TWI499871B - Exposure apparatus and exposure method - Google Patents
Exposure apparatus and exposure method Download PDFInfo
- Publication number
- TWI499871B TWI499871B TW102112427A TW102112427A TWI499871B TW I499871 B TWI499871 B TW I499871B TW 102112427 A TW102112427 A TW 102112427A TW 102112427 A TW102112427 A TW 102112427A TW I499871 B TWI499871 B TW I499871B
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- exposure
- substrates
- loading
- mask
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
- H01L21/67225—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one lithography chamber
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012087316 | 2012-04-06 | ||
JP2013078998A JP2013231962A (ja) | 2012-04-06 | 2013-04-04 | 露光装置及び露光方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201346454A TW201346454A (zh) | 2013-11-16 |
TWI499871B true TWI499871B (zh) | 2015-09-11 |
Family
ID=49300624
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW102112427A TWI499871B (zh) | 2012-04-06 | 2013-04-08 | Exposure apparatus and exposure method |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP2013231962A (ja) |
KR (1) | KR101700019B1 (ja) |
TW (1) | TWI499871B (ja) |
WO (1) | WO2013151146A1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017211533A (ja) * | 2016-05-26 | 2017-11-30 | 株式会社サーマプレシジョン | 投影露光装置及びその投影露光方法 |
CN116339082B (zh) * | 2023-05-30 | 2023-08-15 | 广东科视光学技术股份有限公司 | 一种全自动双装载台曝光机系统 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1164437A2 (en) * | 2000-06-15 | 2001-12-19 | Nikon Corporation | Lithographic system |
US20070272151A1 (en) * | 2004-08-12 | 2007-11-29 | Nikon Corporation | Substrate Processing System, Method of Confirmation of Its State of Use, and Method of Prevention of Illicit Use |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS52154370A (en) * | 1976-06-18 | 1977-12-22 | Hitachi Ltd | Photo resist film treatment apparatus of semiconductor wafers |
JP2893222B2 (ja) * | 1991-06-12 | 1999-05-17 | 菱和株式会社 | 包装機への物品の自動整列供給方法と装置 |
JP3203719B2 (ja) | 1991-12-26 | 2001-08-27 | 株式会社ニコン | 露光装置、その露光装置により製造されるデバイス、露光方法、およびその露光方法を用いたデバイス製造方法 |
JP2000321545A (ja) * | 1999-03-05 | 2000-11-24 | Ricoh Co Ltd | 液晶パネル検査装置 |
JP4538884B2 (ja) | 2000-03-08 | 2010-09-08 | 凸版印刷株式会社 | 大型基板の露光装置 |
JP4044722B2 (ja) * | 2000-10-10 | 2008-02-06 | 上村工業株式会社 | 板状ワークの搬送方向変換装置 |
JP2002277502A (ja) * | 2001-01-12 | 2002-09-25 | Nidec-Read Corp | 基板検査装置及び基板検査方法 |
JP2004319889A (ja) * | 2003-04-18 | 2004-11-11 | Seiko Epson Corp | 製造対象物の受け渡し装置および製造対象物の受け渡し方法 |
JP4300067B2 (ja) | 2003-07-02 | 2009-07-22 | 株式会社日立ハイテクノロジーズ | 基板搬送装置、基板搬送方法、及び半導体デバイスの製造方法 |
DE112005001989T5 (de) | 2004-08-17 | 2007-08-02 | Mattson Technology Inc., Fremont | Kostengünstige Prozessierplattform mit hohem Durchsatz |
JP5189035B2 (ja) * | 2004-12-30 | 2013-04-24 | エーエスエムエル ネザーランズ ビー.ブイ. | 基板ハンドラ |
JP4638755B2 (ja) * | 2005-03-25 | 2011-02-23 | 大日本印刷株式会社 | 露光装置および露光方法 |
TW200815935A (en) * | 2006-05-31 | 2008-04-01 | Nsk Ltd | Exposure device and method |
JP2007322706A (ja) * | 2006-05-31 | 2007-12-13 | Nsk Ltd | 露光装置及び露光方法 |
JP4957133B2 (ja) * | 2006-09-11 | 2012-06-20 | 株式会社Ihi | 基板搬送装置及び基板搬送方法 |
WO2009037754A1 (ja) * | 2007-09-19 | 2009-03-26 | Hirata Corporation | 基板搬送システム |
JP4312248B2 (ja) | 2008-02-06 | 2009-08-12 | 株式会社日立ハイテクノロジーズ | プロキシミティ露光装置及び基板製造方法 |
JP4312247B2 (ja) | 2008-02-06 | 2009-08-12 | 株式会社日立ハイテクノロジーズ | プロキシミティ露光装置及び基板製造方法 |
JP5577730B2 (ja) * | 2010-02-15 | 2014-08-27 | Nskテクノロジー株式会社 | 近接露光装置及び近接露光方法 |
-
2013
- 2013-04-04 KR KR1020147028124A patent/KR101700019B1/ko active IP Right Grant
- 2013-04-04 JP JP2013078998A patent/JP2013231962A/ja active Pending
- 2013-04-04 WO PCT/JP2013/060400 patent/WO2013151146A1/ja active Application Filing
- 2013-04-08 TW TW102112427A patent/TWI499871B/zh not_active IP Right Cessation
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1164437A2 (en) * | 2000-06-15 | 2001-12-19 | Nikon Corporation | Lithographic system |
US20070272151A1 (en) * | 2004-08-12 | 2007-11-29 | Nikon Corporation | Substrate Processing System, Method of Confirmation of Its State of Use, and Method of Prevention of Illicit Use |
Also Published As
Publication number | Publication date |
---|---|
KR20140139543A (ko) | 2014-12-05 |
WO2013151146A1 (ja) | 2013-10-10 |
TW201346454A (zh) | 2013-11-16 |
KR101700019B1 (ko) | 2017-02-13 |
JP2013231962A (ja) | 2013-11-14 |
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Legal Events
Date | Code | Title | Description |
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MM4A | Annulment or lapse of patent due to non-payment of fees |