TWI532202B - 半導體裝置和其製造方法 - Google Patents
半導體裝置和其製造方法 Download PDFInfo
- Publication number
- TWI532202B TWI532202B TW099127957A TW99127957A TWI532202B TW I532202 B TWI532202 B TW I532202B TW 099127957 A TW099127957 A TW 099127957A TW 99127957 A TW99127957 A TW 99127957A TW I532202 B TWI532202 B TW I532202B
- Authority
- TW
- Taiwan
- Prior art keywords
- single crystal
- layer
- region
- crystal semiconductor
- substrate
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F10/00—Individual photovoltaic cells, e.g. solar cells
- H10F10/10—Individual photovoltaic cells, e.g. solar cells having potential barriers
- H10F10/17—Photovoltaic cells having only PIN junction potential barriers
- H10F10/174—Photovoltaic cells having only PIN junction potential barriers comprising monocrystalline or polycrystalline materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F30/00—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors
- H10F30/20—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors
- H10F30/21—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors the devices being sensitive to infrared, visible or ultraviolet radiation
- H10F30/22—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors the devices being sensitive to infrared, visible or ultraviolet radiation the devices having only one potential barrier, e.g. photodiodes
- H10F30/221—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors the devices being sensitive to infrared, visible or ultraviolet radiation the devices having only one potential barrier, e.g. photodiodes the potential barrier being a PN homojunction
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F30/00—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors
- H10F30/20—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors
- H10F30/21—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors the devices being sensitive to infrared, visible or ultraviolet radiation
- H10F30/22—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors the devices being sensitive to infrared, visible or ultraviolet radiation the devices having only one potential barrier, e.g. photodiodes
- H10F30/223—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors the devices being sensitive to infrared, visible or ultraviolet radiation the devices having only one potential barrier, e.g. photodiodes the potential barrier being a PIN barrier
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/10—Integrated devices
- H10F39/12—Image sensors
- H10F39/18—Complementary metal-oxide-semiconductor [CMOS] image sensors; Photodiode array image sensors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F71/00—Manufacture or treatment of devices covered by this subclass
- H10F71/121—The active layers comprising only Group IV materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F71/00—Manufacture or treatment of devices covered by this subclass
- H10F71/128—Annealing
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F71/00—Manufacture or treatment of devices covered by this subclass
- H10F71/139—Manufacture or treatment of devices covered by this subclass using temporary substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/10—Semiconductor bodies
- H10F77/16—Material structures, e.g. crystalline structures, film structures or crystal plane orientations
- H10F77/169—Thin semiconductor films on metallic or insulating substrates
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/547—Monocrystalline silicon PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Thin Film Transistor (AREA)
- Recrystallisation Techniques (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Element Separation (AREA)
- Light Receiving Elements (AREA)
- Electroluminescent Light Sources (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009194223 | 2009-08-25 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201133909A TW201133909A (en) | 2011-10-01 |
| TWI532202B true TWI532202B (zh) | 2016-05-01 |
Family
ID=43623535
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW099127957A TWI532202B (zh) | 2009-08-25 | 2010-08-20 | 半導體裝置和其製造方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US8426231B2 (enExample) |
| JP (1) | JP2011071491A (enExample) |
| KR (1) | KR20120059509A (enExample) |
| TW (1) | TWI532202B (enExample) |
| WO (1) | WO2011024629A1 (enExample) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011129234A1 (ja) * | 2010-04-16 | 2011-10-20 | シャープ株式会社 | 半導体装置及びその製造方法 |
| KR20120081505A (ko) * | 2011-01-11 | 2012-07-19 | 삼성전자주식회사 | 이미지 센서 및 그 제조 방법 |
| JP5988291B2 (ja) * | 2012-06-13 | 2016-09-07 | ソニーセミコンダクタソリューションズ株式会社 | 撮像装置および撮像表示システム |
| JP6254827B2 (ja) * | 2013-11-11 | 2017-12-27 | 日本放送協会 | 積層型集積回路及びその製造方法 |
| JP6572640B2 (ja) * | 2015-06-24 | 2019-09-11 | 住友電気工業株式会社 | 半導体受光素子を作製する方法 |
| WO2026011183A1 (en) * | 2024-07-05 | 2026-01-08 | Government Of The United States Of America, As Represented By The Secretary Of Commerce | Semiconductor junction with lateral heterostructure |
Family Cites Families (34)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63134557U (enExample) * | 1987-02-24 | 1988-09-02 | ||
| JPH0758306A (ja) * | 1993-08-11 | 1995-03-03 | Nec Corp | 光センサ素子 |
| JP3655025B2 (ja) | 1996-09-04 | 2005-06-02 | 株式会社カネカ | 薄膜光電変換装置およびその製造方法 |
| JPH10284431A (ja) * | 1997-04-11 | 1998-10-23 | Sharp Corp | Soi基板の製造方法 |
| US6534380B1 (en) * | 1997-07-18 | 2003-03-18 | Denso Corporation | Semiconductor substrate and method of manufacturing the same |
| JP4044187B2 (ja) * | 1997-10-20 | 2008-02-06 | 株式会社半導体エネルギー研究所 | アクティブマトリクス型表示装置およびその作製方法 |
| JPH11340496A (ja) * | 1998-05-25 | 1999-12-10 | Nippon Telegr & Teleph Corp <Ntt> | pin型半導体受光素子 |
| US6274887B1 (en) * | 1998-11-02 | 2001-08-14 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method therefor |
| US6720577B2 (en) * | 2000-09-06 | 2004-04-13 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method of manufacturing the same |
| JP2002151702A (ja) * | 2000-11-15 | 2002-05-24 | Seiko Epson Corp | 半導体装置及びその製造方法並びに電子機器 |
| FR2894990B1 (fr) * | 2005-12-21 | 2008-02-22 | Soitec Silicon On Insulator | Procede de fabrication de substrats, notamment pour l'optique,l'electronique ou l'optoelectronique et substrat obtenu selon ledit procede |
| JP4271413B2 (ja) * | 2002-06-28 | 2009-06-03 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| CN1331347C (zh) * | 2002-07-12 | 2007-08-08 | 东芝松下显示技术有限公司 | 显示装置 |
| JP4289837B2 (ja) * | 2002-07-15 | 2009-07-01 | アプライド マテリアルズ インコーポレイテッド | イオン注入方法及びsoiウエハの製造方法 |
| US7115488B2 (en) * | 2003-08-29 | 2006-10-03 | Semiconductor Energy Laboratory Co., Ltd. | Method of manufacturing semiconductor device |
| US8529341B2 (en) * | 2004-07-27 | 2013-09-10 | Igt | Optically sensitive display for a gaming apparatus |
| TWI261140B (en) * | 2005-05-31 | 2006-09-01 | Au Optronics Corp | Display panels |
| US7863660B2 (en) * | 2005-05-31 | 2011-01-04 | Sharp Kabushiki Kaisha | Photodiode and display device |
| JP4542492B2 (ja) * | 2005-10-07 | 2010-09-15 | セイコーエプソン株式会社 | 電気光学装置及びその製造方法、電子機器、並びに半導体装置 |
| JP2007281316A (ja) * | 2006-04-11 | 2007-10-25 | Sumco Corp | Simoxウェーハの製造方法 |
| US8581260B2 (en) * | 2007-02-22 | 2013-11-12 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device including a memory |
| CN101281912B (zh) * | 2007-04-03 | 2013-01-23 | 株式会社半导体能源研究所 | Soi衬底及其制造方法以及半导体装置 |
| KR101440930B1 (ko) * | 2007-04-20 | 2014-09-15 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | Soi 기판의 제작방법 |
| KR101400699B1 (ko) * | 2007-05-18 | 2014-05-29 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 기판 및 반도체 장치 및 그 제조 방법 |
| JP4924224B2 (ja) * | 2007-06-13 | 2012-04-25 | セイコーエプソン株式会社 | 光検出器内蔵表示装置及び電子機器 |
| KR101484296B1 (ko) * | 2007-06-26 | 2015-01-19 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 기판의 제작방법 |
| US8049253B2 (en) * | 2007-07-11 | 2011-11-01 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
| WO2009014155A1 (en) | 2007-07-25 | 2009-01-29 | Semiconductor Energy Laboratory Co., Ltd. | Photoelectric conversion device and electronic device having the same |
| US8044464B2 (en) * | 2007-09-21 | 2011-10-25 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| US7982250B2 (en) * | 2007-09-21 | 2011-07-19 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| US7696058B2 (en) * | 2007-10-31 | 2010-04-13 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing SOI substrate |
| JP2009117455A (ja) * | 2007-11-02 | 2009-05-28 | Seiko Epson Corp | 半導体装置の製造方法、電気光学装置の製造方法、電子機器の製造方法、半導体装置、電気光学装置および電子機器 |
| JP4574667B2 (ja) * | 2007-11-30 | 2010-11-04 | Okiセミコンダクタ株式会社 | フォトダイオードの製造方法およびそれを用いて形成されたフォトダイオード |
| US8736587B2 (en) * | 2008-07-10 | 2014-05-27 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
-
2010
- 2010-08-02 KR KR1020127004336A patent/KR20120059509A/ko not_active Ceased
- 2010-08-02 WO PCT/JP2010/063436 patent/WO2011024629A1/en not_active Ceased
- 2010-08-17 US US12/857,820 patent/US8426231B2/en not_active Expired - Fee Related
- 2010-08-19 JP JP2010183920A patent/JP2011071491A/ja not_active Withdrawn
- 2010-08-20 TW TW099127957A patent/TWI532202B/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| US20110049588A1 (en) | 2011-03-03 |
| KR20120059509A (ko) | 2012-06-08 |
| TW201133909A (en) | 2011-10-01 |
| WO2011024629A1 (en) | 2011-03-03 |
| JP2011071491A (ja) | 2011-04-07 |
| US8426231B2 (en) | 2013-04-23 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |