TWI510863B - 真空腔中產生真空的帶電粒子微影設備及方法 - Google Patents

真空腔中產生真空的帶電粒子微影設備及方法 Download PDF

Info

Publication number
TWI510863B
TWI510863B TW099105114A TW99105114A TWI510863B TW I510863 B TWI510863 B TW I510863B TW 099105114 A TW099105114 A TW 099105114A TW 99105114 A TW99105114 A TW 99105114A TW I510863 B TWI510863 B TW I510863B
Authority
TW
Taiwan
Prior art keywords
chamber
vacuum chamber
charged particle
vacuum
door
Prior art date
Application number
TW099105114A
Other languages
English (en)
Chinese (zh)
Other versions
TW201044118A (en
Inventor
Sander Baltussen
Boer Guido De
Tijs Frans Teepen
Remco Jager
Jerry Johannes Martinus Peijster
Nieuwstadt Joris Anne Henri Van
Willem Maurits Weeda
Veen Alexander Hendrik Vincent Van
Original Assignee
Mapper Lithography Ip Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mapper Lithography Ip Bv filed Critical Mapper Lithography Ip Bv
Publication of TW201044118A publication Critical patent/TW201044118A/zh
Application granted granted Critical
Publication of TWI510863B publication Critical patent/TWI510863B/zh

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02Details
    • H01J37/22Optical, image processing or photographic arrangements associated with the tube
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02Details
    • H01J37/16Vessels; Containers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00Manufacture or treatment of nanostructures
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J29/00Details of cathode-ray tubes or of electron-beam tubes of the types covered by group H01J31/00
    • H01J29/86Vessels; Containers; Vacuum locks
    • H01J29/865Vacuum locks
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02Details
    • H01J37/16Vessels; Containers
    • H01J37/165Means associated with the vessel for preventing the generation of or for shielding unwanted radiation, e.g. X-rays
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02Details
    • H01J37/18Vacuum locks ; Means for obtaining or maintaining the desired pressure within the vessel
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02Details
    • H01J37/20Means for supporting or positioning the object or the material; Means for adjusting diaphragms or lenses associated with the support
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/305Electron-beam or ion-beam tubes for localised treatment of objects for casting, melting, evaporating, or etching
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/317Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/317Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
    • H01J37/3174Particle-beam lithography, e.g. electron beam lithography
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/16Vessels

Landscapes

  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Nanotechnology (AREA)
  • Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Mathematical Physics (AREA)
  • Theoretical Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Plasma & Fusion (AREA)
  • Electron Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
TW099105114A 2009-02-22 2010-02-22 真空腔中產生真空的帶電粒子微影設備及方法 TWI510863B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US15441509P 2009-02-22 2009-02-22

Publications (2)

Publication Number Publication Date
TW201044118A TW201044118A (en) 2010-12-16
TWI510863B true TWI510863B (zh) 2015-12-01

Family

ID=42025730

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099105114A TWI510863B (zh) 2009-02-22 2010-02-22 真空腔中產生真空的帶電粒子微影設備及方法

Country Status (7)

Country Link
US (1) US20110042579A1 (https=)
EP (1) EP2399270B1 (https=)
JP (1) JP5680557B2 (https=)
KR (1) KR101545193B1 (https=)
CN (1) CN102422380A (https=)
TW (1) TWI510863B (https=)
WO (1) WO2010094719A1 (https=)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8314483B2 (en) * 2009-01-26 2012-11-20 Taiwan Semiconductor Manufacturing Company, Ltd. On-chip heat spreader
US8586949B2 (en) 2010-11-13 2013-11-19 Mapper Lithography Ip B.V. Charged particle lithography system with intermediate chamber
EP2676168B1 (en) 2011-02-16 2018-09-12 Mapper Lithography IP B.V. System for magnetic shielding
NL2007604C2 (en) * 2011-10-14 2013-05-01 Mapper Lithography Ip Bv Charged particle system comprising a manipulator device for manipulation of one or more charged particle beams.
NL2007392C2 (en) * 2011-09-12 2013-03-13 Mapper Lithography Ip Bv Assembly for providing an aligned stack of two or more modules and a lithography system or a microscopy system comprising such an assembly.
NL2006868C2 (en) 2011-05-30 2012-12-03 Mapper Lithography Ip Bv Charged particle multi-beamlet apparatus.
JP2014530478A (ja) 2011-09-09 2014-11-17 マッパー・リソグラフィー・アイピー・ビー.ブイ. 除振モジュール及び基板処理システム
CN103797420A (zh) * 2011-09-12 2014-05-14 迈普尔平版印刷Ip有限公司 具有基底板的真空腔室
CN106933063B (zh) * 2012-03-20 2019-01-18 迈普尔平版印刷Ip有限公司 电子射束光刻系统
US11348756B2 (en) 2012-05-14 2022-05-31 Asml Netherlands B.V. Aberration correction in charged particle system
CN104428866A (zh) * 2012-05-14 2015-03-18 迈普尔平版印刷Ip有限公司 带电粒子光刻系统和射束产生器
JP2014082327A (ja) * 2012-10-16 2014-05-08 Canon Inc 照射装置、描画装置及び物品の製造方法
NL2010624C2 (en) 2013-04-08 2014-10-09 Mapper Lithography Ip Bv Cabinet for electronic equipment.
CN108962708A (zh) * 2013-11-14 2018-12-07 迈普尔平版印刷Ip有限公司 电极堆栈布置
NL2014430A (en) * 2014-03-13 2015-11-02 Asml Netherlands Bv Radiation Source.
JP6653125B2 (ja) * 2014-05-23 2020-02-26 株式会社ニューフレアテクノロジー マルチ荷電粒子ビーム描画方法及びマルチ荷電粒子ビーム描画装置
EP3155630A4 (en) 2014-06-13 2018-01-24 Intel Corporation Ebeam staggered beam aperture array
US9897908B2 (en) 2014-06-13 2018-02-20 Intel Corporation Ebeam three beam aperture array
EP3155647A4 (en) 2014-06-13 2018-01-24 Intel Corporation Ebeam universal cutter
GB201414395D0 (en) 2014-08-13 2014-09-24 Nikon Metrology Nv X-ray apparatus
US10096450B2 (en) 2015-12-28 2018-10-09 Mapper Lithography Ip B.V. Control system and method for lithography apparatus
US10559408B2 (en) 2016-12-27 2020-02-11 Asml Netherlands B.V. Feedthrough device and signal conductor path arrangement
US10008362B1 (en) 2016-12-27 2018-06-26 Mapper Lithography Ip B.V. Optical fiber feedthrough device and fiber path arrangement
EP3610493A4 (en) * 2017-04-11 2021-07-07 ASML Netherlands B.V. CHARGE PARTICLE SOURCE MODULE
JP6934742B2 (ja) * 2017-04-19 2021-09-15 株式会社ニューフレアテクノロジー マルチ荷電粒子ビーム描画装置及びマルチ荷電粒子ビーム描画方法
EP3734301A1 (en) * 2019-05-03 2020-11-04 Afore Oy Cryogenic wafer prober with movable thermal radiation shield
EP3734303B1 (en) * 2019-05-03 2024-04-03 Afore Oy Cryogenic probe station with loading assembly
JP7391735B2 (ja) * 2019-09-25 2023-12-05 株式会社日立ハイテクサイエンス 荷電粒子ビーム装置
KR20230008209A (ko) 2020-06-10 2023-01-13 에이에스엠엘 네델란즈 비.브이. 하전 입자 장치용 교체 가능 모듈

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60255291A (ja) * 1984-05-31 1985-12-16 Mitsubishi Electric Corp 電子ビ−ム加工装置
JP2002083561A (ja) * 2000-09-06 2002-03-22 Nikon Corp 電子銃及び電子光学鏡筒
JP2002093696A (ja) * 1991-07-04 2002-03-29 Toshiba Corp 荷電ビーム照射方法
JP2002313270A (ja) * 2001-04-16 2002-10-25 Shimadzu Corp 高真空電子線装置及びその排気方法
JP2005005393A (ja) * 2003-06-10 2005-01-06 Canon Inc ステージ装置、露光装置、およびデバイス製造方法
JP2006140267A (ja) * 2004-11-11 2006-06-01 Hitachi High-Technologies Corp 荷電粒子線露光装置
JP2007287546A (ja) * 2006-04-19 2007-11-01 Tokyo Seimitsu Co Ltd 真空容器及び電子線装置

Family Cites Families (43)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3157308A (en) 1961-09-05 1964-11-17 Clark Mfg Co J L Canister type container and method of making the same
US3159408A (en) 1961-10-05 1964-12-01 Grace W R & Co Chuck
US3885932A (en) * 1974-01-10 1975-05-27 Super Products Corp Dust filtration system
GB2159322A (en) * 1984-05-18 1985-11-27 Philips Electronic Associated Electron image projector
US4524308A (en) 1984-06-01 1985-06-18 Sony Corporation Circuits for accomplishing electron beam convergence in color cathode ray tubes
JPS6383756U (https=) * 1986-11-20 1988-06-01
US4833362A (en) * 1988-04-19 1989-05-23 Orchid One Encapsulated high brightness electron beam source and system
US4923544A (en) * 1988-11-02 1990-05-08 Tetrahex, Inc. Method of manufacturing a tetrahexaconal truss structure
US6023068A (en) * 1991-05-30 2000-02-08 Canon Kabushiki Kaisha Semiconductor device manufacturing apparatus
WO1994025880A1 (en) 1993-04-30 1994-11-10 Board Of Regents, The University Of Texas System Megavoltage scanning imager and method for its use
JP2655474B2 (ja) * 1993-12-17 1997-09-17 日本電気株式会社 電子線直接描画方法及びその装置
JPH0936198A (ja) 1995-07-19 1997-02-07 Hitachi Ltd 真空処理装置およびそれを用いた半導体製造ライン
EP0766405A1 (en) 1995-09-29 1997-04-02 STMicroelectronics S.r.l. Successive approximation register without redundancy
JPH10223512A (ja) * 1997-02-10 1998-08-21 Nikon Corp 電子ビーム投影露光装置
US6744268B2 (en) * 1998-08-27 2004-06-01 The Micromanipulator Company, Inc. High resolution analytical probe station
US6943351B2 (en) * 2000-02-19 2005-09-13 Multibeam Systems, Inc. Multi-column charged particle optics assembly
DE60041326D1 (de) * 2000-05-12 2009-02-26 Antonio Giovannetti Federantriebsvorrichtung für Türen, mit regelbarem Hebelarm der Feder
WO2002037526A1 (en) * 2000-11-02 2002-05-10 Ebara Corporation Electron beam apparatus and method for manufacturing semiconductor device comprising the apparatus
US20020145113A1 (en) * 2001-04-09 2002-10-10 Applied Materials, Inc. Optical signal transmission for electron beam imaging apparatus
FI20020025A0 (fi) * 2002-01-08 2002-01-08 4 D Neuroimaging Oy Komposiittiseinõrakenne parannetun magneettisuojauksen aikaansaamiseksi
US6768125B2 (en) * 2002-01-17 2004-07-27 Ims Nanofabrication, Gmbh Maskless particle-beam system for exposing a pattern on a substrate
ATE538412T1 (de) 2002-10-25 2012-01-15 Mapper Lithography Ip Bv Lithographisches system
AU2003276779A1 (en) 2002-10-30 2004-05-25 Mapper Lithography Ip B.V. Electron beam exposure system
KR101068607B1 (ko) 2003-03-10 2011-09-30 마퍼 리쏘그라피 아이피 비.브이. 복수 개의 빔렛 발생 장치
ATE524822T1 (de) 2003-05-28 2011-09-15 Mapper Lithography Ip Bv Belichtungsverfahren für strahlen aus geladenen teilchen
JP4074224B2 (ja) * 2003-06-26 2008-04-09 住友重機械工業株式会社 真空装置及び電子ビーム近接露光装置
ATE381728T1 (de) 2003-07-30 2008-01-15 Mapper Lithography Ip Bv Modulator-schaltkreise
EP1592152A1 (en) * 2004-04-30 2005-11-02 Faculté Polytechnique de Mons Method for characterising an optical fibre link
DE602004031817D1 (de) * 2004-01-21 2011-04-28 Integrated Circuit Testing Strahlenoptische Komponente mit einer teilchenoptischen Linse
US7242456B2 (en) * 2004-05-26 2007-07-10 Asml Holdings N.V. System and method utilizing a lithography tool having modular illumination, pattern generator, and projection optics portions
JP2006114385A (ja) * 2004-10-15 2006-04-27 Toshiba Corp 電子ビーム装置
US7819079B2 (en) 2004-12-22 2010-10-26 Applied Materials, Inc. Cartesian cluster tool configuration for lithography type processes
JP2006203107A (ja) * 2005-01-24 2006-08-03 Toshiba Corp 荷電ビーム描画装置
US20060181689A1 (en) * 2005-02-14 2006-08-17 Nikon Corporation Lithographic-optical systems including isolatable vacuum chambers, and lithography apparatus comprising same
WO2007008792A2 (en) * 2005-07-08 2007-01-18 Nexgensemi Holdings Corporation Apparatus and method for controlled particle beam manufacturing
US7709815B2 (en) 2005-09-16 2010-05-04 Mapper Lithography Ip B.V. Lithography system and projection method
EP1798751A1 (en) * 2005-12-13 2007-06-20 ICT Integrated Circuit Testing Gesellschaft für Halbleiterprüftechnik mbH Protecting aperture for charged particle emitter
US7649613B2 (en) * 2006-03-03 2010-01-19 Asml Netherlands B.V. Lithographic apparatus, method of controlling a component of a lithographic apparatus and device manufacturing method
JP4936368B2 (ja) * 2006-11-21 2012-05-23 株式会社リコー 真空チャンバ及び電子線描画装置
US7903866B2 (en) * 2007-03-29 2011-03-08 Asml Netherlands B.V. Measurement system, lithographic apparatus and method for measuring a position dependent signal of a movable object
US20090079217A1 (en) * 2007-09-26 2009-03-26 Nikesh Bakshi Powered Tailgate Ramp
WO2009099972A2 (en) * 2008-01-31 2009-08-13 D-Wave Systems Inc. Magnetic vacuum systems and devices for use with superconducting-based computing systems
WO2016158421A1 (ja) 2015-04-03 2016-10-06 株式会社日立ハイテクノロジーズ 光量検出装置、それを用いた免疫分析装置および荷電粒子線装置

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60255291A (ja) * 1984-05-31 1985-12-16 Mitsubishi Electric Corp 電子ビ−ム加工装置
JP2002093696A (ja) * 1991-07-04 2002-03-29 Toshiba Corp 荷電ビーム照射方法
JP2002083561A (ja) * 2000-09-06 2002-03-22 Nikon Corp 電子銃及び電子光学鏡筒
JP2002313270A (ja) * 2001-04-16 2002-10-25 Shimadzu Corp 高真空電子線装置及びその排気方法
JP2005005393A (ja) * 2003-06-10 2005-01-06 Canon Inc ステージ装置、露光装置、およびデバイス製造方法
JP2006140267A (ja) * 2004-11-11 2006-06-01 Hitachi High-Technologies Corp 荷電粒子線露光装置
JP2007287546A (ja) * 2006-04-19 2007-11-01 Tokyo Seimitsu Co Ltd 真空容器及び電子線装置

Also Published As

Publication number Publication date
JP2012518897A (ja) 2012-08-16
KR20110131221A (ko) 2011-12-06
TW201044118A (en) 2010-12-16
WO2010094719A1 (en) 2010-08-26
EP2399270B1 (en) 2013-06-12
JP5680557B2 (ja) 2015-03-04
CN102422380A (zh) 2012-04-18
US20110042579A1 (en) 2011-02-24
KR101545193B1 (ko) 2015-08-18
EP2399270A1 (en) 2011-12-28

Similar Documents

Publication Publication Date Title
TWI510863B (zh) 真空腔中產生真空的帶電粒子微影設備及方法
EP2399271B1 (en) Lithography machine and substrate handling arrangement
JP5762981B2 (ja) 荷電粒子リソグラフィ装置と、真空チャンバー内の真空を生成する方法
RU2579533C2 (ru) Литографическая система и способ обработки подложек в такой литографической системе
TWI486723B (zh) 在微影系統中處理基板的方法
JP4885235B2 (ja) 接合装置および接合装置メンテナンス方法
NL2014754B1 (en) Enclosure for a target processing machine.
TWI471891B (zh) 帶電粒子微影機器及基板處理系統

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees