TWI516858B - 使用帶電粒子束在基板上實施繪圖的繪圖裝置及物件之製造方法 - Google Patents
使用帶電粒子束在基板上實施繪圖的繪圖裝置及物件之製造方法 Download PDFInfo
- Publication number
- TWI516858B TWI516858B TW103113857A TW103113857A TWI516858B TW I516858 B TWI516858 B TW I516858B TW 103113857 A TW103113857 A TW 103113857A TW 103113857 A TW103113857 A TW 103113857A TW I516858 B TWI516858 B TW I516858B
- Authority
- TW
- Taiwan
- Prior art keywords
- charged particle
- substrate
- particle beams
- illumination
- axis
- Prior art date
Links
Classifications
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- H10P76/2041—
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
- H01J37/317—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
- H01J37/3174—Particle-beam lithography, e.g. electron beam lithography
- H01J37/3177—Multi-beam, e.g. fly's eye, comb probe
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
- H01J37/302—Controlling tubes by external information, e.g. programme control
- H01J37/3023—Programme control
- H01J37/3026—Patterning strategy
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/30—Electron or ion beam tubes for processing objects
- H01J2237/317—Processing objects on a microscale
- H01J2237/3175—Lithography
- H01J2237/31761—Patterning strategy
- H01J2237/31766—Continuous moving of wafer
Landscapes
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Electron Beam Exposure (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013095960A JP6193611B2 (ja) | 2013-04-30 | 2013-04-30 | 描画装置、及び物品の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201441758A TW201441758A (zh) | 2014-11-01 |
| TWI516858B true TWI516858B (zh) | 2016-01-11 |
Family
ID=51789514
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW103113857A TWI516858B (zh) | 2013-04-30 | 2014-04-16 | 使用帶電粒子束在基板上實施繪圖的繪圖裝置及物件之製造方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US9455124B2 (enExample) |
| JP (1) | JP6193611B2 (enExample) |
| KR (1) | KR101790829B1 (enExample) |
| CN (1) | CN104134605B (enExample) |
| TW (1) | TWI516858B (enExample) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6289181B2 (ja) * | 2013-06-26 | 2018-03-07 | キヤノン株式会社 | 描画装置、及び、物品の製造方法 |
| JP6548982B2 (ja) * | 2014-11-28 | 2019-07-24 | 株式会社ニューフレアテクノロジー | 描画データの作成方法 |
| US9984853B2 (en) | 2014-11-28 | 2018-05-29 | Nuflare Technology, Inc. | Method for generating writing data |
| JP6593090B2 (ja) * | 2015-10-20 | 2019-10-23 | 株式会社ニューフレアテクノロジー | 支持ケース及びマルチ荷電粒子ビーム描画装置 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62144323A (ja) | 1985-12-19 | 1987-06-27 | Toshiba Corp | 荷電ビ−ム露光装置 |
| JP4818501B2 (ja) * | 2000-09-12 | 2011-11-16 | 三菱電機株式会社 | 電子ビーム露光装置 |
| CN100337089C (zh) | 2002-09-20 | 2007-09-12 | Asml荷兰有限公司 | 器件检验 |
| TWI547769B (zh) | 2007-12-28 | 2016-09-01 | 尼康股份有限公司 | An exposure apparatus, a moving body driving system, a pattern forming apparatus, and an exposure method, and an element manufacturing method |
| JP5480496B2 (ja) | 2008-03-25 | 2014-04-23 | 株式会社ニューフレアテクノロジー | 荷電粒子ビーム描画方法及び荷電粒子ビーム描画装置 |
| US8405923B2 (en) * | 2008-08-01 | 2013-03-26 | Pioneer Corporation | Electron beam recording apparatus, controller for the same, and method for controlling same |
| CN103069536B (zh) | 2010-04-09 | 2016-04-06 | 卡尔蔡司Smt有限责任公司 | 带电粒子探测系统和多小波束检查系统 |
| JP5835892B2 (ja) * | 2010-12-27 | 2015-12-24 | キヤノン株式会社 | 荷電粒子線描画装置及びデバイス製造方法 |
| JP5832141B2 (ja) | 2011-05-16 | 2015-12-16 | キヤノン株式会社 | 描画装置、および、物品の製造方法 |
| JP5859778B2 (ja) * | 2011-09-01 | 2016-02-16 | 株式会社ニューフレアテクノロジー | マルチ荷電粒子ビーム描画装置及びマルチ荷電粒子ビーム描画方法 |
-
2013
- 2013-04-30 JP JP2013095960A patent/JP6193611B2/ja active Active
-
2014
- 2014-04-16 TW TW103113857A patent/TWI516858B/zh active
- 2014-04-22 KR KR1020140047828A patent/KR101790829B1/ko active Active
- 2014-04-23 US US14/260,052 patent/US9455124B2/en active Active
- 2014-04-25 CN CN201410169262.0A patent/CN104134605B/zh active Active
Also Published As
| Publication number | Publication date |
|---|---|
| KR101790829B1 (ko) | 2017-10-26 |
| US20140322653A1 (en) | 2014-10-30 |
| KR20140130028A (ko) | 2014-11-07 |
| TW201441758A (zh) | 2014-11-01 |
| JP6193611B2 (ja) | 2017-09-06 |
| US9455124B2 (en) | 2016-09-27 |
| CN104134605B (zh) | 2017-05-24 |
| CN104134605A (zh) | 2014-11-05 |
| JP2014216630A (ja) | 2014-11-17 |
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