TWI497245B - Wafer processing method and wafer processing device - Google Patents

Wafer processing method and wafer processing device Download PDF

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Publication number
TWI497245B
TWI497245B TW098143581A TW98143581A TWI497245B TW I497245 B TWI497245 B TW I497245B TW 098143581 A TW098143581 A TW 098143581A TW 98143581 A TW98143581 A TW 98143581A TW I497245 B TWI497245 B TW I497245B
Authority
TW
Taiwan
Prior art keywords
wafer
holding member
wafer processing
inspection
identification information
Prior art date
Application number
TW098143581A
Other languages
English (en)
Chinese (zh)
Other versions
TW201024946A (en
Inventor
松岡新吾
菅谷功
堀越崇廣
真田覺
Original Assignee
尼康股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 尼康股份有限公司 filed Critical 尼康股份有限公司
Publication of TW201024946A publication Critical patent/TW201024946A/zh
Application granted granted Critical
Publication of TWI497245B publication Critical patent/TWI497245B/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
TW098143581A 2008-12-22 2009-12-18 Wafer processing method and wafer processing device TWI497245B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008325989 2008-12-22

Publications (2)

Publication Number Publication Date
TW201024946A TW201024946A (en) 2010-07-01
TWI497245B true TWI497245B (zh) 2015-08-21

Family

ID=42287146

Family Applications (1)

Application Number Title Priority Date Filing Date
TW098143581A TWI497245B (zh) 2008-12-22 2009-12-18 Wafer processing method and wafer processing device

Country Status (3)

Country Link
JP (2) JP5459224B2 (ja)
TW (1) TWI497245B (ja)
WO (1) WO2010073487A1 (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5459224B2 (ja) * 2008-12-22 2014-04-02 株式会社ニコン ウエハ処理方法およびウエハ処理装置
JP5754113B2 (ja) * 2010-11-15 2015-07-29 株式会社ニコン 基板貼り合わせ装置、基板貼り合わせ方法および積層半導体装置製造方法
WO2014064944A1 (ja) * 2012-10-26 2014-05-01 株式会社ニコン 基板貼り合わせ装置、位置合わせ装置、基板貼り合わせ方法、位置合わせ方法、及び、積層半導体装置の製造方法
US10879094B2 (en) * 2016-11-23 2020-12-29 Applied Materials, Inc. Electrostatic chucking force measurement tool for process chamber carriers
CN113968020B (zh) * 2020-07-24 2024-09-24 盟立自动化股份有限公司 内循环式贴合设备

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002297221A (ja) * 2001-03-30 2002-10-11 Matsushita Electric Ind Co Ltd 治具作業管理方法
TW200510113A (en) * 2003-05-30 2005-03-16 Nippon Kogaku Kk Processing device, semiconductor component manufacturing method using the device, semiconductor component using the method
TW200625506A (en) * 2004-11-30 2006-07-16 Sumitomo Eaton Nova Wafer processing system, wafer processing method, and ion implantation system
JP2007208031A (ja) * 2006-02-02 2007-08-16 Nikon Corp ウェハホルダ及び半導体装置の製造方法
JP2008113027A (ja) * 1998-01-14 2008-05-15 Renesas Technology Corp デバイスの製造方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07183353A (ja) * 1993-12-21 1995-07-21 Sony Corp 加工装置
JPH10244584A (ja) * 1997-03-07 1998-09-14 Dainippon Printing Co Ltd 不良データ処理システム
JPH11354396A (ja) * 1998-06-05 1999-12-24 Matsushita Electric Ind Co Ltd 半導体プロセスの管理方法及びその装置
JPH11351396A (ja) * 1998-06-10 1999-12-24 Matsushita Electric Ind Co Ltd 収納庫
JP2007036279A (ja) * 2000-01-07 2007-02-08 Canon Inc 半導体基板の作製方法
JP2002124445A (ja) * 2000-10-13 2002-04-26 Hitachi Ltd 半導体デバイスの製造方法
JP4564241B2 (ja) * 2003-05-16 2010-10-20 株式会社東芝 半導体装置の生産システム
JP2005136285A (ja) * 2003-10-31 2005-05-26 Kazuo Tanabe ウエーハの貼り合せ方法及び装置
JP2006343952A (ja) * 2005-06-08 2006-12-21 Fujitsu Ltd 製造管理装置、製造管理方法および製造管理プログラム
JP2007053264A (ja) * 2005-08-18 2007-03-01 Sony Corp 実装品質の不良検出装置及び実装品質の不良検出方法
JP2007194262A (ja) * 2006-01-17 2007-08-02 Olympus Corp 欠陥判定システムおよび基板処理システム
JP5459224B2 (ja) * 2008-12-22 2014-04-02 株式会社ニコン ウエハ処理方法およびウエハ処理装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008113027A (ja) * 1998-01-14 2008-05-15 Renesas Technology Corp デバイスの製造方法
JP2002297221A (ja) * 2001-03-30 2002-10-11 Matsushita Electric Ind Co Ltd 治具作業管理方法
TW200510113A (en) * 2003-05-30 2005-03-16 Nippon Kogaku Kk Processing device, semiconductor component manufacturing method using the device, semiconductor component using the method
TW200625506A (en) * 2004-11-30 2006-07-16 Sumitomo Eaton Nova Wafer processing system, wafer processing method, and ion implantation system
JP2007208031A (ja) * 2006-02-02 2007-08-16 Nikon Corp ウェハホルダ及び半導体装置の製造方法

Also Published As

Publication number Publication date
TW201024946A (en) 2010-07-01
JP5459224B2 (ja) 2014-04-02
JPWO2010073487A1 (ja) 2012-06-07
WO2010073487A1 (ja) 2010-07-01
JP5812121B2 (ja) 2015-11-11
JP2014131050A (ja) 2014-07-10

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