TWI516364B - 製造銀微絲膜之方法 - Google Patents

製造銀微絲膜之方法 Download PDF

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Publication number
TWI516364B
TWI516364B TW102129642A TW102129642A TWI516364B TW I516364 B TWI516364 B TW I516364B TW 102129642 A TW102129642 A TW 102129642A TW 102129642 A TW102129642 A TW 102129642A TW I516364 B TWI516364 B TW I516364B
Authority
TW
Taiwan
Prior art keywords
silver
providing
microfilaments
film
carrier
Prior art date
Application number
TW102129642A
Other languages
English (en)
Chinese (zh)
Other versions
TW201431673A (zh
Inventor
葛羅 可漢瑞
凱塞琳Ｍ 歐康乃爾
彼得 崔夫納斯
傑洛米 凱瑞克
卜路嘉
賈布摩 朱
Original Assignee
羅門哈斯電子材料有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 羅門哈斯電子材料有限公司 filed Critical 羅門哈斯電子材料有限公司
Publication of TW201431673A publication Critical patent/TW201431673A/zh
Application granted granted Critical
Publication of TWI516364B publication Critical patent/TWI516364B/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F71/00—Manufacture or treatment of devices covered by this subclass
    • H10F71/138—Manufacture of transparent electrodes, e.g. transparent conductive oxides [TCO] or indium tin oxide [ITO] electrodes
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04112—Electrode mesh in capacitive digitiser: electrode for touch sensing is formed of a mesh of very fine, normally metallic, interconnected lines that are almost invisible to see. This provides a quite large but transparent electrode surface, without need for ITO or similar transparent conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0108—Transparent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0224—Conductive particles having an insulating coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0326—Inorganic, non-metallic conductor, e.g. indium-tin oxide [ITO]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Human Computer Interaction (AREA)
  • Dispersion Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Nanotechnology (AREA)
  • Powder Metallurgy (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Laminated Bodies (AREA)
  • Conductive Materials (AREA)
TW102129642A 2012-08-29 2013-08-19 製造銀微絲膜之方法 TWI516364B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US201261694296P 2012-08-29 2012-08-29

Publications (2)

Publication Number Publication Date
TW201431673A TW201431673A (zh) 2014-08-16
TWI516364B true TWI516364B (zh) 2016-01-11

Family

ID=50098491

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102129642A TWI516364B (zh) 2012-08-29 2013-08-19 製造銀微絲膜之方法

Country Status (7)

Country Link
US (1) US9040114B2 (enExample)
JP (1) JP6235828B2 (enExample)
KR (1) KR20140029270A (enExample)
CN (1) CN103680758B (enExample)
DE (1) DE102013013767A1 (enExample)
FR (1) FR2995125B1 (enExample)
TW (1) TWI516364B (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9148969B2 (en) * 2012-07-30 2015-09-29 Rohm And Haas Electronic Materials Llc Method of manufacturing high aspect ratio silver nanowires
WO2014175163A1 (ja) * 2013-04-26 2014-10-30 昭和電工株式会社 導電パターンの製造方法及び導電パターン形成基板
WO2021229994A1 (ja) * 2020-05-13 2021-11-18 富士フイルム株式会社 アンテナ

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3665969B2 (ja) 2001-03-26 2005-06-29 エイコス・インコーポレーテッド カーボンナノチューブ含有フィルムの製造方法及びカーボンナノチューブ含有コーティング
JP4636454B2 (ja) * 2003-05-13 2011-02-23 三菱マテリアル株式会社 金属ナノロッドの製造方法と用途
EP3473681B1 (en) 2005-08-12 2020-10-07 Cambrios Film Solutions Corporation Nanowires-based transparent conductors
JP2007091959A (ja) * 2005-09-30 2007-04-12 Sumitomo Electric Ind Ltd 異方導電性接着剤
JP4890311B2 (ja) 2007-03-28 2012-03-07 パナソニック株式会社 発光素子
US8212792B2 (en) 2007-08-14 2012-07-03 Tyco Electronics Corporation Touchscreen using oriented microscopic linear conductive elements
JP2009224183A (ja) 2008-03-17 2009-10-01 Fujifilm Corp 金属酸化物微粒子、及び透明導電膜、並びに分散液、及びデバイス
WO2010129604A1 (en) * 2009-05-05 2010-11-11 Cambrios Technologies Corporation Reliable and durable conductive films comprising metal nanostructures
JP5432624B2 (ja) * 2009-07-28 2014-03-05 パナソニック株式会社 透明導電膜付き基材
US20120055013A1 (en) * 2010-07-13 2012-03-08 Féinics AmaTech Nominee Limited Forming microstructures and antennas for transponders
GB2482560A (en) * 2010-08-06 2012-02-08 Stfc Science & Technology Electrospinning or electrospraying composite fibres or vesicles
KR20120111661A (ko) * 2011-04-01 2012-10-10 삼성전자주식회사 신축가능한 전도성 나노섬유, 이를 이용한 신축가능한 섬유전극 및 그 제조방법

Also Published As

Publication number Publication date
FR2995125A1 (fr) 2014-03-07
JP2014055354A (ja) 2014-03-27
DE102013013767A1 (de) 2014-03-06
CN103680758A (zh) 2014-03-26
US9040114B2 (en) 2015-05-26
JP6235828B2 (ja) 2017-11-22
CN103680758B (zh) 2016-08-10
KR20140029270A (ko) 2014-03-10
TW201431673A (zh) 2014-08-16
FR2995125B1 (fr) 2018-02-16
US20140065300A1 (en) 2014-03-06

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