TWI498442B - 物理氣相沈積用真空塗層設備 - Google Patents
物理氣相沈積用真空塗層設備 Download PDFInfo
- Publication number
- TWI498442B TWI498442B TW097147045A TW97147045A TWI498442B TW I498442 B TWI498442 B TW I498442B TW 097147045 A TW097147045 A TW 097147045A TW 97147045 A TW97147045 A TW 97147045A TW I498442 B TWI498442 B TW I498442B
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- substrate carrier
- coating
- substrates
- source
- Prior art date
Links
- 238000001771 vacuum deposition Methods 0.000 title claims description 7
- 239000000758 substrate Substances 0.000 claims description 218
- 238000005520 cutting process Methods 0.000 claims description 158
- 238000000576 coating method Methods 0.000 claims description 119
- 239000011248 coating agent Substances 0.000 claims description 109
- 239000000463 material Substances 0.000 claims description 58
- 238000005240 physical vapour deposition Methods 0.000 claims description 56
- 238000000034 method Methods 0.000 claims description 49
- 230000008569 process Effects 0.000 claims description 27
- 239000007789 gas Substances 0.000 claims description 17
- 238000012545 processing Methods 0.000 claims description 12
- 239000012495 reaction gas Substances 0.000 claims description 11
- 230000008020 evaporation Effects 0.000 claims description 9
- 238000001704 evaporation Methods 0.000 claims description 9
- 230000008859 change Effects 0.000 claims description 4
- 239000004020 conductor Substances 0.000 claims description 3
- 238000012546 transfer Methods 0.000 claims description 3
- 230000000737 periodic effect Effects 0.000 claims 1
- 230000002441 reversible effect Effects 0.000 description 56
- 238000005516 engineering process Methods 0.000 description 13
- 238000004519 manufacturing process Methods 0.000 description 13
- 210000000887 face Anatomy 0.000 description 9
- 238000009826 distribution Methods 0.000 description 8
- 239000002243 precursor Substances 0.000 description 7
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 6
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 6
- 230000008901 benefit Effects 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 6
- 239000000203 mixture Substances 0.000 description 6
- 239000001301 oxygen Substances 0.000 description 6
- 229910052760 oxygen Inorganic materials 0.000 description 6
- 238000000151 deposition Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 239000001257 hydrogen Substances 0.000 description 5
- 229910052739 hydrogen Inorganic materials 0.000 description 5
- 239000011343 solid material Substances 0.000 description 5
- 238000001816 cooling Methods 0.000 description 4
- 230000008021 deposition Effects 0.000 description 4
- 150000002431 hydrogen Chemical class 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 3
- 238000010276 construction Methods 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- 239000013077 target material Substances 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 2
- 229910010037 TiAlN Inorganic materials 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 238000013459 approach Methods 0.000 description 2
- 238000010923 batch production Methods 0.000 description 2
- 229910052796 boron Inorganic materials 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 229930195733 hydrocarbon Natural products 0.000 description 2
- 150000002430 hydrocarbons Chemical class 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 150000004767 nitrides Chemical class 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 229910010052 TiAlO Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 108010074506 Transfer Factor Proteins 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- 229910007875 ZrAlO Inorganic materials 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 210000002159 anterior chamber Anatomy 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 238000010420 art technique Methods 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 238000005422 blasting Methods 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 238000001311 chemical methods and process Methods 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 239000011365 complex material Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 229910052593 corundum Inorganic materials 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 239000012071 phase Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 238000007781 pre-processing Methods 0.000 description 1
- 238000002203 pretreatment Methods 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000009827 uniform distribution Methods 0.000 description 1
- 239000012808 vapor phase Substances 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
- 229910001845 yogo sapphire Inorganic materials 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/32—Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating
- C23C14/325—Electric arc evaporation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
- C23C14/505—Substrate holders for rotation of the substrates
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Cutting Tools, Boring Holders, And Turrets (AREA)
- Battery Electrode And Active Subsutance (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CH18902007 | 2007-12-06 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200936795A TW200936795A (en) | 2009-09-01 |
| TWI498442B true TWI498442B (zh) | 2015-09-01 |
Family
ID=39186114
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW097147045A TWI498442B (zh) | 2007-12-06 | 2008-12-04 | 物理氣相沈積用真空塗層設備 |
Country Status (12)
| Country | Link |
|---|---|
| US (1) | US8968830B2 (enExample) |
| EP (1) | EP2220265A1 (enExample) |
| JP (1) | JP5449185B2 (enExample) |
| KR (1) | KR20100094558A (enExample) |
| CN (1) | CN101889102B (enExample) |
| BR (1) | BRPI0820014A2 (enExample) |
| CA (1) | CA2707581A1 (enExample) |
| MX (1) | MX2010006214A (enExample) |
| RU (1) | RU2486280C2 (enExample) |
| SG (2) | SG186624A1 (enExample) |
| TW (1) | TWI498442B (enExample) |
| WO (1) | WO2009070903A1 (enExample) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2454393B1 (de) * | 2009-07-14 | 2016-09-28 | MSM Krystall GBR | Verfahren zur herstellung von wendeschneidplatten |
| CZ304905B6 (cs) * | 2009-11-23 | 2015-01-14 | Shm, S.R.O. | Způsob vytváření PVD vrstev s pomocí rotační cylindrické katody a zařízení k provádění tohoto způsobu |
| DE102010038077B4 (de) | 2010-10-08 | 2018-05-30 | Msm Krystall Gbr (Vertretungsberechtigte Gesellschafter: Dr. Rainer Schneider, 12165 Berlin; Arno Mecklenburg, 10999 Berlin) | Wendeschneidplatte und Verfahren zu deren Herstellung |
| ES2532898T3 (es) * | 2011-06-30 | 2015-04-01 | Lamina Technologies Sa | Deposición por arco catódico |
| CN104004993B (zh) * | 2013-02-25 | 2018-01-12 | 北京中科三环高技术股份有限公司 | 一种表面处理装置 |
| DE102015004856A1 (de) * | 2015-04-15 | 2016-10-20 | Oerlikon Metaplas Gmbh | Bipolares Arc-Beschichtungsverfahren |
| KR102079460B1 (ko) | 2015-12-17 | 2020-02-19 | 가부시키가이샤 알박 | 진공 처리 장치 |
| US11322338B2 (en) * | 2017-08-31 | 2022-05-03 | Taiwan Semiconductor Manufacturing Co., Ltd. | Sputter target magnet |
| DE102018004086A1 (de) * | 2018-05-18 | 2019-11-21 | Singulus Technologies Ag | Durchlaufanlage und Verfahren zum Beschichten von Substraten |
| US11851740B2 (en) | 2018-12-17 | 2023-12-26 | Applied Materials, Inc. | PVD directional deposition for encapsulation |
| US20200255941A1 (en) * | 2019-02-11 | 2020-08-13 | Kennametal Inc. | Supports for chemical vapor deposition coating applications |
| ES2928498T3 (es) * | 2019-05-07 | 2022-11-18 | Light Med Usa Inc | Método de fase líquida transitoria de plata-indio de unión de dispositivo semiconductor y soporte de dispersión de calor y estructura semiconductora que tiene una junta de unión de fase líquida transitoria de plata-indio |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1169477A (zh) * | 1996-05-10 | 1998-01-07 | 萨蒂斯真空工业销售股份公司 | 在光学基片上蒸镀镀膜的方法 |
| US6250758B1 (en) * | 1997-05-16 | 2001-06-26 | Hoya Corporation | Plastic optical devices having antireflection film and mechanism for equalizing thickness of antireflection film |
| US6328857B1 (en) * | 1999-08-05 | 2001-12-11 | Nippon Sheet Glass Co., Ltd. | Method for forming coating on substrate and sputtering apparatus used for the method |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA1264025A (en) | 1987-05-29 | 1989-12-27 | James A.E. Bell | Apparatus and process for coloring objects by plasma coating |
| DE4209384C1 (enExample) | 1992-03-23 | 1993-04-22 | Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung Ev, 8000 Muenchen, De | |
| RU2058427C1 (ru) * | 1993-06-01 | 1996-04-20 | Александр Иванович Дерюгин | Вакуумная установка для нанесения покрытий |
| RU2099439C1 (ru) * | 1995-05-06 | 1997-12-20 | Самарская государственная архитектурно-строительная академия | Устройство для нанесения покрытий (варианты) |
| DE29615190U1 (de) | 1996-03-11 | 1996-11-28 | Balzers Verschleissschutz GmbH, 55411 Bingen | Anlage zur Beschichtung von Werkstücken |
| US5803971A (en) * | 1997-01-13 | 1998-09-08 | United Technologies Corporation | Modular coating fixture |
| JP4345869B2 (ja) | 1997-05-16 | 2009-10-14 | Ｈｏｙａ株式会社 | スパッタ成膜用の膜厚補正機構 |
| SE517046C2 (sv) | 1997-11-26 | 2002-04-09 | Sandvik Ab | Plasmaaktiverad CVD-metod för beläggning av skärverktyg med finkornig aluminiumoxid |
| JP2000141108A (ja) | 1999-01-01 | 2000-05-23 | Hitachi Tool Engineering Ltd | 被覆スロ―アウェイチップの製造方法 |
| EP1186681B1 (de) | 2000-09-05 | 2010-03-31 | Oerlikon Trading AG, Trübbach | Vakuumanlage mit koppelbarem Werkstückträger |
| US20020160620A1 (en) * | 2001-02-26 | 2002-10-31 | Rudolf Wagner | Method for producing coated workpieces, uses and installation for the method |
| DE202004011179U1 (de) * | 2003-07-21 | 2004-12-02 | Unaxis Balzers Ag | Trog zum Stapeln, Aufnehmen und Transportieren von kleinen Teilen, insbesondere Werkzeugen |
| KR100771026B1 (ko) * | 2004-04-30 | 2007-10-29 | 스미또모 덴꼬오 하드메탈 가부시끼가이샤 | 표면 피복 입방정 질화 붕소 소결체 공구 및 그 제조 방법 |
| MX2007011703A (es) | 2005-03-24 | 2008-03-10 | Oerlikon Trading Ag | Capa de material duro. |
-
2008
- 2008-11-13 US US12/270,415 patent/US8968830B2/en not_active Expired - Fee Related
- 2008-11-17 WO PCT/CH2008/000485 patent/WO2009070903A1/de not_active Ceased
- 2008-11-17 CN CN200880119186.5A patent/CN101889102B/zh not_active Expired - Fee Related
- 2008-11-17 MX MX2010006214A patent/MX2010006214A/es unknown
- 2008-11-17 KR KR1020107014904A patent/KR20100094558A/ko not_active Ceased
- 2008-11-17 RU RU2010127857/02A patent/RU2486280C2/ru not_active IP Right Cessation
- 2008-11-17 CA CA2707581A patent/CA2707581A1/en not_active Abandoned
- 2008-11-17 EP EP08856536A patent/EP2220265A1/de not_active Withdrawn
- 2008-11-17 JP JP2010536303A patent/JP5449185B2/ja not_active Expired - Fee Related
- 2008-11-17 BR BRPI0820014-9A patent/BRPI0820014A2/pt not_active IP Right Cessation
- 2008-11-17 SG SG2012089439A patent/SG186624A1/en unknown
- 2008-11-17 SG SG10201604607PA patent/SG10201604607PA/en unknown
- 2008-12-04 TW TW097147045A patent/TWI498442B/zh not_active IP Right Cessation
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1169477A (zh) * | 1996-05-10 | 1998-01-07 | 萨蒂斯真空工业销售股份公司 | 在光学基片上蒸镀镀膜的方法 |
| US6250758B1 (en) * | 1997-05-16 | 2001-06-26 | Hoya Corporation | Plastic optical devices having antireflection film and mechanism for equalizing thickness of antireflection film |
| US6328857B1 (en) * | 1999-08-05 | 2001-12-11 | Nippon Sheet Glass Co., Ltd. | Method for forming coating on substrate and sputtering apparatus used for the method |
Also Published As
| Publication number | Publication date |
|---|---|
| MX2010006214A (es) | 2010-06-23 |
| RU2010127857A (ru) | 2012-01-20 |
| CN101889102B (zh) | 2013-04-10 |
| US20090148599A1 (en) | 2009-06-11 |
| CN101889102A (zh) | 2010-11-17 |
| KR20100094558A (ko) | 2010-08-26 |
| US8968830B2 (en) | 2015-03-03 |
| TW200936795A (en) | 2009-09-01 |
| RU2486280C2 (ru) | 2013-06-27 |
| WO2009070903A1 (de) | 2009-06-11 |
| JP2011505262A (ja) | 2011-02-24 |
| EP2220265A1 (de) | 2010-08-25 |
| SG186624A1 (en) | 2013-01-30 |
| CA2707581A1 (en) | 2009-06-11 |
| JP5449185B2 (ja) | 2014-03-19 |
| BRPI0820014A2 (pt) | 2015-05-19 |
| SG10201604607PA (en) | 2016-07-28 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |