TWI524539B - 增加具有頂層及底層塗層之塗層堆疊的濁度以製造薄膜太陽電池之方法及薄膜太陽電池 - Google Patents
增加具有頂層及底層塗層之塗層堆疊的濁度以製造薄膜太陽電池之方法及薄膜太陽電池 Download PDFInfo
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- 238000000576 coating method Methods 0.000 title claims description 103
- 239000011248 coating agent Substances 0.000 title claims description 94
- 239000010409 thin film Substances 0.000 title claims description 11
- 238000004519 manufacturing process Methods 0.000 title description 5
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 70
- 239000010410 layer Substances 0.000 claims description 52
- 239000000758 substrate Substances 0.000 claims description 31
- 239000000203 mixture Substances 0.000 claims description 30
- 239000004408 titanium dioxide Substances 0.000 claims description 27
- 229910000420 cerium oxide Inorganic materials 0.000 claims description 26
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 claims description 26
- 239000002243 precursor Substances 0.000 claims description 25
- 238000005229 chemical vapour deposition Methods 0.000 claims description 23
- 238000000034 method Methods 0.000 claims description 22
- 239000000463 material Substances 0.000 claims description 21
- 229910052718 tin Inorganic materials 0.000 claims description 19
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 15
- 229910052782 aluminium Inorganic materials 0.000 claims description 15
- 239000011247 coating layer Substances 0.000 claims description 15
- 229910052726 zirconium Inorganic materials 0.000 claims description 15
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 claims description 14
- 229910001887 tin oxide Inorganic materials 0.000 claims description 14
- 229910052719 titanium Inorganic materials 0.000 claims description 13
- 239000010936 titanium Substances 0.000 claims description 13
- 238000000151 deposition Methods 0.000 claims description 12
- 229910001392 phosphorus oxide Inorganic materials 0.000 claims description 12
- VSAISIQCTGDGPU-UHFFFAOYSA-N tetraphosphorus hexaoxide Chemical compound O1P(O2)OP3OP1OP2O3 VSAISIQCTGDGPU-UHFFFAOYSA-N 0.000 claims description 12
- 229910052698 phosphorus Inorganic materials 0.000 claims description 10
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 claims description 9
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 9
- 239000012159 carrier gas Substances 0.000 claims description 9
- 230000003746 surface roughness Effects 0.000 claims description 9
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 8
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 8
- 239000011574 phosphorus Substances 0.000 claims description 8
