TWI533775B - 具有訂製層之佈線基材 - Google Patents

具有訂製層之佈線基材 Download PDF

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Publication number
TWI533775B
TWI533775B TW100107534A TW100107534A TWI533775B TW I533775 B TWI533775 B TW I533775B TW 100107534 A TW100107534 A TW 100107534A TW 100107534 A TW100107534 A TW 100107534A TW I533775 B TWI533775 B TW I533775B
Authority
TW
Taiwan
Prior art keywords
layer
insulating material
wiring substrate
lines
line
Prior art date
Application number
TW100107534A
Other languages
English (en)
Chinese (zh)
Other versions
TW201206285A (en
Inventor
班哲明Ｎ 艾瑞吉
蓋頓Ｌ 馬修
Original Assignee
佛姆費克特股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 佛姆費克特股份有限公司 filed Critical 佛姆費克特股份有限公司
Publication of TW201206285A publication Critical patent/TW201206285A/zh
Application granted granted Critical
Publication of TWI533775B publication Critical patent/TWI533775B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4647—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits by applying an insulating layer around previously made via studs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/049—Wire bonding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • H05K3/4015—Surface contacts, e.g. bumps using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4046—Through-connections; Vertical interconnect access [VIA] connections using auxiliary conductive elements, e.g. metallic spheres, eyelets, pieces of wire
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
TW100107534A 2010-03-08 2011-03-07 具有訂製層之佈線基材 TWI533775B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US12/719,136 US8476538B2 (en) 2010-03-08 2010-03-08 Wiring substrate with customization layers

Publications (2)

Publication Number Publication Date
TW201206285A TW201206285A (en) 2012-02-01
TWI533775B true TWI533775B (zh) 2016-05-11

Family

ID=44530323

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100107534A TWI533775B (zh) 2010-03-08 2011-03-07 具有訂製層之佈線基材

Country Status (5)

Country Link
US (1) US8476538B2 (enExample)
JP (1) JP6087630B2 (enExample)
KR (1) KR101851269B1 (enExample)
TW (1) TWI533775B (enExample)
WO (1) WO2011112409A2 (enExample)

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TW201347124A (zh) * 2012-05-07 2013-11-16 矽品精密工業股份有限公司 半導體封裝件及其製法
JP2014216123A (ja) * 2013-04-24 2014-11-17 タイコエレクトロニクスジャパン合同会社 電気コネクタ組立体及びその実装構造
US9431759B2 (en) 2014-10-20 2016-08-30 HGST Netherlands B.V. Feedthrough connector for hermetically sealed electronic devices
US10650181B2 (en) * 2017-09-21 2020-05-12 Nokia Solutions And Networks Oy Spatial location of vias in a printed circuit board
CN111566806B (zh) * 2018-01-24 2024-04-30 京瓷株式会社 布线基板、电子装置以及电子模块
US10790307B2 (en) 2018-11-27 2020-09-29 Qorvo Us, Inc. Switch branch structure
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CN115248339A (zh) * 2021-04-27 2022-10-28 旺矽科技股份有限公司 用于探针卡的探针安装电路板及探针装置

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Also Published As

Publication number Publication date
KR20130037203A (ko) 2013-04-15
JP2013522874A (ja) 2013-06-13
TW201206285A (en) 2012-02-01
KR101851269B1 (ko) 2018-04-23
WO2011112409A2 (en) 2011-09-15
US8476538B2 (en) 2013-07-02
US20110214910A1 (en) 2011-09-08
WO2011112409A3 (en) 2012-01-19
JP6087630B2 (ja) 2017-03-01

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MM4A Annulment or lapse of patent due to non-payment of fees