TWI524960B - 基板及基板加工方法 - Google Patents

基板及基板加工方法 Download PDF

Info

Publication number
TWI524960B
TWI524960B TW102103674A TW102103674A TWI524960B TW I524960 B TWI524960 B TW I524960B TW 102103674 A TW102103674 A TW 102103674A TW 102103674 A TW102103674 A TW 102103674A TW I524960 B TWI524960 B TW I524960B
Authority
TW
Taiwan
Prior art keywords
substrate
laser light
light collecting
modified layer
single crystal
Prior art date
Application number
TW102103674A
Other languages
English (en)
Chinese (zh)
Other versions
TW201345640A (zh
Inventor
松尾利香
鈴木秀樹
國司洋介
池野順一
Original Assignee
信越聚合物股份有限公司
國立大學法人埼玉大學
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 信越聚合物股份有限公司, 國立大學法人埼玉大學 filed Critical 信越聚合物股份有限公司
Publication of TW201345640A publication Critical patent/TW201345640A/zh
Application granted granted Critical
Publication of TWI524960B publication Critical patent/TWI524960B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B23K26/0613—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams having a common axis
    • B23K26/0617—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams having a common axis and with spots spaced along the common axis
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0853—Devices involving movement of the workpiece in at least two axial directions, e.g. in a plane
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special environment or atmosphere, e.g. in an enclosure
    • B23K26/1224—Working by laser beam, e.g. welding, cutting or boring in a special environment or atmosphere, e.g. in an enclosure in vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/02—Elements
    • C30B29/06—Silicon
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B33/00—After-treatment of single crystals or homogeneous polycrystalline material with defined structure
    • C30B33/06—Joining of crystals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P34/00—Irradiation with electromagnetic or particle radiation of wafers, substrates or parts of devices
    • H10P34/40—Irradiation with electromagnetic or particle radiation of wafers, substrates or parts of devices with high-energy radiation
    • H10P34/42—Irradiation with electromagnetic or particle radiation of wafers, substrates or parts of devices with high-energy radiation with electromagnetic radiation, e.g. laser annealing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
    • H10D62/83—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge
    • H10D62/832—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge being Group IV materials comprising two or more elements, e.g. SiGe
    • H10D62/8325—Silicon carbide

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Plasma & Fusion (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Laser Beam Processing (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
TW102103674A 2012-02-01 2013-01-31 基板及基板加工方法 TWI524960B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012020067A JP6044919B2 (ja) 2012-02-01 2012-02-01 基板加工方法

Publications (2)

Publication Number Publication Date
TW201345640A TW201345640A (zh) 2013-11-16
TWI524960B true TWI524960B (zh) 2016-03-11

Family

ID=48905381

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102103674A TWI524960B (zh) 2012-02-01 2013-01-31 基板及基板加工方法

Country Status (3)