- 229910052725 zinc Inorganic materials 0.000 claims description 8
- 239000002019 doping agent Substances 0.000 claims description 7
- 229910052684 Cerium Inorganic materials 0.000 claims description 6
- 230000005540 biological transmission Effects 0.000 claims description 6
- 239000010408 film Substances 0.000 claims description 6
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 claims description 5
- 229910052787 antimony Inorganic materials 0.000 claims description 5
- 239000007789 gas Substances 0.000 claims description 5
- 229910052738 indium Inorganic materials 0.000 claims description 5
- 229910052707 ruthenium Inorganic materials 0.000 claims description 5
- 239000000126 substance Substances 0.000 claims description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 5
- 239000000956 alloy Substances 0.000 claims description 4
- 229910045601 alloy Inorganic materials 0.000 claims description 4
- 229910052797 bismuth Inorganic materials 0.000 claims description 4
- 229910052804 chromium Inorganic materials 0.000 claims description 4
- 229910052735 hafnium Inorganic materials 0.000 claims description 4
- 229910052742 iron Inorganic materials 0.000 claims description 4
- 229910052748 manganese Inorganic materials 0.000 claims description 4
- 229910052759 nickel Inorganic materials 0.000 claims description 4
- 229910052710 silicon Inorganic materials 0.000 claims description 4
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 claims description 4
- 229910052731 fluorine Inorganic materials 0.000 claims description 3
- GWXLDORMOJMVQZ-UHFFFAOYSA-N cerium Chemical compound [Ce] GWXLDORMOJMVQZ-UHFFFAOYSA-N 0.000 claims description 2
- 229910052715 tantalum Inorganic materials 0.000 claims description 2
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims description 2
- 239000002987 primer (paints) Substances 0.000 claims 3
- 239000002356 single layer Substances 0.000 claims 2
- 239000008187 granular material Substances 0.000 claims 1
- 239000011521 glass Substances 0.000 description 17
- 229910052751 metal Inorganic materials 0.000 description 13
- 239000002184 metal Substances 0.000 description 13
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 12
- 239000005329 float glass Substances 0.000 description 10
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 7
- CETPSERCERDGAM-UHFFFAOYSA-N ceric oxide Chemical compound O=[Ce]=O CETPSERCERDGAM-UHFFFAOYSA-N 0.000 description 7
- 229910000422 cerium(IV) oxide Inorganic materials 0.000 description 7
- 230000008021 deposition Effects 0.000 description 7
- -1 polyethylene terephthalate Polymers 0.000 description 7
- 230000008569 process Effects 0.000 description 7
