TWI496758B - In-Ga-O-based oxide sintered body, target material, oxide semiconductor thin film, and the like - Google Patents

In-Ga-O-based oxide sintered body, target material, oxide semiconductor thin film, and the like Download PDF

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TWI496758B
TWI496758B TW100101510A TW100101510A TWI496758B TW I496758 B TWI496758 B TW I496758B TW 100101510 A TW100101510 A TW 100101510A TW 100101510 A TW100101510 A TW 100101510A TW I496758 B TWI496758 B TW I496758B
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Taiwan
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sintered body
oxide
thin film
oxide sintered
sputtering
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TW100101510A
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Chinese (zh)
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TW201134781A (en
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江端一晃
笘井重和
矢野公規
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出光興產股份有限公司
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    • C23C14/06Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
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  • Physical Vapour Deposition (AREA)
  • Compositions Of Oxide Ceramics (AREA)
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TW100101510A 2010-01-15 2011-01-14 In-Ga-O-based oxide sintered body, target material, oxide semiconductor thin film, and the like TWI496758B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010006831A JP5437825B2 (ja) 2010-01-15 2010-01-15 In−Ga−O系酸化物焼結体、ターゲット、酸化物半導体薄膜及びこれらの製造方法

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TW201134781A TW201134781A (en) 2011-10-16
TWI496758B true TWI496758B (zh) 2015-08-21

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US (1) US20120292617A1 (enExample)
EP (1) EP2524905A4 (enExample)
JP (1) JP5437825B2 (enExample)
KR (2) KR20120123322A (enExample)
CN (1) CN102652119B (enExample)
TW (1) TWI496758B (enExample)
WO (1) WO2011086940A1 (enExample)

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JP5301021B2 (ja) 2011-09-06 2013-09-25 出光興産株式会社 スパッタリングターゲット
JP5966840B2 (ja) 2012-10-11 2016-08-10 住友金属鉱山株式会社 酸化物半導体薄膜および薄膜トランジスタ
JP6107085B2 (ja) * 2012-11-22 2017-04-05 住友金属鉱山株式会社 酸化物半導体薄膜および薄膜トランジスタ
JP5883990B2 (ja) * 2013-03-29 2016-03-15 Jx金属株式会社 Igzoスパッタリングターゲット
CN105393360B (zh) * 2013-07-16 2018-11-23 住友金属矿山株式会社 氧化物半导体薄膜和薄膜晶体管
US20170077243A1 (en) * 2014-03-14 2017-03-16 Sumitomo Metal Mining Co., Ltd. Sintered oxide, sputtering target, and oxide semiconductor thin film obtained using sputtering target
KR20170086473A (ko) * 2014-11-25 2017-07-26 스미토모 긴조쿠 고잔 가부시키가이샤 산화물 소결체, 스퍼터링용 타겟, 및 그것을 이용하여 얻어지는 산화물 반도체 박막
JP2017154910A (ja) * 2016-02-29 2017-09-07 住友金属鉱山株式会社 酸化物焼結体及びスパッタリング用ターゲット
KR102543783B1 (ko) 2017-02-01 2023-06-15 이데미쓰 고산 가부시키가이샤 비정질 산화물 반도체막, 산화물 소결체, 및 박막 트랜지스터
CN116240630A (zh) * 2018-08-01 2023-06-09 出光兴产株式会社 晶体化合物、氧化物烧结体、溅射靶、晶质及无定形氧化物薄膜、薄膜晶体管及电子设备
KR20240167820A (ko) 2022-03-29 2024-11-28 이데미쓰 고산 가부시키가이샤 스퍼터링 타깃, 스퍼터링 타깃의 제조 방법, 결정 산화물 박막, 박막 트랜지스터, 및 전자 기기

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI288429B (en) * 2004-06-14 2007-10-11 Yi-Chi Shih Indium oxide-based thin film transistors and circuits
TW200909380A (en) * 2007-07-06 2009-03-01 Sumitomo Metal Mining Co Oxide sintered compact and method of manufacturing the same, target, transparent conductive film obtained by using the same, and transparent conductive substrate

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3947575B2 (ja) 1994-06-10 2007-07-25 Hoya株式会社 導電性酸化物およびそれを用いた電極
JPH09259640A (ja) * 1996-03-25 1997-10-03 Uchitsugu Minami 透明導電膜
EP2280092A1 (en) * 2001-08-02 2011-02-02 Idemitsu Kosan Co., Ltd. Sputtering target, transparent conductive film, and their manufacturing method
JP2006165530A (ja) * 2004-11-10 2006-06-22 Canon Inc センサ及び非平面撮像装置
JP5058469B2 (ja) 2005-09-06 2012-10-24 キヤノン株式会社 スパッタリングターゲットおよび該ターゲットを用いた薄膜の形成方法
KR101080527B1 (ko) * 2005-09-20 2011-11-04 이데미쓰 고산 가부시키가이샤 스퍼터링 타겟, 투명 도전막 및 투명 전극
JP4805648B2 (ja) * 2005-10-19 2011-11-02 出光興産株式会社 半導体薄膜及びその製造方法
WO2007058248A1 (ja) * 2005-11-18 2007-05-24 Idemitsu Kosan Co., Ltd. 半導体薄膜、及びその製造方法、並びに薄膜トランジスタ
CN101680081B (zh) * 2007-03-20 2012-10-31 出光兴产株式会社 溅射靶、氧化物半导体膜及半导体器件
JP5345952B2 (ja) 2007-12-27 2013-11-20 Jx日鉱日石金属株式会社 a−IGZO酸化物薄膜の製造方法
JP5348132B2 (ja) * 2008-04-16 2013-11-20 住友金属鉱山株式会社 薄膜トランジスタ型基板、薄膜トランジスタ型液晶表示装置および薄膜トランジスタ型基板の製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI288429B (en) * 2004-06-14 2007-10-11 Yi-Chi Shih Indium oxide-based thin film transistors and circuits
TW200909380A (en) * 2007-07-06 2009-03-01 Sumitomo Metal Mining Co Oxide sintered compact and method of manufacturing the same, target, transparent conductive film obtained by using the same, and transparent conductive substrate

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