TWI539191B - 光學插入物 - Google Patents
光學插入物 Download PDFInfo
- Publication number
- TWI539191B TWI539191B TW101150996A TW101150996A TWI539191B TW I539191 B TWI539191 B TW I539191B TW 101150996 A TW101150996 A TW 101150996A TW 101150996 A TW101150996 A TW 101150996A TW I539191 B TWI539191 B TW I539191B
- Authority
- TW
- Taiwan
- Prior art keywords
- cavity
- fiber optic
- insert
- sidewall
- optical insert
- Prior art date
Links
- 230000003287 optical effect Effects 0.000 title claims description 115
- 239000000835 fiber Substances 0.000 claims description 97
- 239000000758 substrate Substances 0.000 claims description 85
- 125000006850 spacer group Chemical group 0.000 claims description 83
- 238000000034 method Methods 0.000 claims description 53
- 239000000463 material Substances 0.000 claims description 46
- 229910052751 metal Inorganic materials 0.000 claims description 37
- 239000002184 metal Substances 0.000 claims description 37
- 229910052732 germanium Inorganic materials 0.000 claims description 30
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 claims description 30
- 239000013078 crystal Substances 0.000 claims description 16
- 238000005530 etching Methods 0.000 claims description 16
- 238000000059 patterning Methods 0.000 claims description 11
- 230000008878 coupling Effects 0.000 claims description 8
- 238000010168 coupling process Methods 0.000 claims description 8
- 238000005859 coupling reaction Methods 0.000 claims description 8
- 229910000679 solder Inorganic materials 0.000 claims description 8
- 230000005693 optoelectronics Effects 0.000 claims description 7
- 230000008859 change Effects 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 claims description 6
- 238000006243 chemical reaction Methods 0.000 claims description 3
- 238000001039 wet etching Methods 0.000 claims description 3
- 238000002310 reflectometry Methods 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 133
- 235000012431 wafers Nutrition 0.000 description 49
- 239000013307 optical fiber Substances 0.000 description 25
- 238000004519 manufacturing process Methods 0.000 description 21
- 239000012212 insulator Substances 0.000 description 17
- 229920002120 photoresistant polymer Polymers 0.000 description 17
- 238000002161 passivation Methods 0.000 description 16
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 14
- 229910052802 copper Inorganic materials 0.000 description 14
- 239000010949 copper Substances 0.000 description 14
- 238000000151 deposition Methods 0.000 description 9
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 9
- 229920005591 polysilicon Polymers 0.000 description 9
- 230000008021 deposition Effects 0.000 description 7
- 238000005520 cutting process Methods 0.000 description 6
- 238000012545 processing Methods 0.000 description 6
- 230000003647 oxidation Effects 0.000 description 5
- 238000007254 oxidation reaction Methods 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 239000011241 protective layer Substances 0.000 description 5
- 239000004642 Polyimide Substances 0.000 description 4
- YBMRDBCBODYGJE-UHFFFAOYSA-N germanium dioxide Chemical compound O=[Ge]=O YBMRDBCBODYGJE-UHFFFAOYSA-N 0.000 description 4
- 229920001721 polyimide Polymers 0.000 description 4
- 229910052715 tantalum Inorganic materials 0.000 description 4
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 4
- 229910000420 cerium oxide Inorganic materials 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 238000003780 insertion Methods 0.000 description 3
- 230000037431 insertion Effects 0.000 description 3
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 3
- 238000004806 packaging method and process Methods 0.000 description 3
- 230000008646 thermal stress Effects 0.000 description 3
- 229910000906 Bronze Inorganic materials 0.000 description 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000010974 bronze Substances 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 2