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 6
- VXUYXOFXAQZZMF-UHFFFAOYSA-N titanium(IV) isopropoxide Chemical compound CC(C)O[Ti](OC(C)C)(OC(C)C)OC(C)C VXUYXOFXAQZZMF-UHFFFAOYSA-N 0.000 description 6
- 239000011701 zinc Substances 0.000 description 6
- 238000000149 argon plasma sintering Methods 0.000 description 5
- 229910052732 germanium Inorganic materials 0.000 description 5
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 5
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 description 5
- VHYFNPMBLIVWCW-UHFFFAOYSA-N 4-Dimethylaminopyridine Chemical compound CN(C)C1=CC=NC=C1 VHYFNPMBLIVWCW-UHFFFAOYSA-N 0.000 description 4
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 4
- 239000013078 crystal Substances 0.000 description 4
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 4
- 229920000642 polymer Polymers 0.000 description 4
- 229910001928 zirconium oxide Inorganic materials 0.000 description 4
- 238000000137 annealing Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000005670 electromagnetic radiation Effects 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 238000002834 transmittance Methods 0.000 description 3
- 229960000549 4-dimethylaminophenol Drugs 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical group CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- 229920000058 polyacrylate Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 238000005118 spray pyrolysis Methods 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- BDZBKCUKTQZUTL-UHFFFAOYSA-N triethyl phosphite Chemical compound CCOP(OCC)OCC BDZBKCUKTQZUTL-UHFFFAOYSA-N 0.000 description 2
- BNEMLSQAJOPTGK-UHFFFAOYSA-N zinc;dioxido(oxo)tin Chemical compound [Zn+2].[O-][Sn]([O-])=O BNEMLSQAJOPTGK-UHFFFAOYSA-N 0.000 description 2
- GGAUUQHSCNMCAU-ZXZARUISSA-N (2s,3r)-butane-1,2,3,4-tetracarboxylic acid Chemical compound OC(=O)C[C@H](C(O)=O)[C@H](C(O)=O)CC(O)=O GGAUUQHSCNMCAU-ZXZARUISSA-N 0.000 description 1
- MXLMTQWGSQIYOW-UHFFFAOYSA-N 3-methyl-2-butanol Chemical compound CC(C)C(C)O MXLMTQWGSQIYOW-UHFFFAOYSA-N 0.000 description 1
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 1
- 238000006124 Pilkington process Methods 0.000 description 1
- 229920002845 Poly(methacrylic acid) Polymers 0.000 description 1
- 229920001283 Polyalkylene terephthalate Polymers 0.000 description 1
- QOSMNYMQXIVWKY-UHFFFAOYSA-N Propyl levulinate Chemical compound CCCOC(=O)CCC(C)=O QOSMNYMQXIVWKY-UHFFFAOYSA-N 0.000 description 1
- 238000002441 X-ray diffraction Methods 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 238000000089 atomic force micrograph Methods 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000005388 borosilicate glass Substances 0.000 description 1
- YHWCPXVTRSHPNY-UHFFFAOYSA-N butan-1-olate;titanium(4+) Chemical compound [Ti+4].CCCC[O-].CCCC[O-].CCCC[O-].CCCC[O-] YHWCPXVTRSHPNY-UHFFFAOYSA-N 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- XFVGXQSSXWIWIO-UHFFFAOYSA-N chloro hypochlorite;titanium Chemical compound [Ti].ClOCl XFVGXQSSXWIWIO-UHFFFAOYSA-N 0.000 description 1
- 239000008199 coating composition Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- RBVFMVQZAAZKJF-UHFFFAOYSA-N dimethyl(propan-2-yl)alumane Chemical compound CC(C)[Al](C)C RBVFMVQZAAZKJF-UHFFFAOYSA-N 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 230000014509 gene expression Effects 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000001755 magnetron sputter deposition Methods 0.000 description 1
- 150000002734 metacrylic acid derivatives Chemical class 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000006060 molten glass Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- SOQBVABWOPYFQZ-UHFFFAOYSA-N oxygen(2-);titanium(4+) Chemical class [O-2].[O-2].[Ti+4] SOQBVABWOPYFQZ-UHFFFAOYSA-N 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920001483 poly(ethyl methacrylate) polymer Polymers 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 229920002215 polytrimethylene terephthalate Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- ZYTJPPRBIGGXRO-UHFFFAOYSA-N propan-2-ylalumane Chemical compound C(C)(C)[AlH2] ZYTJPPRBIGGXRO-UHFFFAOYSA-N 0.000 description 1
- 238000004621 scanning probe microscopy Methods 0.000 description 1
- 239000005368 silicate glass Substances 0.000 description 1
- HUAUNKAZQWMVFY-UHFFFAOYSA-M sodium;oxocalcium;hydroxide Chemical compound [OH-].[Na+].[Ca]=O HUAUNKAZQWMVFY-UHFFFAOYSA-M 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 229920001897 terpolymer Polymers 0.000 description 1
- JMXKSZRRTHPKDL-UHFFFAOYSA-N titanium ethoxide Chemical compound [Ti+4].CC[O-].CC[O-].CC[O-].CC[O-] JMXKSZRRTHPKDL-UHFFFAOYSA-N 0.000 description 1
- XJDNKRIXUMDJCW-UHFFFAOYSA-J titanium tetrachloride Chemical compound Cl[Ti](Cl)(Cl)Cl XJDNKRIXUMDJCW-UHFFFAOYSA-J 0.000 description 1
- JLTRXTDYQLMHGR-UHFFFAOYSA-N trimethylaluminium Chemical compound C[Al](C)C JLTRXTDYQLMHGR-UHFFFAOYSA-N 0.000 description 1
- FGYSRRUNRYVMBF-UHFFFAOYSA-N tris(3-methylbutan-2-yloxy)alumane Chemical compound CC(C([O-])C)C.[Al+3].CC(C([O-])C)C.CC(C([O-])C)C FGYSRRUNRYVMBF-UHFFFAOYSA-N 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
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Description
本發明大體上係關於太陽電池且於一特定實施例中,係關於具有增進濁度特性之非晶矽薄膜太陽電池。
習知非晶矽薄膜太陽電池一般包括一玻璃基板,其上設置有一透明導電氧化物(TCO)接觸層及具有p-n接面之一非晶矽薄膜活性層。後金屬層用作反射體及背面接觸件。TCO具有增加光散射之不規則表面。在太陽電池中,光散射或「濁度」係用以補捉電池活性區域中之光。電池中補捉的光越多,則可獲得越高之效率。然而,濁度不可大至對於通過TCO之光的透明性產生不利影響。因此,光捕捉係當嘗試改良太陽電池效率時之重要問題且在薄膜電池設計中特別重要。然而,對於薄膜裝置,由於層厚度遠薄於先前已知單晶裝置中之彼等者,故此光捕捉更困難的。降低薄膜厚度時,其等傾向為具有主要平行表面之塗層。此等平行表面一般不提供明顯的光散射。對於藉由習知化學氣相沉積(CVD)塗層方法沉積之塗層,此特別明顯。雖然習知CVD塗層方法提供生產量與成本方面之優點,但習知CVD沉積傾向在基板上形成濁度小於0.5%之光滑、均勻塗層。此等光滑塗層一般無法提供具有充足光散射以顯著增加太陽電池效率之層體。
因此,期望提供一種太陽電池及一種特別是藉由CVD方法製造具有增進光散射特性之太陽電池之方法。
本發明提供一種控制,例如增加或減少塗層堆疊濁度之方法。一種增加具有一頂層及一底層塗層之一塗層堆疊的濁度之方法包括:沉積具有表面粗糙度之一底層塗層;及藉由化學氣相沉積在該底層塗層上沉積一頂層以使該頂層較該底層塗層具有更大之表面粗糙度。
另一種利用化學氣相沉積塗層方法增加具有一頂層及一底層塗層之一塗層堆疊的濁度之方法,該方法包括以下至少一者:增加前驅體流動速度;降低載氣流動速度;增加基板溫度;增加水流動速度;降低排出氣流動速度;及增加該頂層或底層塗層中之至少一者的厚度。
一種薄膜太陽電池,包括具有至少一主表面之一透明基板。在該主表面之至少一部份上形成一第一塗層,該第一塗層包括選自矽、鈦、鋁、錫、鋯及/或磷之氧化物的一或多種氧化物。在該第一塗層之至少一部份上形成一第二塗層,該第二塗層包括選自Zn、Fe、Mn、Al、Ce、Sn、Sb、Hf、Zr、Ni、Zn、Bi、Ti、Co、Cr、Si或In中之一或多者或此等物質中之兩者或多者的合金之氧化物的一或多種氧化物物質。
參酌附圖將可自以下說明書更徹底理解本發明。
如本文所用,空間或方向術語,諸如「左」、「右」、「內」、「外」、「上方」、「下方」及其類似者,係如圖中所述闡述本發明。然而,應瞭解本發明可假定各種替代定向,且因此此等術語不應視為限制。此外,如本文所用,說明書及專利申請範圍中使用之表述尺寸、物理性質、製程參數、成份量、反應條件及其類似物之所有數字應理解為在所有實例中均藉由術語「約」修飾。因此,除非另有相反指明,否則以下說明書及專利申請範圍中所闡述之數值可依企圖藉由本發明獲得之期望性質而變化。至少,但非嘗試限制專利申請範圍之對等物教義之應用,各數值至少應視為所記錄之有效數字並應用一般四捨五入技術。此外,本文所揭示之所有範圍係應理解為涵蓋起始及終止範圍數值及其中所包括之任何及所有子範圍。例如,「1至10」之陳述範圍應視為包括介於(及包括)最小值1與最大值10間之任何及所有;即,所有以最小值1或更大起始並以最大值10或更小終止之子範圍,例如1至3.3、4.7至7.5、5.5至10及諸如此類。此外,如本文所用,術語「在…上形成」、「沉積於…上」或「設置於上」意指形成、沉積或設置於上但並不一定與表面直接接觸。例如,一塗層「形成於」一基板上不排除位於所形成之塗層與基板間之相同或不同組合物的一或多個其他塗層或薄膜之存在。如本文所用,術語「聚合物」或「聚合性」包括寡聚體、均聚物、共聚物及三元共聚物,例如由兩種或多種類型聚合物單體形成之聚合物。術語「可見光區」或「可見光」係指具有在380 nm至760 nm範圍中之波長的電磁輻射。術語「紅外光區」或「紅外光輻射」係指具有在大於760 nm至100,000 nm範圍中之波長的電磁輻射。術語「紫外光區」或「紫外光輻射」意指具有在200 nm至小於380 nm範圍中之波長的電磁能。術語「微波區」或「微波輻射」係指具有在300兆赫至300千兆赫範圍中之頻率的電磁輻射。另外,所有的文件,諸如(但不限於)本文所提及之發證專利及專利申請書應認為其之全文係「以引用形式併入」。在以下闡述中,折射率值係參考波長為550奈米(nm)之彼等者。術語「薄膜」係指具有所需或所選擇組合物之塗層的區域。一「層體」包括一或多個「薄膜」。一「塗層」或「塗層堆疊」係由一或多個「層體」組成。
圖1顯示併入本發明特徵之一例示性太陽電池10。太陽電池10包括具有至少一主表面14之一基板12。本發明之一第一塗層16(底層塗層)係形成於該主表面14之至少一部份上。一第二塗層18(透明導電氧化物或「TCO」)係形成於第一塗層16之至少一部份上。一非晶矽層20係形成於第二塗層18之至少一部份上。一金屬或含金屬層22係形成於非晶矽層20之至少一部份上。
在本發明之寬廣實務中,基板12可包括具有任何所需特性之任何所需物質。例如,基板可對可見光為透明或半透明。就「透明」而言,其意指具有大於0%至高達100%之可見光透射率。或者,基板12可係半透明。就「半透明」而言,其意指允許電磁能(例如可見光)穿過但散射此能量以使觀察者無法清晰看見相對側上之物體。適宜物質之實例包括(但不限於)塑膠基板(諸如丙烯酸系聚合物,諸如聚丙烯酸酯;聚甲基丙烯酸烷酯,諸如聚甲基丙烯酸甲酯、聚甲基丙烯酸乙酯、聚甲基丙烯酸丙酯及其類似物;聚胺酯;聚碳酸酯;聚對苯二甲酸烷酯,諸如聚對苯二甲酸乙二酯(PET)、聚對苯二甲酸丙二酯、聚對苯二甲酸丁二酯及其類似物;含聚矽氧烷之聚合物;或用於製備此等或其任何混合物之任何單體的共聚物);玻璃基板;或上述任一者之混合物或組合。例如,基板12可包括習知鹼石灰矽酸鹽玻璃、硼矽酸鹽玻璃或含鉛玻璃。玻璃可係透明玻璃。就「透明玻璃」而言,其意指非帶色或非有色玻璃。或者,玻璃可係帶色或另外著色玻璃。玻璃可係經退火或熱處理玻璃。如本文所用,術語「經熱處理」意指回火或至少部份回火。玻璃可係任何類型,諸如習知浮法玻璃且可係具有任何光學性質,例如可見光透射率、紫外光透射率、紅外光透射率及/或總太陽能透射率之任何數值之任何組合物。就「浮法玻璃」而言,其意指藉由習知浮法製程形成之玻璃,其中熔融玻璃係沉積於熔融金屬浴上並受控冷卻以形成浮法玻璃肋帶。雖然不限制本發明,但美國專利第4,746,347、4,792,536、5,030,593、5,030,594、5,240,886、5,385,872及5,393,593號描述適用於基板之玻璃實例。本發明實務上可用之玻璃非限制實例包括Solargreen、Solextra、GL-20、GL-35TM、Solarbronze、Starphire、Solarphire、Solarphire PV及Solargray玻璃,均購自Pennsylvania之PPG Industries Inc. of Pittsburgh。
基板12可係任何所需尺寸,例如長度、寬度、形狀或厚度。例如,基板12可係平面、曲面或具有平面及曲面部份兩者。在一非限制實施例中,基板12可具有在1 mm至10 mm範圍中,諸如1 mm至5 mm,諸如2 mm至4 mm,諸如3 mm至4 mm之厚度。
基板12可具有在參考波長為550奈米(nm)下之高可見光透射率。就「高可見光透射率」而言,其意指在550 nm下大於或等於85%,諸如大於或等於87%,諸如大於或等於90%,諸如大於或等於91%,諸如大於或等於92%之可見光透射率。
在實施本發明中,如下所述,第一塗層16(底層塗層)可用於影響(例如增加)隨後塗覆之第二塗層18的粗糙度(「濁度」)。已發現藉由有意將輕微濁度或粗糙度(例如表面粗糙度)引入底層塗層16,此濁度在第二塗層18之表面被放大。咸信此係歸因於底層塗層16上之第二層18的晶體結構不匹配。
以下將描述用於增加第一塗層16及/或第二塗層18之粗糙度之方法。在一非限制實施例中,第一塗層16包括選自矽、鈦、鋁、錫、鋯及/或磷之氧化物的一或多種氧化物。氧化物可以任何所需比例存在。例如,第一塗層16可包括二氧化矽。或者,第一塗層16可包括二氧化矽與二氧化鈦之混合物,其中二氧化矽係以0.1重量百分比(重量%)至99.9重量%範圍存在且二氧化鈦係以99.9重量%至0.1重量%範圍存在。第一塗層16可係均勻塗層。或者,第一塗層16可係梯度塗層,其中成份(例如二氧化矽與二氧化鈦)之相對比例在整個塗層中變化。例如,第一塗層16在鄰近基板12表面之區域中主要係二氧化矽且在第一塗層16之外部區域(即遠離基板12之表面)處主要係二氧化鈦。例如,第一塗層16可係具有厚度在80 nm至90 nm範圍中之二氧化矽。
如上所述,第一塗層16可包括至少兩種氧化物之混合物,該等氧化物具有選自矽、鈦、鋁、錫、鋯及/或磷之元素。此等混合物包括(但不限於)二氧化鈦及氧化磷;二氧化矽與氧化鋁;二氧化鈦及氧化鋁;二氧化矽與氧化磷;二氧化鈦與氧化磷;二氧化矽與氧化錫、氧化錫與氧化磷、二氧化鈦與氧化錫、氧化鋁與氧化錫、二氧化矽與氧化鋯;二氧化鈦與氧化鋯;氧化鋁與氧化鋯;氧化鋁與氧化磷;氧化鋯與氧化磷;或以上物質之任何組合。氧化物之相對比例可係以任何所需量存在,諸如0.1重量%至99.9重量%之一種物質及99.9重量%至0.1重量%之其他物質。
另外,第一塗層16可包括至少三種氧化物之混合物,諸如(但不限於)具有選自矽、鈦、鋁、錫、鋯及/或磷之元素的三種或更多種氧化物。實例包括(但不限於)包括二氧化矽、二氧化鈦及氧化磷之混合物;二氧化矽、氧化錫及氧化磷;二氧化矽、二氧化鈦及氧化鋁;及二氧化矽、二氧化鈦及氧化鋯。例如,第一塗層16可包括二氧化矽及二氧化鈦與選自氧化鋁、氧化鋯及氧化磷之至少一種其他氧化物之混合物。對於另一實例,第一塗層16可包括二氧化矽及氧化錫與選自氧化鋁、氧化鋯及氧化磷之至少一種其他氧化物之混合物。氧化物之相對比例可係以諸如0.1重量%至99.9重量%之一種物質,99.9重量%至0.1重量%之第二種物質及0.1重量%至99.9重量%之第三種物質之任何所需量存在。
本發明之一特定第一塗層16包括二氧化矽、二氧化鈦及氧化磷之混合物。二氧化矽可以30體積百分比(體積%)至80體積%之範圍存在。二氧化鈦可係以5體積%至69體積%之範圍存在。氧化磷可係以1體積%至15體積%之範圍存在。
在另一非限制實施例中,第一塗層16可包括銳鈦礦型二氧化鈦。已發現使用銳鈦礦型二氧化鈦,第一層16可增加第二層18之濁度。咸信此係歸因於介於二氧化鈦底層塗層16與形成於底層塗層16上之第二層18間的晶體不匹配。
第一塗層16可具有任何所需厚度,諸如(但不限於)10 nm至120 nm,諸如30 nm至100 nm,諸如30 nm至90 nm,諸如40 nm至90 nm,諸如50 nm至90 nm,諸如70 nm至90 nm,諸如80 nm至90 nm。
在一非限制實施例中,第二塗層18包括至少一導電氧化物層,諸如摻雜劑氧化物層。例如,第二塗層18可包括一或多種氧化物物質,諸如(但不限於)Zn、Fe、Mn、Al、Ce、Sn、Sb、Hf、Zr、Ni、Zn、Bi、Ti、Co、Cr、Si或In中之一或多者或此等物質中之兩者或多者的合金的一或多種氧化物,諸如錫酸鋅。第二塗層18亦可包括一或多種摻雜劑物質,諸如(但不限於)F、In、Al、P及/或Sb。在一非限制實施例中,第二塗層18係摻氟氧化錫塗層,其中氟係以少於以前驅體物質之總重量計之20重量%之量存在於塗層前驅體物質中,諸如少於15重量%,諸如少於13重量%,諸如少於10重量%,諸如少於5重量%。第二塗層18可係非晶形、晶體或至少部份晶體。
第二塗層18可具有大於200 nm,諸如大於250 nm,諸如大於350 nm,諸如大於380 nm,諸如大於400 nm,諸如大於420 nm,諸如大於500 nm,諸如大於600 nm之厚度。在一非限制實施例中,第二塗層18包括摻氟氧化錫且具有如上所述之厚度,諸如在350 nm至1,000 nm之範圍中,諸如400 nm至800 nm,諸如500 nm至700 nm,諸如600 nm至700 nm,諸如650 nm。
第二塗層18(例如摻氟氧化錫)可具有小於15歐姆/面積(Ω/□),諸如小於14 Ω/□,諸如小於13.5 Ω/□,諸如小於13 Ω/□,諸如小於12 Ω/□,諸如小於11 Ω/□,諸如小於10 Ω/□之表面電阻係數。
第二塗層18可具有在5 nm至60 nm範圍中,諸如諸如5 nm至40 nm,諸如5 nm至30 nm,諸如10 nm至30 nm,諸如10 nm至20 nm,諸如10 nm至15 nm,諸如11 nm至15 nm之表面粗糙度(RMS)。第一塗層16之表面粗糙度將係小於第二塗層18之表面粗糙度。
非晶矽層20可具有在200 nm至1,000 nm範圍中,諸如200 nm至800 nm,諸如300 nm至500 nm,諸如300 nm至400 nm,諸如350 nm之厚度。
含金屬層22可係金屬或可含有一或多種金屬氧化物。適宜金屬氧化物物質實例包括(但不限於)諸如(但不限於)Zn、Fe、Mn、Al、Ce、Sn、Sb、Hf、Zr、Ni、Zn、Bi、Ti、Co、Cr、Si或In中之一或多者或此等物質中之兩者或多者的合金的氧化物,諸如錫酸鋅。含金屬層22可具有在50 nm至500 nm範圍中,諸如50 nm至300 nm,諸如50 nm至200 nm,諸如100 nm至200 nm,諸如150 nm之厚度。
藉由任何習知方法,諸如(但不限於)噴霧熱解、化學氣相沉積(CVD)或磁控濺鍍真空沉積(MSVD)可於基板12之至少一部份上形成第一塗層16及/或第二塗層18。在噴霧熱解方法中,具有一或多種氧化物前驅體物質之有機或含金屬前驅體組合物,例如二氧化鈦及/或二氧化矽及/或氧化鋁及/或氧化磷及/或氧化鋯之前驅體物質係以懸浮液,例如水溶液或非水溶液形式攜載,且當基板係處於足以導致前驅體組合物分解並於該基板上形成一塗層之高溫度下時,其係朝基板表面定向。組合物可包括一或多種摻雜劑物質。在CVD方法中,前驅體組合物係以載氣,例如氮氣形式攜載且係朝受熱基板定向。在MSVD方法中,一或多種含金屬陰極靶係於減壓惰性或含氧氛圍中濺鍍以於基板上沉積一濺鍍塗層。在塗覆期間或之後加熱基板以促使濺鍍塗料結晶,形成塗層。
在本發明之一非限制實務中,在習知浮法玻璃肋帶製造製程中,於一或多個位置使用一或多個CVD塗層設備。例如,當浮法玻璃肋帶行經錫浴時,在其離開錫浴後,在其進入退火窯前,當其行經退火窯或在其離開退火窯後可使用CVD塗層設備。由於CVD方法可塗覆移動中之浮法玻璃肋帶,且又能承受與製造浮法玻璃肋帶有關之苛刻環境,故CVD方法係極其適於在熔融錫浴中之浮法玻璃肋帶上沉積塗層。美國專利第4,853,257、4,971,843、5,536,718、5,464,657、5,714,199及5,599,387號描述CVD塗層設備及用於實施本發明以在熔融錫浴中塗覆浮法玻璃肋帶之方法。
在一非限制實施例中,一或多種CVD塗佈機可置於熔融錫池上方之錫浴中。當浮法玻璃肋帶移經錫浴時,可將經蒸發之前驅體組合物加入載氣並引向該肋帶之上表面上。前驅體組合物分解,在肋帶上形成一塗層(例如第一塗層16及/或第二塗層18)。塗層組合物可沉積於其中肋帶之溫度係小於1300℉(704℃),諸如小於1250℉(677℃),諸如小於1200℉(649℃),諸如小於1190℉(643℃),諸如小於1150℉(621℃),諸如小於1130℉(610℃),諸如在1190℉至1200℉(643℃至649℃)之範圍中的位置處之肋帶上。此特別可用於沉積表面電阻係數減小之第二塗層18(例如摻氟氧化錫),此因沉積溫度越低,則所得表面電阻係數越低之故。
例如,為形成包含二氧化矽與二氧化鈦之第一塗層16,該組合物包含二氧化矽前驅體與二氧化鈦前驅體兩者。二氧化矽前驅體之一非限制實例係原矽酸四乙酯(TEOS)。
二氧化鈦前驅體之實例包括(但不限於)鈦之氧化物、次氧化物或過氧化物。在一實施例中,二氧化鈦前驅體物質可包括一或多種烷氧化鈦,諸如(但不限於)甲氧化鈦、乙氧化鈦、丙氧化鈦、丁氧化鈦及其類似物;或其異構體,例如異丙氧化鈦、四乙氧化鈦及其類似物。適於實施本發明之例示前驅體物質包括(但不限於)鈦酸四異丙酯(TPT)。或者,二氧化鈦前驅體物質可係四氯化鈦。氧化鋁前驅體之實例包括(但不限於)二甲基異丙氧化鋁(DMAP)及三-第二丁氧化鋁(ATSB)。藉由在室溫惰性氛圍中以2:1之莫耳比混合三甲基鋁及異丙氧化鋁可製造二甲基異丙氧化鋁。氧化磷前驅體之實例包括(但不限於)亞磷酸三乙酯。氧化鋯前驅體之實例包括(但不限於)烷氧化鋯。
具有二氧化矽與二氧化鈦組合之第一塗層16提供優於先前氧化物組合之優點。例如,藉由改變二氧化矽與二氧化鈦之量,低折射率物質如二氧化矽(在550 nm下之折射率為1.5)與高折射率物質如二氧化鈦(銳鈦礦二氧化鈦在550 nm下之折射率為2.48)之組合容許第一塗層16之折射率在此兩極端間變化。此特別可用於提供具有顏色或虹彩抑制性質之第一塗層16。
然而,二氧化鈦之沉積速度一般遠快於二氧化矽。故在一般沉積條件下,此將二氧化矽之量限制於不多於約50重量%,此接著限制所得二氧化矽/二氧化鈦塗層之折射率的下限範圍。因此,可將摻雜劑物質加入二氧化矽與二氧化鈦前驅體組合物以加快二氧化矽之沉積速度。摻雜劑形成所得氧化物混合物之一部份並因此可經選擇以為所得塗層提供增強之性能性質。實施本發明可使用之摻雜劑實例包括(但不限於)含一或多種磷、鋁及鋯之物質以於所得塗層中形成此等物質之混合物。氧化磷前驅體物質實例包括(但不限於)亞磷酸三乙酯。氧化鋁前驅體物質實例包括三第二丁氧化鋁(ATSB)及二甲基異丙氧基鋁(DMAP)。氧化鋯前驅體實例包括烷氧化鋯。
在一特定非限制實施例中,利用化學氣相沉積塗層方法塗覆第一及/或第二塗層。已確定用以調節沉積塗層濁度之CVD塗層方法參數。例如,為增加特定塗層之濁度,可如下改變以下參數中之一或多者:(1)增加前驅體組合物之流動速度;(2)降低載氣流動速度;(3)增加基板溫度;(4)增加水流動速度;(5)降低排出氣流動速度;及(6)增加塗層,尤其頂層之厚度。
提供以下實例以闡述本發明之各種非限制態樣。然而,應瞭解本發明不限於此等特定實例。
實例1
此實例闡述降低排出氣流量對所得塗層之濁度的影響。
在此實例中,在製造玻璃期間,利用習知化學氣相沉積塗佈機沉積摻氟氧化錫塗層(標準)。標準樣品具有小於0.5%之濁度。接著,除完全停止排氣機,僅留下來自通風系統之排氣流外,利用化學氣相沉積塗佈機沉積摻氟氧化錫。表1顯示自此樣品之量測濁度為16.6%。如所看出,減少化學氣相沉積塗佈機之排氣流明顯增加樣品1之濁度。
實例2
在此實例中,調節化學氣相沉積系統之各種沉積參數以確定所得塗層濁度之影響。表2顯示各種沉積參數與所量測之性質。
如表2所示,降低排氣機速度較增加水流動速度對濁度似乎具有更大影響。
實例3
此實例闡述入口載氣流動速度對所得塗層之濁度的影響。如表3所示,利用不同入口載氣流動速度製備5號與6號樣品。以相同化學試劑流動速度,5英吋/分鐘之相同帶速度,相同排氣機速度及相同水/MBTC比沉積5號與6號樣品。所改變之唯一參數係入口載氣流動速度。如表3所示,具有較高載氣流動速度之5號樣品較具有較低流動速度之樣品具有更低之濁度(3.21%)。藉由減小約一半之入口流動速度,塗層厚度僅增加了約25%,表面電阻係數降低了約6.6%,但濁度增加了三倍。
研究5號與6號樣品之原子力顯微鏡圖像且6號樣品具有較5號樣品更粗糙之表面。如表4所顯示,6號樣品係較5號樣品粗糙約29%至40%。5號與6號樣品之電子掃描顯微鏡圖像顯示5號樣品較6號樣品具有更小之晶體顆粒大小。根據X射線繞射結果,5號樣品與6號樣品之(101)峰亦有明顯變化,此提示對於濁度更高之6號樣品之(101)空間明顯成長。
熟習此項技術者應輕易瞭解到在不脫離前面所提及說明書中所揭示之概念下,可對本發明作出修飾。例如,以上闡述主要注重於增加塗層之濁度。應瞭解藉由顛倒以上步驟亦可減小濁度。因此,本文詳細描述之特定實施例僅係例示性且不限制本發明之範圍,本發明之範圍將由隨附專利申請範圍之整個範圍及其任何及所有對等物所給出。
10...太陽電池
12...基板
14...主表面
16...第一塗層
18...第二塗層
20...非晶矽層
22...金屬或含金屬層
圖1係併入本發明特徵之太陽電池之側面截面圖(不按比例繪製)。
10...太陽電池
12...基板
14...主表面
16...第一塗層
18...第二塗層
20...非晶矽層
22...金屬或含金屬層
Claims (11)
- 一種增加具有一頂層及一底層塗層之塗層堆疊的濁度以製造薄膜太陽電池之方法,其包括:沉積具有表面粗糙度之一底層塗層;及藉由化學氣相沉積在該底層塗層上沉積一頂層,以使該頂層具有較該底層塗層表面粗糙度大之表面粗糙度其中該底層塗層包含至少兩種氧化物之混合物,該等氧化物具有選自矽、鈦、鋯、錫、鋁、磷及其混合物之元素,或其中該底層塗層包含具有厚度在20nm至25nm範圍中之銳鈦礦型二氧化鈦。
- 如請求項1之方法,其中該頂層具有在5%至30%範圍中之濁度水準。
- 一種利用化學氣相沉積塗層方法增加具有一頂層與一底層塗層的塗層堆疊之濁度以製造薄膜太陽電池之方法,其中該底層塗層係為一單層且包含一種選自由以下各者所組成之群之物質:銳鈦礦型二氧化鈦;二氧化矽及二氧化鈦之混合物;二氧化矽、二氧化鈦及氧化磷之混合物;及氧化磷與矽、鈦、鋯、錫及鋁中至少一者之氧化物的混合物,且其中該濁度藉由執行至少一選自由以下步驟所組成之群之塗層步驟而增加:增加前驅體流動速度;降低載氣流動速度;增加水流動速度;及降低排出氣流動速度。
- 如請求項3之方法,其中該經塗覆物件具有大於80%之可 見光透射率及小於15Ω/□之表面電阻。
- 如請求項3之方法,其中該表面電阻係小於10Ω/□。
- 如請求項4之方法,其中該表面電阻係在5Ω/□至9Ω/□範圍中。
- 如請求項3之方法,其包括降低排出氣流動速度以產生顆粒膜沉積。
- 一種增加具有一頂層及一底層塗層之塗層堆疊的濁度以製造薄膜太陽電池之方法,其包括:提供一銳鈦礦型二氧化鈦底層塗層;及在該底層塗層之至少一部份上沉積摻氟氧化錫層。
- 一種薄膜太陽電池,其包括:具有至少一主表面之透明基板;在該主表面之至少一部份上形成之第一塗層,該第一塗層包括選自矽、鈦、鋁、錫、鋯及/或磷中之氧化物的氧化物;在該第一塗層之至少一部份上形成之第二塗層,該第二塗層包含選自Zn、Fe、Mn、Al、Ce、Sn、Sb、Hf、Zr、Ni、Zn、Bi、Ti、Co、Cr、Si或In中之一或多者或此等物質中之兩種或多種的合金的氧化物之一或多種氧化物物質,其中該第一塗層係為一單層且包含至少兩種氧化物之混合物,該等氧化物具有選自矽、鈦、鋁、錫、鋯及磷之元素,且其中該第二塗層進一步包括選自F、In、Al、P及Sb之 一或多種摻雜劑物質。
- 如請求項9之太陽電池,其中該第一塗層包含二氧化矽。
- 如請求項9之太陽電池,其中該第二塗層包含摻氟氧化錫。
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Also Published As
Publication number | Publication date |
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US20110146767A1 (en) | 2011-06-23 |
US9224892B2 (en) | 2015-12-29 |
JP5607180B2 (ja) | 2014-10-15 |
JP2013515373A (ja) | 2013-05-02 |
BR112012014980A2 (pt) | 2016-04-05 |
WO2011084292A2 (en) | 2011-07-14 |
MY159272A (en) | 2016-12-30 |
WO2011084292A3 (en) | 2011-09-09 |
KR20120096099A (ko) | 2012-08-29 |
RU2526298C2 (ru) | 2014-08-20 |
TR201908926T4 (tr) | 2019-07-22 |
TW201138125A (en) | 2011-11-01 |
MX2012006821A (es) | 2012-07-23 |
EP2517259A2 (en) | 2012-10-31 |
EP2517259B1 (en) | 2019-04-17 |
KR101511015B1 (ko) | 2015-04-13 |
CN102652365A (zh) | 2012-08-29 |
IN2012DN05184A (zh) | 2015-10-23 |
TW201631785A (zh) | 2016-09-01 |
MX336541B (es) | 2016-01-22 |
RU2012131142A (ru) | 2014-01-27 |
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