TWI499871B - Exposure apparatus and exposure method - Google Patents

Exposure apparatus and exposure method Download PDF

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Publication number
TWI499871B
TWI499871B TW102112427A TW102112427A TWI499871B TW I499871 B TWI499871 B TW I499871B TW 102112427 A TW102112427 A TW 102112427A TW 102112427 A TW102112427 A TW 102112427A TW I499871 B TWI499871 B TW I499871B
Authority
TW
Taiwan
Prior art keywords
substrate
exposure
substrates
loading
mask
Prior art date
Application number
TW102112427A
Other languages
English (en)
Chinese (zh)
Other versions
TW201346454A (zh
Inventor
Motoyasu Suzuki
Takahiro Nishikawa
Original Assignee
Nsk Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nsk Technology Co Ltd filed Critical Nsk Technology Co Ltd
Publication of TW201346454A publication Critical patent/TW201346454A/zh
Application granted granted Critical
Publication of TWI499871B publication Critical patent/TWI499871B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H01L21/67225—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one lithography chamber

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
TW102112427A 2012-04-06 2013-04-08 Exposure apparatus and exposure method TWI499871B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012087316 2012-04-06
JP2013078998A JP2013231962A (ja) 2012-04-06 2013-04-04 露光装置及び露光方法

Publications (2)

Publication Number Publication Date
TW201346454A TW201346454A (zh) 2013-11-16
TWI499871B true TWI499871B (zh) 2015-09-11

Family

ID=49300624

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102112427A TWI499871B (zh) 2012-04-06 2013-04-08 Exposure apparatus and exposure method

Country Status (4)

Country Link
JP (1) JP2013231962A (ja)
KR (1) KR101700019B1 (ja)
TW (1) TWI499871B (ja)
WO (1) WO2013151146A1 (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017211533A (ja) * 2016-05-26 2017-11-30 株式会社サーマプレシジョン 投影露光装置及びその投影露光方法
CN116339082B (zh) * 2023-05-30 2023-08-15 广东科视光学技术股份有限公司 一种全自动双装载台曝光机系统

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1164437A2 (en) * 2000-06-15 2001-12-19 Nikon Corporation Lithographic system
US20070272151A1 (en) * 2004-08-12 2007-11-29 Nikon Corporation Substrate Processing System, Method of Confirmation of Its State of Use, and Method of Prevention of Illicit Use

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52154370A (en) * 1976-06-18 1977-12-22 Hitachi Ltd Photo resist film treatment apparatus of semiconductor wafers
JP2893222B2 (ja) * 1991-06-12 1999-05-17 菱和株式会社 包装機への物品の自動整列供給方法と装置
JP3203719B2 (ja) 1991-12-26 2001-08-27 株式会社ニコン 露光装置、その露光装置により製造されるデバイス、露光方法、およびその露光方法を用いたデバイス製造方法
JP2000321545A (ja) * 1999-03-05 2000-11-24 Ricoh Co Ltd 液晶パネル検査装置
JP4538884B2 (ja) 2000-03-08 2010-09-08 凸版印刷株式会社 大型基板の露光装置
JP4044722B2 (ja) * 2000-10-10 2008-02-06 上村工業株式会社 板状ワークの搬送方向変換装置
JP2002277502A (ja) * 2001-01-12 2002-09-25 Nidec-Read Corp 基板検査装置及び基板検査方法
JP2004319889A (ja) * 2003-04-18 2004-11-11 Seiko Epson Corp 製造対象物の受け渡し装置および製造対象物の受け渡し方法
JP4300067B2 (ja) 2003-07-02 2009-07-22 株式会社日立ハイテクノロジーズ 基板搬送装置、基板搬送方法、及び半導体デバイスの製造方法
DE112005001989T5 (de) 2004-08-17 2007-08-02 Mattson Technology Inc., Fremont Kostengünstige Prozessierplattform mit hohem Durchsatz
JP5189035B2 (ja) * 2004-12-30 2013-04-24 エーエスエムエル ネザーランズ ビー．ブイ． 基板ハンドラ
JP4638755B2 (ja) * 2005-03-25 2011-02-23 大日本印刷株式会社 露光装置および露光方法
TW200815935A (en) * 2006-05-31 2008-04-01 Nsk Ltd Exposure device and method
JP2007322706A (ja) * 2006-05-31 2007-12-13 Nsk Ltd 露光装置及び露光方法
JP4957133B2 (ja) * 2006-09-11 2012-06-20 株式会社Ｉｈｉ 基板搬送装置及び基板搬送方法
WO2009037754A1 (ja) * 2007-09-19 2009-03-26 Hirata Corporation 基板搬送システム
JP4312248B2 (ja) 2008-02-06 2009-08-12 株式会社日立ハイテクノロジーズ プロキシミティ露光装置及び基板製造方法
JP4312247B2 (ja) 2008-02-06 2009-08-12 株式会社日立ハイテクノロジーズ プロキシミティ露光装置及び基板製造方法
JP5577730B2 (ja) * 2010-02-15 2014-08-27 Ｎｓｋテクノロジー株式会社 近接露光装置及び近接露光方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1164437A2 (en) * 2000-06-15 2001-12-19 Nikon Corporation Lithographic system
US20070272151A1 (en) * 2004-08-12 2007-11-29 Nikon Corporation Substrate Processing System, Method of Confirmation of Its State of Use, and Method of Prevention of Illicit Use

Also Published As

Publication number Publication date
KR20140139543A (ko) 2014-12-05
WO2013151146A1 (ja) 2013-10-10
TW201346454A (zh) 2013-11-16
KR101700019B1 (ko) 2017-02-13
JP2013231962A (ja) 2013-11-14

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MM4A Annulment or lapse of patent due to non-payment of fees