CN101904013B - 用于获得沉积于高度纹理化基板上的高性能薄膜装置的方法 - Google Patents
用于获得沉积于高度纹理化基板上的高性能薄膜装置的方法 Download PDFInfo
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- CN101904013B CN101904013B CN2008801221131A CN200880122113A CN101904013B CN 101904013 B CN101904013 B CN 101904013B CN 2008801221131 A CN2008801221131 A CN 2008801221131A CN 200880122113 A CN200880122113 A CN 200880122113A CN 101904013 B CN101904013 B CN 101904013B
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- 238000000034 method Methods 0.000 title claims abstract description 49
- 239000010409 thin film Substances 0.000 title claims abstract description 37
- 239000000758 substrate Substances 0.000 title claims description 28
- 238000004519 manufacturing process Methods 0.000 claims abstract description 7
- 238000000151 deposition Methods 0.000 claims description 74
- 230000008021 deposition Effects 0.000 claims description 62
- 238000004518 low pressure chemical vapour deposition Methods 0.000 claims description 33
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 8
- 229910000077 silane Inorganic materials 0.000 claims description 8
- 230000007423 decrease Effects 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 261
- 239000004065 semiconductor Substances 0.000 description 18
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 16
- 229910052710 silicon Inorganic materials 0.000 description 16
- 239000010703 silicon Substances 0.000 description 16
- 229910021417 amorphous silicon Inorganic materials 0.000 description 15
- HQWPLXHWEZZGKY-UHFFFAOYSA-N diethylzinc Chemical compound CC[Zn]CC HQWPLXHWEZZGKY-UHFFFAOYSA-N 0.000 description 14
- 239000000463 material Substances 0.000 description 12
- 229910021423 nanocrystalline silicon Inorganic materials 0.000 description 9
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 9
- 238000010521 absorption reaction Methods 0.000 description 8
- 229910052799 carbon Inorganic materials 0.000 description 8
- 229910021419 crystalline silicon Inorganic materials 0.000 description 8
- MARUHZGHZWCEQU-UHFFFAOYSA-N 5-phenyl-2h-tetrazole Chemical compound C1=CC=CC=C1C1=NNN=N1 MARUHZGHZWCEQU-UHFFFAOYSA-N 0.000 description 7
- 238000005229 chemical vapour deposition Methods 0.000 description 7
- 239000011358 absorbing material Substances 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 6
- 239000011521 glass Substances 0.000 description 6
- 230000003287 optical effect Effects 0.000 description 6
- 239000010408 film Substances 0.000 description 5
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 4
- 229910006404 SnO 2 Inorganic materials 0.000 description 4
- 229910052796 boron Inorganic materials 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- WUPHOULIZUERAE-UHFFFAOYSA-N 3-(oxolan-2-yl)propanoic acid Chemical compound OC(=O)CCC1CCCO1 WUPHOULIZUERAE-UHFFFAOYSA-N 0.000 description 3
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 229910052980 cadmium sulfide Inorganic materials 0.000 description 3
- 239000002019 doping agent Substances 0.000 description 3
- 230000005684 electric field Effects 0.000 description 3
- 229910052733 gallium Inorganic materials 0.000 description 3
- 239000012528 membrane Substances 0.000 description 3
- 239000013081 microcrystal Substances 0.000 description 3
- 238000005240 physical vapour deposition Methods 0.000 description 3
- 238000004062 sedimentation Methods 0.000 description 3
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 2
- 239000006096 absorbing agent Substances 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
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- 239000013049 sediment Substances 0.000 description 2
- 150000003376 silicon Chemical class 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 238000000149 argon plasma sintering Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- HVMJUDPAXRRVQO-UHFFFAOYSA-N copper indium Chemical compound [Cu].[In] HVMJUDPAXRRVQO-UHFFFAOYSA-N 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- XIMIGUBYDJDCKI-UHFFFAOYSA-N diselenium Chemical compound [Se]=[Se] XIMIGUBYDJDCKI-UHFFFAOYSA-N 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000005329 float glass Substances 0.000 description 1
- 150000004678 hydrides Chemical class 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000001451 molecular beam epitaxy Methods 0.000 description 1
- 239000002159 nanocrystal Substances 0.000 description 1
- 231100000252 nontoxic Toxicity 0.000 description 1
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- 230000005622 photoelectricity Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000012958 reprocessing Methods 0.000 description 1
- 239000005336 safety glass Substances 0.000 description 1
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- 239000004575 stone Substances 0.000 description 1
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- 238000001771 vacuum deposition Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0236—Special surface textures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022466—Electrodes made of transparent conductive layers, e.g. TCO, ITO layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022466—Electrodes made of transparent conductive layers, e.g. TCO, ITO layers
- H01L31/022483—Electrodes made of transparent conductive layers, e.g. TCO, ITO layers composed of zinc oxide [ZnO]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1884—Manufacture of transparent electrodes, e.g. TCO, ITO
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Abstract
Description
Claims (14)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US1479907P | 2007-12-19 | 2007-12-19 | |
US61/014,799 | 2007-12-19 | ||
PCT/EP2008/067936 WO2009077605A2 (en) | 2007-12-19 | 2008-12-18 | Method for obtaining high performance thin film devices deposited on highly textured substrates |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101904013A CN101904013A (zh) | 2010-12-01 |
CN101904013B true CN101904013B (zh) | 2013-05-08 |
Family
ID=40795941
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2008801221131A Expired - Fee Related CN101904013B (zh) | 2007-12-19 | 2008-12-18 | 用于获得沉积于高度纹理化基板上的高性能薄膜装置的方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US8981200B2 (zh) |
EP (1) | EP2232570A2 (zh) |
CN (1) | CN101904013B (zh) |
TW (1) | TWI438904B (zh) |
WO (1) | WO2009077605A2 (zh) |
Families Citing this family (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7442629B2 (en) | 2004-09-24 | 2008-10-28 | President & Fellows Of Harvard College | Femtosecond laser-induced formation of submicrometer spikes on a semiconductor substrate |
US7057256B2 (en) | 2001-05-25 | 2006-06-06 | President & Fellows Of Harvard College | Silicon-based visible and near-infrared optoelectric devices |
WO2010009436A2 (en) | 2008-07-17 | 2010-01-21 | Uriel Solar Inc. | High power efficiency, large substrate, polycrystalline cdte thin film semiconductor photovoltaic cell structures grown by molecular beam epitaxy at high deposition rate for use in solar electricity generation |
US9911781B2 (en) | 2009-09-17 | 2018-03-06 | Sionyx, Llc | Photosensitive imaging devices and associated methods |
US9673243B2 (en) | 2009-09-17 | 2017-06-06 | Sionyx, Llc | Photosensitive imaging devices and associated methods |
CN102782882A (zh) | 2009-09-18 | 2012-11-14 | 欧瑞康太阳能股份公司(特吕巴赫) | 高效率非晶/微晶堆叠串联电池 |
WO2011032854A2 (en) | 2009-09-18 | 2011-03-24 | Oerlikon Solar Ag, Truebbach | A method for manufacturing a photovoltaic device |
CN102782881A (zh) * | 2009-09-18 | 2012-11-14 | 欧瑞康太阳能股份公司(特吕巴赫) | 高效率非晶硅光伏器件 |
DE102009042018A1 (de) * | 2009-09-21 | 2011-03-24 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Solarzelle |
US9224892B2 (en) * | 2009-12-21 | 2015-12-29 | Ppg Industries Ohio, Inc. | Silicon thin film solar cell having improved haze and methods of making the same |
US8692198B2 (en) | 2010-04-21 | 2014-04-08 | Sionyx, Inc. | Photosensitive imaging devices and associated methods |
CN106449684B (zh) | 2010-06-18 | 2019-09-27 | 西奥尼克斯公司 | 高速光敏设备及相关方法 |
US20130269767A1 (en) * | 2010-09-03 | 2013-10-17 | Tel Solar Ag | Method of coating a substrate for manufacturing a solar cell |
DE102010049976B4 (de) * | 2010-10-18 | 2017-02-02 | Universität Stuttgart | Solarzelle mit texturierter Elektrodenschicht und Verfahren zur Herstellung einer solchen |
TWI472042B (zh) * | 2010-12-28 | 2015-02-01 | Chih Hua Yang | 薄膜太陽能電池結構 |
TWI473281B (zh) * | 2011-04-01 | 2015-02-11 | Nexpower Technology Corp | 薄膜太陽能電池結構 |
US9496308B2 (en) | 2011-06-09 | 2016-11-15 | Sionyx, Llc | Process module for increasing the response of backside illuminated photosensitive imagers and associated methods |
WO2013010127A2 (en) | 2011-07-13 | 2013-01-17 | Sionyx, Inc. | Biometric imaging devices and associated methods |
WO2013096824A1 (en) * | 2011-12-22 | 2013-06-27 | Laser Energetics, Inc. | Solar concentrator |
US9064764B2 (en) | 2012-03-22 | 2015-06-23 | Sionyx, Inc. | Pixel isolation elements, devices, and associated methods |
US8735210B2 (en) * | 2012-06-28 | 2014-05-27 | International Business Machines Corporation | High efficiency solar cells fabricated by inexpensive PECVD |
US9762830B2 (en) | 2013-02-15 | 2017-09-12 | Sionyx, Llc | High dynamic range CMOS image sensor having anti-blooming properties and associated methods |
US9939251B2 (en) | 2013-03-15 | 2018-04-10 | Sionyx, Llc | Three dimensional imaging utilizing stacked imager devices and associated methods |
US9209345B2 (en) | 2013-06-29 | 2015-12-08 | Sionyx, Inc. | Shallow trench textured regions and associated methods |
US20150207011A1 (en) * | 2013-12-20 | 2015-07-23 | Uriel Solar, Inc. | Multi-junction photovoltaic cells and methods for forming the same |
CN105304752B (zh) * | 2015-09-21 | 2017-03-08 | 中国科学院上海硅酸盐研究所 | 绒面硼掺杂氧化锌基透明导电薄膜的生长方法和生长装置 |
LU93080B1 (en) * | 2016-05-20 | 2017-11-29 | Univ Luxembourg | transparent conducting film based on zinc oxide |
US10510861B1 (en) * | 2018-06-15 | 2019-12-17 | Taiwan Semiconductor Manufacturing Company, Ltd. | Gaseous spacer and methods of forming same |
CN112993169B (zh) * | 2021-03-03 | 2024-03-08 | 北京交通大学 | 一种nip异质结太阳能电池及其制造方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1125357A (zh) * | 1994-08-24 | 1996-06-26 | 佳能株式会社 | 背部反射体层及其形成方法和应用它的光电元件 |
US5589403A (en) * | 1992-02-05 | 1996-12-31 | Canon Kabushiki Kaisha | Method for producing photovoltaic device |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4633034A (en) * | 1985-02-08 | 1986-12-30 | Energy Conversion Devices, Inc. | Photovoltaic device and method |
JPS62198169A (ja) * | 1986-02-25 | 1987-09-01 | Fuji Electric Corp Res & Dev Ltd | 太陽電池 |
US6974976B2 (en) * | 2002-09-30 | 2005-12-13 | Miasole | Thin-film solar cells |
US20050056312A1 (en) * | 2003-03-14 | 2005-03-17 | Young David L. | Bifacial structure for tandem solar cells |
FR2891269B1 (fr) * | 2005-09-23 | 2007-11-09 | Saint Gobain | Substrat transparent muni d'une electrode |
US20070193624A1 (en) * | 2006-02-23 | 2007-08-23 | Guardian Industries Corp. | Indium zinc oxide based front contact for photovoltaic device and method of making same |
-
2008
- 2008-12-18 WO PCT/EP2008/067936 patent/WO2009077605A2/en active Application Filing
- 2008-12-18 EP EP08860935A patent/EP2232570A2/en not_active Withdrawn
- 2008-12-18 US US12/808,200 patent/US8981200B2/en not_active Expired - Fee Related
- 2008-12-18 CN CN2008801221131A patent/CN101904013B/zh not_active Expired - Fee Related
- 2008-12-19 TW TW097149853A patent/TWI438904B/zh not_active IP Right Cessation
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5589403A (en) * | 1992-02-05 | 1996-12-31 | Canon Kabushiki Kaisha | Method for producing photovoltaic device |
CN1125357A (zh) * | 1994-08-24 | 1996-06-26 | 佳能株式会社 | 背部反射体层及其形成方法和应用它的光电元件 |
Also Published As
Publication number | Publication date |
---|---|
EP2232570A2 (en) | 2010-09-29 |
CN101904013A (zh) | 2010-12-01 |
US8981200B2 (en) | 2015-03-17 |
WO2009077605A2 (en) | 2009-06-25 |
TWI438904B (zh) | 2014-05-21 |
WO2009077605A3 (en) | 2009-11-26 |
TW201001721A (en) | 2010-01-01 |
US20100313932A1 (en) | 2010-12-16 |
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Effective date of registration: 20110616 Address after: Swiss Tur Ray Bbu Bach Applicant after: Oerlikon Solar AG, TRUBBACH Address before: Swiss Tur Ray Bbu Bach Applicant before: Oerlikon Solar AG, TRUBBACH |
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