TWI528427B - Plasma processing device and processing system - Google Patents

Plasma processing device and processing system Download PDF

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Publication number
TWI528427B
TWI528427B TW100143046A TW100143046A TWI528427B TW I528427 B TWI528427 B TW I528427B TW 100143046 A TW100143046 A TW 100143046A TW 100143046 A TW100143046 A TW 100143046A TW I528427 B TWI528427 B TW I528427B
Authority
TW
Taiwan
Prior art keywords
central portion
electrode
processing apparatus
lower electrode
processing chamber
Prior art date
Application number
TW100143046A
Other languages
English (en)
Chinese (zh)
Other versions
TW201234455A (en
Inventor
Seiji Tanaka
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW201234455A publication Critical patent/TW201234455A/zh
Application granted granted Critical
Publication of TWI528427B publication Critical patent/TWI528427B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
    • H01J37/32807—Construction (includes replacing parts of the apparatus)
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
    • H01J37/32899—Multiple chambers, e.g. cluster tools
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H01J37/32174—Circuits specially adapted for controlling the RF discharge
    • H01J37/32183—Matching circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32458—Vessel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32532—Electrodes
    • H01J37/32559—Protection means, e.g. coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32532—Electrodes
    • H01J37/32568—Relative arrangement or disposition of electrodes; moving means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32623—Mechanical discharge control means
    • H01J37/32651—Shields, e.g. dark space shields, Faraday shields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
    • H05H1/00—Generating plasma; Handling plasma
    • H05H1/24—Generating plasma
    • H05H1/46—Generating plasma using applied electromagnetic fields, e.g. high frequency or microwave energy
    • H05H1/4645—Radiofrequency discharges
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32532—Electrodes
    • H01J37/32577—Electrical connecting means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
    • H05H1/00—Generating plasma; Handling plasma
    • H05H1/24—Generating plasma
    • H05H1/46—Generating plasma using applied electromagnetic fields, e.g. high frequency or microwave energy

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Power Engineering (AREA)
  • Electromagnetism (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Plasma Technology (AREA)
  • Chemical Vapour Deposition (AREA)
  • Drying Of Semiconductors (AREA)
TW100143046A 2010-11-25 2011-11-24 Plasma processing device and processing system TWI528427B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010262857A JP5666888B2 (ja) 2010-11-25 2010-11-25 プラズマ処理装置及び処理システム

Publications (2)

Publication Number Publication Date
TW201234455A TW201234455A (en) 2012-08-16
TWI528427B true TWI528427B (zh) 2016-04-01

Family

ID=46092247

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100143046A TWI528427B (zh) 2010-11-25 2011-11-24 Plasma processing device and processing system

Country Status (4)

Country Link
JP (1) JP5666888B2 (ja)
KR (2) KR101351678B1 (ja)
CN (1) CN102479658B (ja)
TW (1) TWI528427B (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5947435B1 (ja) * 2015-08-27 2016-07-06 株式会社日立国際電気 基板処理装置、半導体装置の製造方法、プログラムおよび記録媒体

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0668839A (ja) * 1992-08-13 1994-03-11 Tokyo Electron Ltd プラズマ装置における高周波給電装置
JP3010443U (ja) * 1994-10-20 1995-05-02 株式会社プラズマシステム プラズマ処理装置
JP4450883B2 (ja) * 1999-03-30 2010-04-14 東京エレクトロン株式会社 プラズマ処理装置
JP4576011B2 (ja) * 1999-09-03 2010-11-04 株式会社アルバック プラズマ処理装置
JP2002329711A (ja) * 2001-05-01 2002-11-15 Matsushita Electric Ind Co Ltd 平行平板型電極プラズマ処理装置
JP2003100721A (ja) * 2001-09-27 2003-04-04 Matsushita Electric Ind Co Ltd プラズマ処理装置
JP4158726B2 (ja) * 2004-03-12 2008-10-01 富士電機ホールディングス株式会社 薄膜製造装置
JP4553247B2 (ja) * 2004-04-30 2010-09-29 東京エレクトロン株式会社 プラズマ処理装置
KR100710923B1 (ko) * 2004-06-02 2007-04-23 동경 엘렉트론 주식회사 플라즈마 처리장치 및 임피던스 조정방법
JP4623422B2 (ja) * 2005-03-17 2011-02-02 富士電機システムズ株式会社 プラズマ処理装置
JP2007220594A (ja) * 2006-02-20 2007-08-30 Nissin Electric Co Ltd プラズマ生成方法及びプラズマ生成装置並びにプラズマ処理装置
JP4788504B2 (ja) * 2006-07-12 2011-10-05 富士電機株式会社 プラズマ処理装置の給電構造
JP4826483B2 (ja) * 2007-01-19 2011-11-30 東京エレクトロン株式会社 プラズマ処理装置
JP2008235161A (ja) * 2007-03-23 2008-10-02 Sekisui Chem Co Ltd プラズマ処理装置
KR101362813B1 (ko) * 2007-08-08 2014-02-14 (주)소슬 플라즈마 처리 장치
JP4558067B2 (ja) * 2008-05-21 2010-10-06 シャープ株式会社 プラズマ処理装置

Also Published As

Publication number Publication date
CN102479658A (zh) 2012-05-30
KR101351678B1 (ko) 2014-01-14
TW201234455A (en) 2012-08-16
KR20120056787A (ko) 2012-06-04
KR20130018360A (ko) 2013-02-20
JP2012113998A (ja) 2012-06-14
CN102479658B (zh) 2014-06-25
JP5666888B2 (ja) 2015-02-12

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