TWI541128B - 積層體及帶有波長變換層的發光二極體的製造方法 - Google Patents

積層體及帶有波長變換層的發光二極體的製造方法 Download PDF

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TWI541128B
TWI541128B TW101146944A TW101146944A TWI541128B TW I541128 B TWI541128 B TW I541128B TW 101146944 A TW101146944 A TW 101146944A TW 101146944 A TW101146944 A TW 101146944A TW I541128 B TWI541128 B TW I541128B
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phosphor
phosphor sheet
resin
sheet
fluorenone
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TW101146944A
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Chinese (zh)
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TW201323211A (zh
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松村宣夫
井上武治郎
定国広宣
石田豊
川本一成
関口広樹
吉岡正裕
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東麗股份有限公司
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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04Polysiloxanes
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/80Siloxanes having aromatic substituents, e.g. phenyl side groups
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04Coating
    • C08J7/0427Coating with only one layer of a composition containing a polymer binder
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04Coating
    • C08J7/043Improving the adhesiveness of the coatings per se, e.g. forming primers
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/20Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes for coatings strippable as coherent films, e.g. temporary coatings strippable as coherent films
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40Additives
    • C09D7/60Additives non-macromolecular
    • C09D7/61Additives non-macromolecular inorganic
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50Wavelength conversion elements
    • H01L33/501Wavelength conversion elements characterised by the materials, e.g. binder
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2381/00Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur with or without nitrogen, oxygen, or carbon only; Polysulfones; Derivatives of such polymers
    • C08J2381/04Polysulfides
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2483/00Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
    • C08J2483/04Polysiloxanes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008Processes
    • H01L2933/0033Processes relating to semiconductor body packages
    • H01L2933/0041Processes relating to semiconductor body packages relating to wavelength conversion elements

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Materials Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inorganic Chemistry (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Led Device Packages (AREA)
  • Laminated Bodies (AREA)
TW101146944A 2011-12-13 2012-12-12 積層體及帶有波長變換層的發光二極體的製造方法 TWI541128B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011271879 2011-12-13

Publications (2)

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TW201323211A TW201323211A (zh) 2013-06-16
TWI541128B true TWI541128B (zh) 2016-07-11

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TW101146944A TWI541128B (zh) 2011-12-13 2012-12-12 積層體及帶有波長變換層的發光二極體的製造方法

Country Status (5)

Country Link
JP (1) JP5488761B2 (ja)
CN (1) CN104010813B (ja)
MY (1) MY167573A (ja)
TW (1) TWI541128B (ja)
WO (1) WO2013089075A1 (ja)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015119172A (ja) * 2013-11-13 2015-06-25 株式会社日本セラテック 発光素子、発光装置、及びそれらの製造方法
JP6481154B2 (ja) * 2014-10-18 2019-03-13 エムテックスマート株式会社 粉粒体の塗布方法
WO2018235447A1 (ja) * 2017-06-21 2018-12-27 積水ポリマテック株式会社 複合成形体
TWI848915B (zh) * 2017-07-28 2024-07-21 日商杜邦東麗特殊材料股份有限公司 光學構件用樹脂薄片、具備其之光學構件、積層體或發光元件以及光學構件用樹脂薄片之製造方法
US10879431B2 (en) * 2017-12-22 2020-12-29 Lumileds Llc Wavelength converting layer patterning for LED arrays
US10590339B2 (en) * 2018-05-16 2020-03-17 Osram Opto Semiconductors Gmbh Method for producing a converter element, converter element and light emitting device
KR102038228B1 (ko) * 2018-07-31 2019-10-29 도레이첨단소재 주식회사 색변환 시트 및 이를 포함하는 백라이트 유닛
JP2020029525A (ja) * 2018-08-23 2020-02-27 株式会社オリジン 塗料組成物、塗装品及び塗装品の製造方法
US20230104278A1 (en) * 2020-03-24 2023-04-06 Denka Company Limited Phosphor particle, composite, light- emitting device, and self-light-emitting display
CN116075562A (zh) * 2020-08-07 2023-05-05 电化株式会社 荧光体涂料、涂膜、荧光体基板和照明装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3085484B2 (ja) * 1992-04-10 2000-09-11 東レ株式会社 離型フィルム
JP2003001777A (ja) * 2001-06-27 2003-01-08 Toray Ind Inc 離型用積層フィルム
JP4946022B2 (ja) * 2005-12-06 2012-06-06 東レ株式会社 ポリフェニレンサルファイド複合フィルム
KR101228745B1 (ko) * 2008-05-28 2013-01-31 가부시끼가이샤 구레하 폴리페닐렌술피드 수지제 이형 필름 및 적층체
JP5287935B2 (ja) * 2011-06-16 2013-09-11 東レ株式会社 蛍光体含有シート、それを用いたled発光装置およびその製造方法

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Publication number Publication date
TW201323211A (zh) 2013-06-16
JPWO2013089075A1 (ja) 2015-04-27
MY167573A (en) 2018-09-20
WO2013089075A1 (ja) 2013-06-20
JP5488761B2 (ja) 2014-05-14
CN104010813B (zh) 2016-08-24
CN104010813A (zh) 2014-08-27

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