TWI502282B - 驅動微鏡之方法及裝置 - Google Patents
驅動微鏡之方法及裝置 Download PDFInfo
- Publication number
- TWI502282B TWI502282B TW098133956A TW98133956A TWI502282B TW I502282 B TWI502282 B TW I502282B TW 098133956 A TW098133956 A TW 098133956A TW 98133956 A TW98133956 A TW 98133956A TW I502282 B TWI502282 B TW I502282B
- Authority
- TW
- Taiwan
- Prior art keywords
- tilt
- micromirror
- control
- actuators
- control signals
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims description 62
- 239000013598 vector Substances 0.000 claims description 84
- 238000005286 illumination Methods 0.000 claims description 63
- 238000004364 calculation method Methods 0.000 claims description 21
- 230000006870 function Effects 0.000 claims description 18
- 238000009826 distribution Methods 0.000 claims description 15
- 238000005259 measurement Methods 0.000 claims description 12
- 238000004422 calculation algorithm Methods 0.000 claims description 7
- 230000011664 signaling Effects 0.000 claims 1
- 230000000694 effects Effects 0.000 description 6
- 239000000725 suspension Substances 0.000 description 6
- 238000003491 array Methods 0.000 description 5
- 239000011159 matrix material Substances 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000000691 measurement method Methods 0.000 description 3
- 238000012544 monitoring process Methods 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 210000001747 pupil Anatomy 0.000 description 3
- 238000012937 correction Methods 0.000 description 2
- 230000009977 dual effect Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000004044 response Effects 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- 238000011144 upstream manufacturing Methods 0.000 description 2
- 230000001133 acceleration Effects 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000005094 computer simulation Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000001627 detrimental effect Effects 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012634 optical imaging Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 238000005381 potential energy Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000013139 quantization Methods 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70058—Mask illumination systems
- G03F7/70091—Illumination settings, i.e. intensity distribution in the pupil plane or angular distribution in the field plane; On-axis or off-axis settings, e.g. annular, dipole or quadrupole settings; Partial coherence control, i.e. sigma or numerical aperture [NA]
- G03F7/70116—Off-axis setting using a programmable means, e.g. liquid crystal display [LCD], digital micromirror device [DMD] or pupil facets
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
- G02B26/0816—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements
- G02B26/0833—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD
- G02B26/0841—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD the reflecting element being moved or deformed by electrostatic means
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/0025—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 for optical correction, e.g. distorsion, aberration
- G02B27/0037—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 for optical correction, e.g. distorsion, aberration with diffracting elements
- G02B27/0043—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 for optical correction, e.g. distorsion, aberration with diffracting elements in projection exposure systems, e.g. microlithographic systems
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B27/00—Photographic printing apparatus
- G03B27/72—Controlling or varying light intensity, spectral composition, or exposure time in photographic printing apparatus
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70058—Mask illumination systems
- G03F7/70075—Homogenization of illumination intensity in the mask plane by using an integrator, e.g. fly's eye lens, facet mirror or glass rod, by using a diffusing optical element or by beam deflection
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70058—Mask illumination systems
- G03F7/702—Reflective illumination, i.e. reflective optical elements other than folding mirrors, e.g. extreme ultraviolet [EUV] illumination systems
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
- G03F7/70525—Controlling normal operating mode, e.g. matching different apparatus, remote control or prediction of failure
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Mechanical Light Control Or Optical Switches (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Micromachines (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102008050446A DE102008050446B4 (de) | 2008-10-08 | 2008-10-08 | Verfahren und Vorrichtungen zur Ansteuerung von Mikrospiegeln |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201019051A TW201019051A (en) | 2010-05-16 |
| TWI502282B true TWI502282B (zh) | 2015-10-01 |
Family
ID=41821122
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW098133956A TWI502282B (zh) | 2008-10-08 | 2009-10-07 | 驅動微鏡之方法及裝置 |
Country Status (8)
| Country | Link |
|---|---|
| US (2) | US8345224B2 (enExample) |
| EP (2) | EP3193203B1 (enExample) |
| JP (1) | JP5325301B2 (enExample) |
| KR (1) | KR101233900B1 (enExample) |
| CN (2) | CN104267495B (enExample) |
| DE (1) | DE102008050446B4 (enExample) |
| TW (1) | TWI502282B (enExample) |
| WO (1) | WO2010040506A1 (enExample) |
Families Citing this family (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102008050446B4 (de) | 2008-10-08 | 2011-07-28 | Carl Zeiss SMT GmbH, 73447 | Verfahren und Vorrichtungen zur Ansteuerung von Mikrospiegeln |
| CN102349026B (zh) | 2009-03-13 | 2015-07-29 | 卡尔蔡司Smt有限责任公司 | 微光刻投射曝光设备 |
| DE102010062720B4 (de) | 2010-12-09 | 2012-07-12 | Carl Zeiss Smt Gmbh | EUV-Lithographiesystem |
| WO2012169089A1 (ja) | 2011-06-07 | 2012-12-13 | 株式会社ニコン | 照明光学系、露光装置、デバイス製造方法、および偏光ユニット |
| TWI587002B (zh) | 2011-06-13 | 2017-06-11 | 尼康股份有限公司 | 照明方法 |
| WO2013061858A1 (ja) | 2011-10-24 | 2013-05-02 | 株式会社ニコン | 照明光学系、露光装置、およびデバイス製造方法 |
| US9732934B2 (en) | 2011-10-28 | 2017-08-15 | Nikon Corporation | Illumination device for optimizing polarization in an illumination pupil |
| JP5918858B2 (ja) | 2011-11-15 | 2016-05-18 | カール・ツァイス・エスエムティー・ゲーエムベーハー | マイクロリソグラフィ投影露光装置の光変調器及び照明系 |
| DE102013201506A1 (de) | 2012-02-17 | 2013-08-22 | Carl Zeiss Smt Gmbh | Optisches Bauelement |
| DE102013201509A1 (de) | 2012-02-17 | 2013-08-22 | Carl Zeiss Smt Gmbh | Optisches Bauelement |
| JPWO2013164997A1 (ja) | 2012-05-02 | 2015-12-24 | 株式会社ニコン | 瞳輝度分布の評価方法および改善方法、照明光学系およびその調整方法、露光装置、露光方法、並びにデバイス製造方法 |
| DE102012011202A1 (de) * | 2012-06-06 | 2013-09-12 | Carl Zeiss Smt Gmbh | Projektor und Verfahren zum Erzeugen eines Bildes |
| JP6246907B2 (ja) * | 2013-05-22 | 2017-12-13 | カール・ツァイス・エスエムティー・ゲーエムベーハー | 光学素子及び当該光学素子に対する放射の影響を低減する手段を備えた光学コンポーネント |
| DE102013212613B4 (de) * | 2013-06-28 | 2015-07-23 | Carl Zeiss Sms Gmbh | Beleuchtungsoptik für ein Metrologiesystem sowie Metrologiesystem mit einer derartigen Beleuchtungsoptik |
| JP6273109B2 (ja) * | 2013-08-28 | 2018-01-31 | 株式会社ミツトヨ | 光干渉測定装置 |
| DE102014203188A1 (de) * | 2014-02-21 | 2015-08-27 | Carl Zeiss Smt Gmbh | Verfahren zur Beleuchtung eines Objektfeldes einer Projektionsbelichtungsanlage |
| CN104111592B (zh) * | 2014-08-06 | 2016-06-08 | 中国科学院光电技术研究所 | 一种基于微反射镜阵列实现可变自由照明光瞳的方法 |
| CN105573061B (zh) * | 2014-10-16 | 2018-03-06 | 中芯国际集成电路制造(上海)有限公司 | Euv光源和曝光装置 |
| DE102017217164B4 (de) | 2017-09-27 | 2020-10-15 | Continental Automotive Gmbh | Projektionsvorrichtung zum Erzeugen eines pixelbasierten Beleuchtungsmusters |
| DE102018202421B3 (de) | 2018-02-16 | 2019-07-11 | Carl Zeiss Microscopy Gmbh | Vielstrahl-Teilchenstrahlsystem |
| DE102018216344A1 (de) * | 2018-09-25 | 2020-03-26 | Carl Zeiss Smt Gmbh | Abstützung eines optischen elements |
| CN110347082B (zh) * | 2019-07-12 | 2021-07-27 | 中国科学院上海微系统与信息技术研究所 | 一种驱动电路、驱动方法及微反射镜阵列 |
| CN110954142B (zh) * | 2019-12-10 | 2021-12-28 | 京东方科技集团股份有限公司 | 一种光学微电机传感器、基板及电子设备 |
| CN114660880A (zh) * | 2022-04-11 | 2022-06-24 | 长沙沃默科技有限公司 | 一种反射式投影成像装置及其设计方法 |
| CN116698367A (zh) * | 2023-05-23 | 2023-09-05 | 上海镭望光学科技有限公司 | 微反射镜阵列反射光光斑位置标定方法、装置及标定设备 |
| DE102023207368A1 (de) * | 2023-08-01 | 2025-02-06 | Carl Zeiss Smt Gmbh | Ansteuervorrichtung, optisches system und lithographieanlage |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030189389A1 (en) * | 2002-03-06 | 2003-10-09 | Glimmerglass Networks, Inc. | Method and apparatus for actuation of a two-axis MEMS device using three actuation elements |
| EP1367446A1 (en) * | 2002-05-31 | 2003-12-03 | ASML Netherlands B.V. | Lithographic apparatus |
Family Cites Families (29)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6312134B1 (en) * | 1996-07-25 | 2001-11-06 | Anvik Corporation | Seamless, maskless lithography system using spatial light modulator |
| JP2863502B2 (ja) * | 1996-10-23 | 1999-03-03 | 防衛庁技術研究本部長 | マルチディザー方式補償光学装置 |
| US7006595B2 (en) * | 1998-05-05 | 2006-02-28 | Carl Zeiss Semiconductor Manufacturing Technologies Ag | Illumination system particularly for microlithography |
| KR100716946B1 (ko) | 2000-07-20 | 2007-05-10 | 삼성전자주식회사 | 마이크로미러 액추에이터를 이용한 광결합 구조체 |
| KR100332888B1 (ko) | 2000-08-25 | 2002-04-15 | 이형도 | 마이크로 미러를 이용한 광 픽업 액츄에이터 |
| US6300665B1 (en) | 2000-09-28 | 2001-10-09 | Xerox Corporation | Structure for an optical switch on a silicon on insulator substrate |
| JP2002189176A (ja) * | 2000-12-20 | 2002-07-05 | Mitsubishi Electric Corp | ミラー駆動装置 |
| KR100389865B1 (ko) * | 2001-03-02 | 2003-07-04 | 삼성전자주식회사 | 마이크로미러 디바이스 및 이를 채용한 프로젝터 |
| US6735004B1 (en) * | 2001-03-15 | 2004-05-11 | Nanogear, Inc. | Rotatable counterbalanced actuator |
| JP3724432B2 (ja) * | 2001-04-19 | 2005-12-07 | 株式会社ニコン | 薄膜弾性構造体及びその製造方法並びにこれを用いたミラーデバイス及び光スイッチ |
| JP3908503B2 (ja) * | 2001-10-30 | 2007-04-25 | 富士通株式会社 | 光スイッチ |
| US6643053B2 (en) * | 2002-02-20 | 2003-11-04 | The Regents Of The University Of California | Piecewise linear spatial phase modulator using dual-mode micromirror arrays for temporal and diffractive fourier optics |
| US6707534B2 (en) * | 2002-05-10 | 2004-03-16 | Anvik Corporation | Maskless conformable lithography |
| KR100464320B1 (ko) * | 2002-11-19 | 2004-12-31 | 삼성전자주식회사 | 마이크로미러 액츄에이터 및 그 제조방법 |
| US6906848B2 (en) * | 2003-02-24 | 2005-06-14 | Exajoule, Llc | Micromirror systems with concealed multi-piece hinge structures |
| JP4244156B2 (ja) * | 2003-05-07 | 2009-03-25 | 富士フイルム株式会社 | 投影露光装置 |
| JP4357317B2 (ja) * | 2003-05-13 | 2009-11-04 | 富士通株式会社 | ティルトミラーの制御装置及び制御方法 |
| US7714983B2 (en) * | 2003-09-12 | 2010-05-11 | Carl Zeiss Smt Ag | Illumination system for a microlithography projection exposure installation |
| DE10343333A1 (de) * | 2003-09-12 | 2005-04-14 | Carl Zeiss Smt Ag | Beleuchtungssystem für eine Mikrolithographie-Projektionsbelichtungsanlage |
| US7646528B2 (en) * | 2006-12-26 | 2010-01-12 | Silicon Quest Kabushiki-Kaisha | Deformable mirror device with oscillating states |
| US7304783B2 (en) * | 2003-11-01 | 2007-12-04 | Fusao Ishii | Control of micromirrors with intermediate states |
| WO2005085125A1 (ja) * | 2004-03-08 | 2005-09-15 | Matsushita Electric Industrial Co., Ltd. | マイクロアクチュエータ、およびマイクロアクチュエータを備えた装置 |
| US7855825B2 (en) | 2005-04-15 | 2010-12-21 | Panasonic Corporation | Micromachine structure system and method for manufacturing same |
| JP2007264305A (ja) * | 2006-03-28 | 2007-10-11 | Fujitsu Ltd | 光スイッチシステム |
| DE102006020734A1 (de) * | 2006-05-04 | 2007-11-15 | Carl Zeiss Smt Ag | Beleuchtungssystem für die EUV-Lithographie sowie erstes und zweites optisches Element zum Einsatz in einem derartigen Beleuchtungssystem |
| US9250536B2 (en) * | 2007-03-30 | 2016-02-02 | Asml Netherlands B.V. | Lithographic apparatus and method |
| CN101796460B (zh) * | 2007-08-30 | 2013-05-01 | 卡尔蔡司Smt有限责任公司 | 微光刻投射曝光设备中用于照明掩模的照明系统 |
| CN103034075B (zh) * | 2007-12-21 | 2015-07-08 | 卡尔蔡司Smt有限责任公司 | 微光刻投射曝光设备的照明系统 |
| DE102008050446B4 (de) | 2008-10-08 | 2011-07-28 | Carl Zeiss SMT GmbH, 73447 | Verfahren und Vorrichtungen zur Ansteuerung von Mikrospiegeln |
-
2008
- 2008-10-08 DE DE102008050446A patent/DE102008050446B4/de active Active
-
2009
- 2009-10-06 EP EP17157830.5A patent/EP3193203B1/en active Active
- 2009-10-06 WO PCT/EP2009/007175 patent/WO2010040506A1/en not_active Ceased
- 2009-10-06 KR KR1020117010412A patent/KR101233900B1/ko active Active
- 2009-10-06 JP JP2011530409A patent/JP5325301B2/ja active Active
- 2009-10-06 CN CN201410453043.5A patent/CN104267495B/zh active Active
- 2009-10-06 CN CN2009801398210A patent/CN102177460A/zh active Pending
- 2009-10-06 EP EP09744324.6A patent/EP2340456B1/en active Active
- 2009-10-07 TW TW098133956A patent/TWI502282B/zh active
-
2011
- 2011-03-02 US US13/038,734 patent/US8345224B2/en active Active
-
2012
- 2012-11-28 US US13/687,887 patent/US10061202B2/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030189389A1 (en) * | 2002-03-06 | 2003-10-09 | Glimmerglass Networks, Inc. | Method and apparatus for actuation of a two-axis MEMS device using three actuation elements |
| EP1367446A1 (en) * | 2002-05-31 | 2003-12-03 | ASML Netherlands B.V. | Lithographic apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| JP5325301B2 (ja) | 2013-10-23 |
| KR101233900B1 (ko) | 2013-02-15 |
| DE102008050446A1 (de) | 2010-04-15 |
| CN104267495A (zh) | 2015-01-07 |
| TW201019051A (en) | 2010-05-16 |
| CN102177460A (zh) | 2011-09-07 |
| KR20110067156A (ko) | 2011-06-21 |
| US20130088698A1 (en) | 2013-04-11 |
| US20110188017A1 (en) | 2011-08-04 |
| JP2012505533A (ja) | 2012-03-01 |
| EP2340456A1 (en) | 2011-07-06 |
| CN104267495B (zh) | 2016-12-07 |
| DE102008050446B4 (de) | 2011-07-28 |
| US8345224B2 (en) | 2013-01-01 |
| WO2010040506A1 (en) | 2010-04-15 |
| EP3193203B1 (en) | 2018-08-29 |
| EP3193203A1 (en) | 2017-07-19 |
| EP2340456B1 (en) | 2017-04-05 |
| US10061202B2 (en) | 2018-08-28 |
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