TWI541128B - 積層體及帶有波長變換層的發光二極體的製造方法 - Google Patents
積層體及帶有波長變換層的發光二極體的製造方法 Download PDFInfo
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- TWI541128B TWI541128B TW101146944A TW101146944A TWI541128B TW I541128 B TWI541128 B TW I541128B TW 101146944 A TW101146944 A TW 101146944A TW 101146944 A TW101146944 A TW 101146944A TW I541128 B TWI541128 B TW I541128B
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- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/80—Siloxanes having aromatic substituents, e.g. phenyl side groups
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
- C08J7/0427—Coating with only one layer of a composition containing a polymer binder
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
- C08J7/043—Improving the adhesiveness of the coatings per se, e.g. forming primers
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/20—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes for coatings strippable as coherent films, e.g. temporary coatings strippable as coherent films
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/61—Additives non-macromolecular inorganic
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2381/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur with or without nitrogen, oxygen, or carbon only; Polysulfones; Derivatives of such polymers
- C08J2381/04—Polysulfides
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2483/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
- C08J2483/04—Polysiloxanes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
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- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
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- Polymers & Plastics (AREA)
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- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Inorganic Chemistry (AREA)
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- Computer Hardware Design (AREA)
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- Led Device Packages (AREA)
- Laminated Bodies (AREA)
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JP2011271879 | 2011-12-13 |
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CN (1) | CN104010813B (ja) |
MY (1) | MY167573A (ja) |
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WO (1) | WO2013089075A1 (ja) |
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JP2015119172A (ja) * | 2013-11-13 | 2015-06-25 | 株式会社日本セラテック | 発光素子、発光装置、及びそれらの製造方法 |
JP6481154B2 (ja) * | 2014-10-18 | 2019-03-13 | エムテックスマート株式会社 | 粉粒体の塗布方法 |
WO2018235447A1 (ja) * | 2017-06-21 | 2018-12-27 | 積水ポリマテック株式会社 | 複合成形体 |
TWI848915B (zh) * | 2017-07-28 | 2024-07-21 | 日商杜邦東麗特殊材料股份有限公司 | 光學構件用樹脂薄片、具備其之光學構件、積層體或發光元件以及光學構件用樹脂薄片之製造方法 |
US10879431B2 (en) * | 2017-12-22 | 2020-12-29 | Lumileds Llc | Wavelength converting layer patterning for LED arrays |
US10590339B2 (en) * | 2018-05-16 | 2020-03-17 | Osram Opto Semiconductors Gmbh | Method for producing a converter element, converter element and light emitting device |
KR102038228B1 (ko) * | 2018-07-31 | 2019-10-29 | 도레이첨단소재 주식회사 | 색변환 시트 및 이를 포함하는 백라이트 유닛 |
JP2020029525A (ja) * | 2018-08-23 | 2020-02-27 | 株式会社オリジン | 塗料組成物、塗装品及び塗装品の製造方法 |
US20230104278A1 (en) * | 2020-03-24 | 2023-04-06 | Denka Company Limited | Phosphor particle, composite, light- emitting device, and self-light-emitting display |
CN116075562A (zh) * | 2020-08-07 | 2023-05-05 | 电化株式会社 | 荧光体涂料、涂膜、荧光体基板和照明装置 |
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JP4946022B2 (ja) * | 2005-12-06 | 2012-06-06 | 東レ株式会社 | ポリフェニレンサルファイド複合フィルム |
KR101228745B1 (ko) * | 2008-05-28 | 2013-01-31 | 가부시끼가이샤 구레하 | 폴리페닐렌술피드 수지제 이형 필름 및 적층체 |
JP5287935B2 (ja) * | 2011-06-16 | 2013-09-11 | 東レ株式会社 | 蛍光体含有シート、それを用いたled発光装置およびその製造方法 |
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TW201323211A (zh) | 2013-06-16 |
JPWO2013089075A1 (ja) | 2015-04-27 |
MY167573A (en) | 2018-09-20 |
WO2013089075A1 (ja) | 2013-06-20 |
JP5488761B2 (ja) | 2014-05-14 |
CN104010813B (zh) | 2016-08-24 |
CN104010813A (zh) | 2014-08-27 |
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