Country Link
JP (1) JP6044919B2 (https=)
TW (1) TWI524960B (https=)
WO (1) WO2013115353A1 (https=)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102015000449A1 (de) 2015-01-15 2016-07-21 Siltectra Gmbh Festkörperteilung mittels Stoffumwandlung
JP6298695B2 (ja) * 2014-04-16 2018-03-20 信越ポリマー株式会社 原盤製造方法及び原盤
JP6506520B2 (ja) * 2014-09-16 2019-04-24 株式会社ディスコ ＳｉＣのスライス方法
JP6482423B2 (ja) * 2015-07-16 2019-03-13 株式会社ディスコ ウエーハの生成方法
JP6562819B2 (ja) * 2015-11-12 2019-08-21 株式会社ディスコ ＳｉＣ基板の分離方法
EP4166270B1 (de) * 2016-03-22 2024-10-16 Siltectra GmbH Verfahren zum abtrennen durch laserbestrahlung einer festkörperschicht von einem festkörper
JP2018063407A (ja) * 2016-10-14 2018-04-19 株式会社ディスコ 貼り合わせ基板の加工方法
WO2018108938A1 (de) 2016-12-12 2018-06-21 Siltectra Gmbh Verfahren zum dünnen von mit bauteilen versehenen festkörperschichten
JP6887641B2 (ja) * 2017-03-30 2021-06-16 国立大学法人埼玉大学 ガラススライシング方法
JP6923877B2 (ja) 2017-04-26 2021-08-25 国立大学法人埼玉大学 基板製造方法
JP6943388B2 (ja) * 2017-10-06 2021-09-29 国立大学法人埼玉大学 基板製造方法
JP7121941B2 (ja) 2018-03-09 2022-08-19 国立大学法人埼玉大学 基板製造方法
JP7417411B2 (ja) * 2019-02-13 2024-01-18 株式会社ディスコ 確認方法
US12525453B2 (en) 2019-04-19 2026-01-13 Tokyo Electron Limited Processing apparatus and processing method
TWI857095B (zh) 2019-07-18 2024-10-01 日商東京威力科創股份有限公司 處理裝置及處理方法
TWI860382B (zh) 2019-07-18 2024-11-01 日商東京威力科創股份有限公司 處理裝置及處理方法
TWI877184B (zh) 2019-07-18 2025-03-21 日商東京威力科創股份有限公司 處理裝置及處理方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20000073768A (ko) * 1999-05-14 2000-12-05 황인길 반도체 웨이퍼 제조 공정에서의 실리콘 잉고트 레이저 빔 절삭방법
JP4954653B2 (ja) * 2006-09-19 2012-06-20 浜松ホトニクス株式会社 レーザ加工方法
JP2009200383A (ja) * 2008-02-25 2009-09-03 Seiko Epson Corp 基板分割方法、及び表示装置の製造方法
JP5456382B2 (ja) * 2009-06-17 2014-03-26 信越ポリマー株式会社 半導体ウェーハの製造方法及びその装置
JP5645000B2 (ja) * 2010-01-26 2014-12-24 国立大学法人埼玉大学 基板加工方法
KR20110114972A (ko) * 2010-04-14 2011-10-20 삼성전자주식회사 레이저 빔을 이용한 기판의 가공 방법

Also Published As

Publication number Publication date
TW201345640A (zh) 2013-11-16
JP2013161820A (ja) 2013-08-19
JP6044919B2 (ja) 2016-12-14
WO2013115353A1 (ja) 2013-08-08

Similar Documents

Publication Publication Date Title
TWI524960B (zh) 基板及基板加工方法
JP5875122B2 (ja) 単結晶基板製造方法および内部改質層形成単結晶部材
JP5875121B2 (ja) 単結晶基板の製造方法および内部改質層形成単結晶部材の製造方法
JP6004338B2 (ja) 単結晶基板製造方法および内部改質層形成単結晶部材
CN104022080B (zh) 晶片的加工方法
TWI687560B (zh) 晶圓的生成方法
CN101335235B (zh) 基板的分割方法
CN102470550B (zh) 加工对象物切断方法
CN103962728B (zh) 激光加工方法
JP6004339B2 (ja) 内部応力層形成単結晶部材および単結晶基板製造方法
JP2015123466A (ja) 基板加工装置及び基板加工方法
JP5995045B2 (ja) 基板加工方法及び基板加工装置
JP5899513B2 (ja) 基板製造方法、および改質層形成装置
KR102399375B1 (ko) 웨이퍼의 가공 방법
TW201641206A (zh) 薄板的分離方法
US9761492B2 (en) Processing method of optical device wafer
TW201321109A (zh) 雷射切割方法
JP6202696B2 (ja) 単結晶基板製造方法
JP2015119076A (ja) 内部加工層形成単結晶部材およびその製造方法
JP2014019120A (ja) 内部加工層形成単結晶部材の製造方法
JP2015123465A (ja) 基板加工装置及び基板加工方法
TWI693633B (zh) 單晶基板之加工方法
JP6664686B2 (ja) 基板加工方法及び剥離基板製造方法
CN102881782B (zh) 光器件衬底的分割方法
JP6202695B2 (ja) 単結晶基板製造方法