TWI510863B - 真空腔中產生真空的帶電粒子微影設備及方法 - Google Patents
真空腔中產生真空的帶電粒子微影設備及方法 Download PDFInfo
- Publication number
- TWI510863B TWI510863B TW099105114A TW99105114A TWI510863B TW I510863 B TWI510863 B TW I510863B TW 099105114 A TW099105114 A TW 099105114A TW 99105114 A TW99105114 A TW 99105114A TW I510863 B TWI510863 B TW I510863B
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- Taiwan
- Prior art keywords
- chamber
- vacuum chamber
- charged particle
- vacuum
- door
- Prior art date
Links
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- 238000013016 damping Methods 0.000 description 5
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/22—Optical, image processing or photographic arrangements associated with the tube
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/16—Vessels; Containers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J29/00—Details of cathode-ray tubes or of electron-beam tubes of the types covered by group H01J31/00
- H01J29/86—Vessels; Containers; Vacuum locks
- H01J29/865—Vacuum locks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/16—Vessels; Containers
- H01J37/165—Means associated with the vessel for preventing the generation of or for shielding unwanted radiation, e.g. X-rays
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/18—Vacuum locks ; Means for obtaining or maintaining the desired pressure within the vessel
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/20—Means for supporting or positioning the object or the material; Means for adjusting diaphragms or lenses associated with the support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
- H01J37/305—Electron-beam or ion-beam tubes for localised treatment of objects for casting, melting, evaporating, or etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
- H01J37/317—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
- H01J37/317—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
- H01J37/3174—Particle-beam lithography, e.g. electron beam lithography
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/16—Vessels
Landscapes
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Nanotechnology (AREA)
- Physics & Mathematics (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Mathematical Physics (AREA)
- Theoretical Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Plasma & Fusion (AREA)
- Electron Beam Exposure (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US15441509P | 2009-02-22 | 2009-02-22 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201044118A TW201044118A (en) | 2010-12-16 |
| TWI510863B true TWI510863B (zh) | 2015-12-01 |
Family
ID=42025730
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW099105114A TWI510863B (zh) | 2009-02-22 | 2010-02-22 | 真空腔中產生真空的帶電粒子微影設備及方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20110042579A1 (https=) |
| EP (1) | EP2399270B1 (https=) |
| JP (1) | JP5680557B2 (https=) |
| KR (1) | KR101545193B1 (https=) |
| CN (1) | CN102422380A (https=) |
| TW (1) | TWI510863B (https=) |
| WO (1) | WO2010094719A1 (https=) |
Families Citing this family (29)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8314483B2 (en) * | 2009-01-26 | 2012-11-20 | Taiwan Semiconductor Manufacturing Company, Ltd. | On-chip heat spreader |
| US8586949B2 (en) | 2010-11-13 | 2013-11-19 | Mapper Lithography Ip B.V. | Charged particle lithography system with intermediate chamber |
| EP2676168B1 (en) | 2011-02-16 | 2018-09-12 | Mapper Lithography IP B.V. | System for magnetic shielding |
| NL2007604C2 (en) * | 2011-10-14 | 2013-05-01 | Mapper Lithography Ip Bv | Charged particle system comprising a manipulator device for manipulation of one or more charged particle beams. |
| NL2007392C2 (en) * | 2011-09-12 | 2013-03-13 | Mapper Lithography Ip Bv | Assembly for providing an aligned stack of two or more modules and a lithography system or a microscopy system comprising such an assembly. |
| NL2006868C2 (en) | 2011-05-30 | 2012-12-03 | Mapper Lithography Ip Bv | Charged particle multi-beamlet apparatus. |
| JP2014530478A (ja) | 2011-09-09 | 2014-11-17 | マッパー・リソグラフィー・アイピー・ビー.ブイ. | 除振モジュール及び基板処理システム |
| CN103797420A (zh) * | 2011-09-12 | 2014-05-14 | 迈普尔平版印刷Ip有限公司 | 具有基底板的真空腔室 |
| CN106933063B (zh) * | 2012-03-20 | 2019-01-18 | 迈普尔平版印刷Ip有限公司 | 电子射束光刻系统 |
| US11348756B2 (en) | 2012-05-14 | 2022-05-31 | Asml Netherlands B.V. | Aberration correction in charged particle system |
| CN104428866A (zh) * | 2012-05-14 | 2015-03-18 | 迈普尔平版印刷Ip有限公司 | 带电粒子光刻系统和射束产生器 |
| JP2014082327A (ja) * | 2012-10-16 | 2014-05-08 | Canon Inc | 照射装置、描画装置及び物品の製造方法 |
| NL2010624C2 (en) | 2013-04-08 | 2014-10-09 | Mapper Lithography Ip Bv | Cabinet for electronic equipment. |
| CN108962708A (zh) * | 2013-11-14 | 2018-12-07 | 迈普尔平版印刷Ip有限公司 | 电极堆栈布置 |
| NL2014430A (en) * | 2014-03-13 | 2015-11-02 | Asml Netherlands Bv | Radiation Source. |
| JP6653125B2 (ja) * | 2014-05-23 | 2020-02-26 | 株式会社ニューフレアテクノロジー | マルチ荷電粒子ビーム描画方法及びマルチ荷電粒子ビーム描画装置 |
| EP3155630A4 (en) | 2014-06-13 | 2018-01-24 | Intel Corporation | Ebeam staggered beam aperture array |
| US9897908B2 (en) | 2014-06-13 | 2018-02-20 | Intel Corporation | Ebeam three beam aperture array |
| EP3155647A4 (en) | 2014-06-13 | 2018-01-24 | Intel Corporation | Ebeam universal cutter |
| GB201414395D0 (en) | 2014-08-13 | 2014-09-24 | Nikon Metrology Nv | X-ray apparatus |
| US10096450B2 (en) | 2015-12-28 | 2018-10-09 | Mapper Lithography Ip B.V. | Control system and method for lithography apparatus |
| US10559408B2 (en) | 2016-12-27 | 2020-02-11 | Asml Netherlands B.V. | Feedthrough device and signal conductor path arrangement |
| US10008362B1 (en) | 2016-12-27 | 2018-06-26 | Mapper Lithography Ip B.V. | Optical fiber feedthrough device and fiber path arrangement |
| EP3610493A4 (en) * | 2017-04-11 | 2021-07-07 | ASML Netherlands B.V. | CHARGE PARTICLE SOURCE MODULE |
| JP6934742B2 (ja) * | 2017-04-19 | 2021-09-15 | 株式会社ニューフレアテクノロジー | マルチ荷電粒子ビーム描画装置及びマルチ荷電粒子ビーム描画方法 |
| EP3734301A1 (en) * | 2019-05-03 | 2020-11-04 | Afore Oy | Cryogenic wafer prober with movable thermal radiation shield |
| EP3734303B1 (en) * | 2019-05-03 | 2024-04-03 | Afore Oy | Cryogenic probe station with loading assembly |
| JP7391735B2 (ja) * | 2019-09-25 | 2023-12-05 | 株式会社日立ハイテクサイエンス | 荷電粒子ビーム装置 |
| KR20230008209A (ko) | 2020-06-10 | 2023-01-13 | 에이에스엠엘 네델란즈 비.브이. | 하전 입자 장치용 교체 가능 모듈 |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60255291A (ja) * | 1984-05-31 | 1985-12-16 | Mitsubishi Electric Corp | 電子ビ−ム加工装置 |
| JP2002083561A (ja) * | 2000-09-06 | 2002-03-22 | Nikon Corp | 電子銃及び電子光学鏡筒 |
| JP2002093696A (ja) * | 1991-07-04 | 2002-03-29 | Toshiba Corp | 荷電ビーム照射方法 |
| JP2002313270A (ja) * | 2001-04-16 | 2002-10-25 | Shimadzu Corp | 高真空電子線装置及びその排気方法 |
| JP2005005393A (ja) * | 2003-06-10 | 2005-01-06 | Canon Inc | ステージ装置、露光装置、およびデバイス製造方法 |
| JP2006140267A (ja) * | 2004-11-11 | 2006-06-01 | Hitachi High-Technologies Corp | 荷電粒子線露光装置 |
| JP2007287546A (ja) * | 2006-04-19 | 2007-11-01 | Tokyo Seimitsu Co Ltd | 真空容器及び電子線装置 |
Family Cites Families (43)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3157308A (en) | 1961-09-05 | 1964-11-17 | Clark Mfg Co J L | Canister type container and method of making the same |
| US3159408A (en) | 1961-10-05 | 1964-12-01 | Grace W R & Co | Chuck |
| US3885932A (en) * | 1974-01-10 | 1975-05-27 | Super Products Corp | Dust filtration system |
| GB2159322A (en) * | 1984-05-18 | 1985-11-27 | Philips Electronic Associated | Electron image projector |
| US4524308A (en) | 1984-06-01 | 1985-06-18 | Sony Corporation | Circuits for accomplishing electron beam convergence in color cathode ray tubes |
| JPS6383756U (https=) * | 1986-11-20 | 1988-06-01 | ||
| US4833362A (en) * | 1988-04-19 | 1989-05-23 | Orchid One | Encapsulated high brightness electron beam source and system |
| US4923544A (en) * | 1988-11-02 | 1990-05-08 | Tetrahex, Inc. | Method of manufacturing a tetrahexaconal truss structure |
| US6023068A (en) * | 1991-05-30 | 2000-02-08 | Canon Kabushiki Kaisha | Semiconductor device manufacturing apparatus |
| WO1994025880A1 (en) | 1993-04-30 | 1994-11-10 | Board Of Regents, The University Of Texas System | Megavoltage scanning imager and method for its use |
| JP2655474B2 (ja) * | 1993-12-17 | 1997-09-17 | 日本電気株式会社 | 電子線直接描画方法及びその装置 |
| JPH0936198A (ja) | 1995-07-19 | 1997-02-07 | Hitachi Ltd | 真空処理装置およびそれを用いた半導体製造ライン |
| EP0766405A1 (en) | 1995-09-29 | 1997-04-02 | STMicroelectronics S.r.l. | Successive approximation register without redundancy |
| JPH10223512A (ja) * | 1997-02-10 | 1998-08-21 | Nikon Corp | 電子ビーム投影露光装置 |
| US6744268B2 (en) * | 1998-08-27 | 2004-06-01 | The Micromanipulator Company, Inc. | High resolution analytical probe station |
| US6943351B2 (en) * | 2000-02-19 | 2005-09-13 | Multibeam Systems, Inc. | Multi-column charged particle optics assembly |
| DE60041326D1 (de) * | 2000-05-12 | 2009-02-26 | Antonio Giovannetti | Federantriebsvorrichtung für Türen, mit regelbarem Hebelarm der Feder |
| WO2002037526A1 (en) * | 2000-11-02 | 2002-05-10 | Ebara Corporation | Electron beam apparatus and method for manufacturing semiconductor device comprising the apparatus |
| US20020145113A1 (en) * | 2001-04-09 | 2002-10-10 | Applied Materials, Inc. | Optical signal transmission for electron beam imaging apparatus |
| FI20020025A0 (fi) * | 2002-01-08 | 2002-01-08 | 4 D Neuroimaging Oy | Komposiittiseinõrakenne parannetun magneettisuojauksen aikaansaamiseksi |
| US6768125B2 (en) * | 2002-01-17 | 2004-07-27 | Ims Nanofabrication, Gmbh | Maskless particle-beam system for exposing a pattern on a substrate |
| ATE538412T1 (de) | 2002-10-25 | 2012-01-15 | Mapper Lithography Ip Bv | Lithographisches system |
| AU2003276779A1 (en) | 2002-10-30 | 2004-05-25 | Mapper Lithography Ip B.V. | Electron beam exposure system |
| KR101068607B1 (ko) | 2003-03-10 | 2011-09-30 | 마퍼 리쏘그라피 아이피 비.브이. | 복수 개의 빔렛 발생 장치 |
| ATE524822T1 (de) | 2003-05-28 | 2011-09-15 | Mapper Lithography Ip Bv | Belichtungsverfahren für strahlen aus geladenen teilchen |
| JP4074224B2 (ja) * | 2003-06-26 | 2008-04-09 | 住友重機械工業株式会社 | 真空装置及び電子ビーム近接露光装置 |
| ATE381728T1 (de) | 2003-07-30 | 2008-01-15 | Mapper Lithography Ip Bv | Modulator-schaltkreise |
| EP1592152A1 (en) * | 2004-04-30 | 2005-11-02 | Faculté Polytechnique de Mons | Method for characterising an optical fibre link |
| DE602004031817D1 (de) * | 2004-01-21 | 2011-04-28 | Integrated Circuit Testing | Strahlenoptische Komponente mit einer teilchenoptischen Linse |
| US7242456B2 (en) * | 2004-05-26 | 2007-07-10 | Asml Holdings N.V. | System and method utilizing a lithography tool having modular illumination, pattern generator, and projection optics portions |
| JP2006114385A (ja) * | 2004-10-15 | 2006-04-27 | Toshiba Corp | 電子ビーム装置 |
| US7819079B2 (en) | 2004-12-22 | 2010-10-26 | Applied Materials, Inc. | Cartesian cluster tool configuration for lithography type processes |
| JP2006203107A (ja) * | 2005-01-24 | 2006-08-03 | Toshiba Corp | 荷電ビーム描画装置 |
| US20060181689A1 (en) * | 2005-02-14 | 2006-08-17 | Nikon Corporation | Lithographic-optical systems including isolatable vacuum chambers, and lithography apparatus comprising same |
| WO2007008792A2 (en) * | 2005-07-08 | 2007-01-18 | Nexgensemi Holdings Corporation | Apparatus and method for controlled particle beam manufacturing |
| US7709815B2 (en) | 2005-09-16 | 2010-05-04 | Mapper Lithography Ip B.V. | Lithography system and projection method |
| EP1798751A1 (en) * | 2005-12-13 | 2007-06-20 | ICT Integrated Circuit Testing Gesellschaft für Halbleiterprüftechnik mbH | Protecting aperture for charged particle emitter |
| US7649613B2 (en) * | 2006-03-03 | 2010-01-19 | Asml Netherlands B.V. | Lithographic apparatus, method of controlling a component of a lithographic apparatus and device manufacturing method |
| JP4936368B2 (ja) * | 2006-11-21 | 2012-05-23 | 株式会社リコー | 真空チャンバ及び電子線描画装置 |
| US7903866B2 (en) * | 2007-03-29 | 2011-03-08 | Asml Netherlands B.V. | Measurement system, lithographic apparatus and method for measuring a position dependent signal of a movable object |
| US20090079217A1 (en) * | 2007-09-26 | 2009-03-26 | Nikesh Bakshi | Powered Tailgate Ramp |
| WO2009099972A2 (en) * | 2008-01-31 | 2009-08-13 | D-Wave Systems Inc. | Magnetic vacuum systems and devices for use with superconducting-based computing systems |
| WO2016158421A1 (ja) | 2015-04-03 | 2016-10-06 | 株式会社日立ハイテクノロジーズ | 光量検出装置、それを用いた免疫分析装置および荷電粒子線装置 |
-
2010
- 2010-02-17 CN CN2010800178733A patent/CN102422380A/zh active Pending
- 2010-02-17 WO PCT/EP2010/052004 patent/WO2010094719A1/en not_active Ceased
- 2010-02-17 KR KR1020117022182A patent/KR101545193B1/ko not_active Expired - Fee Related
- 2010-02-17 EP EP10704819.1A patent/EP2399270B1/en active Active
- 2010-02-17 JP JP2011550551A patent/JP5680557B2/ja not_active Expired - Fee Related
- 2010-02-19 US US12/708,544 patent/US20110042579A1/en not_active Abandoned
- 2010-02-22 TW TW099105114A patent/TWI510863B/zh not_active IP Right Cessation
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60255291A (ja) * | 1984-05-31 | 1985-12-16 | Mitsubishi Electric Corp | 電子ビ−ム加工装置 |
| JP2002093696A (ja) * | 1991-07-04 | 2002-03-29 | Toshiba Corp | 荷電ビーム照射方法 |
| JP2002083561A (ja) * | 2000-09-06 | 2002-03-22 | Nikon Corp | 電子銃及び電子光学鏡筒 |
| JP2002313270A (ja) * | 2001-04-16 | 2002-10-25 | Shimadzu Corp | 高真空電子線装置及びその排気方法 |
| JP2005005393A (ja) * | 2003-06-10 | 2005-01-06 | Canon Inc | ステージ装置、露光装置、およびデバイス製造方法 |
| JP2006140267A (ja) * | 2004-11-11 | 2006-06-01 | Hitachi High-Technologies Corp | 荷電粒子線露光装置 |
| JP2007287546A (ja) * | 2006-04-19 | 2007-11-01 | Tokyo Seimitsu Co Ltd | 真空容器及び電子線装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2012518897A (ja) | 2012-08-16 |
| KR20110131221A (ko) | 2011-12-06 |
| TW201044118A (en) | 2010-12-16 |
| WO2010094719A1 (en) | 2010-08-26 |
| EP2399270B1 (en) | 2013-06-12 |
| JP5680557B2 (ja) | 2015-03-04 |
| CN102422380A (zh) | 2012-04-18 |
| US20110042579A1 (en) | 2011-02-24 |
| KR101545193B1 (ko) | 2015-08-18 |
| EP2399270A1 (en) | 2011-12-28 |
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