタ内蔵基板 |
JP2006165289A (ja) * | 2004-12-08 | 2006-06-22 | Alps Electric Co Ltd | 中継基板 |
US7438581B1 (en) * | 2005-05-16 | 2008-10-21 | Myoungsoo Jeon | Socket having printed circuit board body portion |
US7663387B2 (en) * | 2007-09-27 | 2010-02-16 | Yokowo Co., Ltd. | Test socket |
JP4659087B2 (ja) * | 2008-12-17 | 2011-03-30 | パナソニック株式会社 | 差動平衡信号伝送基板 |
-
2011
- 2011-02-01 JP JP2011019951A patent/JP6157048B2/ja not_active Expired - Fee Related
-
2012
- 2012-01-17 WO PCT/US2012/021504 patent/WO2012106103A1/en active Application Filing
- 2012-01-31 TW TW101103129A patent/TWI545860B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
TWI545860B (zh) | 2016-08-11 |
JP2012159425A (ja) | 2012-08-23 |
WO2012106103A1 (en) | 2012-08-09 |
TW201246728A (en) | 2012-11-16 |
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