- 238000000708 deep reactive-ion etching Methods 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 229940119177 germanium dioxide Drugs 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- BPUBBGLMJRNUCC-UHFFFAOYSA-N oxygen(2-);tantalum(5+) Chemical group [O-2].[O-2].[O-2].[O-2].[O-2].[Ta+5].[Ta+5] BPUBBGLMJRNUCC-UHFFFAOYSA-N 0.000 description 2
- 238000005240 physical vapour deposition Methods 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- WOCIAKWEIIZHES-UHFFFAOYSA-N ruthenium(iv) oxide Chemical compound O=[Ru]=O WOCIAKWEIIZHES-UHFFFAOYSA-N 0.000 description 2
- 230000008054 signal transmission Effects 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 230000035882 stress Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 description 2
- RUDFQVOCFDJEEF-UHFFFAOYSA-N yttrium(III) oxide Inorganic materials [O-2].[O-2].[O-2].[Y+3].[Y+3] RUDFQVOCFDJEEF-UHFFFAOYSA-N 0.000 description 2
- 238000009623 Bosch process Methods 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- CETPSERCERDGAM-UHFFFAOYSA-N ceric oxide Chemical compound O=[Ce]=O CETPSERCERDGAM-UHFFFAOYSA-N 0.000 description 1
- 229910000422 cerium(IV) oxide Inorganic materials 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 230000005670 electromagnetic radiation Effects 0.000 description 1
- 230000009970 fire resistant effect Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000007521 mechanical polishing technique Methods 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 229910000480 nickel oxide Inorganic materials 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 229910001936 tantalum oxide Inorganic materials 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/36—Mechanical coupling means
- G02B6/3628—Mechanical coupling means for mounting fibres to supporting carriers
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/36—Mechanical coupling means
- G02B6/3628—Mechanical coupling means for mounting fibres to supporting carriers
- G02B6/3684—Mechanical coupling means for mounting fibres to supporting carriers characterised by the manufacturing process of surface profiling of the supporting carrier
- G02B6/3692—Mechanical coupling means for mounting fibres to supporting carriers characterised by the manufacturing process of surface profiling of the supporting carrier with surface micromachining involving etching, e.g. wet or dry etching steps
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4249—Packages, e.g. shape, construction, internal or external details comprising arrays of active devices and fibres
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/36—Mechanical coupling means
- G02B6/3628—Mechanical coupling means for mounting fibres to supporting carriers
- G02B6/3632—Mechanical coupling means for mounting fibres to supporting carriers characterised by the cross-sectional shape of the mechanical coupling means
- G02B6/3636—Mechanical coupling means for mounting fibres to supporting carriers characterised by the cross-sectional shape of the mechanical coupling means the mechanical coupling means being grooves
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/36—Mechanical coupling means
- G02B6/3628—Mechanical coupling means for mounting fibres to supporting carriers
- G02B6/3648—Supporting carriers of a microbench type, i.e. with micromachined additional mechanical structures
- G02B6/3652—Supporting carriers of a microbench type, i.e. with micromachined additional mechanical structures the additional structures being prepositioning mounting areas, allowing only movement in one dimension, e.g. grooves, trenches or vias in the microbench surface, i.e. self aligning supporting carriers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Optical Couplings Of Light Guides (AREA)
- Micromachines (AREA)
- Weting (AREA)
- Optical Integrated Circuits (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201261585217P | 2012-01-10 | 2012-01-10 | |
| US13/362,898 US8757897B2 (en) | 2012-01-10 | 2012-01-31 | Optical interposer |
| US13/454,713 US9323010B2 (en) | 2012-01-10 | 2012-04-24 | Structures formed using monocrystalline silicon and/or other materials for optical and other applications |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201333562A TW201333562A (zh) | 2013-08-16 |
| TWI539191B true TWI539191B (zh) | 2016-06-21 |
Family
ID=48743988
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW101150996A TWI539191B (zh) | 2012-01-10 | 2012-12-28 | 光學插入物 |
| TW101150997A TWI553368B (zh) | 2012-01-10 | 2012-12-28 | 包含具單晶矽之區域之基板的結構及用以製造基板及結構之方法 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW101150997A TWI553368B (zh) | 2012-01-10 | 2012-12-28 | 包含具單晶矽之區域之基板的結構及用以製造基板及結構之方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US9323010B2 (enExample) |
| EP (2) | EP2802915B1 (enExample) |
| JP (1) | JP5970081B2 (enExample) |
| KR (2) | KR101955060B1 (enExample) |
| CN (2) | CN104364688B (enExample) |
| TW (2) | TWI539191B (enExample) |
| WO (2) | WO2013106285A2 (enExample) |
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| US9529162B2 (en) * | 2012-10-09 | 2016-12-27 | Corning Optical Communications LLC | Optical fiber connectors and methods of forming optical fiber connectors |
| US9484211B2 (en) | 2013-01-24 | 2016-11-01 | Taiwan Semiconductor Manufacturing Company, Ltd. | Etchant and etching process |
| DE102013224607B4 (de) | 2013-11-29 | 2024-06-06 | Robert Bosch Gmbh | Mikro-elektromechanische Anordnung und Verfahren zum Aufbau einer mikro-elektromechanischen Anordnung |
| WO2015094377A1 (en) | 2013-12-20 | 2015-06-25 | Intel Corporation | Photodetector with tapered waveguide structure |
| CN104752192B (zh) * | 2013-12-31 | 2017-11-14 | 中芯国际集成电路制造(上海)有限公司 | 一种在半导体衬底表面制作斜面的方法 |
| US9395491B2 (en) | 2014-02-05 | 2016-07-19 | Aurrion, Inc. | Shielding regions for photonic integrated circuits |
| CN103941577A (zh) * | 2014-04-10 | 2014-07-23 | 中国电子科技集团公司第三十八研究所 | 具有双反射镜和凹槽形结构的原子气体腔器件及其制造方法 |
| CN103941576A (zh) * | 2014-04-10 | 2014-07-23 | 中国电子科技集团公司第三十八研究所 | 基于mems技术的原子气体腔器件及其制造方法 |
| CN103955129A (zh) * | 2014-04-10 | 2014-07-30 | 中国电子科技集团公司第三十八研究所 | 具有双反射镜的微型原子气体腔器件及其制造方法 |
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| CN104465855B (zh) * | 2014-11-24 | 2017-02-22 | 华天科技（昆山）电子有限公司 | 晶圆级光互连模块及制作方法 |
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| CN104966670A (zh) * | 2015-06-25 | 2015-10-07 | 中国工程物理研究院电子工程研究所 | 一种单晶硅刻蚀方法及刻蚀液 |
| JP6217706B2 (ja) | 2015-07-29 | 2017-10-25 | 日亜化学工業株式会社 | 光学部材の製造方法、半導体レーザ装置の製造方法及び半導体レーザ装置 |
| JP6354704B2 (ja) | 2015-08-25 | 2018-07-11 | 日亜化学工業株式会社 | 光学部材の製造方法、半導体レーザ装置の製造方法及び半導体レーザ装置 |
| CN105336795B (zh) * | 2015-08-26 | 2017-03-22 | 中国科学院微电子研究所 | 一种基于光栅接口的光子芯片封装结构及其制作方法 |
| CN105321929B (zh) * | 2015-08-26 | 2018-05-08 | 中国科学院微电子研究所 | 一种三维光电集成结构及其制作方法 |
| CN108136440B (zh) * | 2015-09-03 | 2021-06-15 | 皇家飞利浦有限公司 | Ic管芯、探头和超声系统 |
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-
2012
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- 2012-12-28 TW TW101150996A patent/TWI539191B/zh not_active IP Right Cessation
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- 2013-01-07 EP EP13700811.6A patent/EP2802915B1/en active Active
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- 2013-01-07 CN CN201380013246.6A patent/CN104364688B/zh active Active
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- 2013-01-07 CN CN201380013259.3A patent/CN104169768B/zh active Active
- 2013-01-07 KR KR1020147022313A patent/KR101955060B1/ko active Active
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Also Published As
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|---|---|
| TW201333567A (zh) | 2013-08-16 |
| WO2013106285A3 (en) | 2013-09-26 |
| EP2802915A1 (en) | 2014-11-19 |
| CN104364688B (zh) | 2016-08-24 |
| KR101870490B1 (ko) | 2018-06-22 |
| CN104169768A (zh) | 2014-11-26 |
| US20130177274A1 (en) | 2013-07-11 |
| KR20140112069A (ko) | 2014-09-22 |
| JP2015515113A (ja) | 2015-05-21 |
| EP2802916A2 (en) | 2014-11-19 |
| WO2013106285A2 (en) | 2013-07-18 |
| JP5970081B2 (ja) | 2016-08-17 |
| EP2802916B1 (en) | 2020-03-11 |
| TW201333562A (zh) | 2013-08-16 |
| EP2802915B1 (en) | 2017-04-12 |
| KR101955060B1 (ko) | 2019-03-06 |
| CN104364688A (zh) | 2015-02-18 |
| TWI553368B (zh) | 2016-10-11 |
| US9323010B2 (en) | 2016-04-26 |
| CN104169768B (zh) | 2016-03-02 |
| WO2013106288A1 (en) | 2013-07-18 |
| KR20140112068A (ko) | 2014-09-22 |
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