TWI492290B - Machining devices and machining methods - Google Patents

Machining devices and machining methods Download PDF

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Publication number
TWI492290B
TWI492290B TW100142706A TW100142706A TWI492290B TW I492290 B TWI492290 B TW I492290B TW 100142706 A TW100142706 A TW 100142706A TW 100142706 A TW100142706 A TW 100142706A TW I492290 B TWI492290 B TW I492290B
Authority
TW
Taiwan
Prior art keywords
cutting fluid
fine foam
cutting
tool
foam
Prior art date
Application number
TW100142706A
Other languages
English (en)
Chinese (zh)
Other versions
TW201234468A (en
Inventor
廣瀨治道
牧野勉
Original Assignee
芝浦機械電子裝置股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 芝浦機械電子裝置股份有限公司 filed Critical 芝浦機械電子裝置股份有限公司
Publication of TW201234468A publication Critical patent/TW201234468A/zh
Application granted granted Critical
Publication of TWI492290B publication Critical patent/TWI492290B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles

Landscapes

  • Dicing (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
TW100142706A 2010-12-10 2011-11-22 Machining devices and machining methods TWI492290B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010276195 2010-12-10

Publications (2)

Publication Number Publication Date
TW201234468A TW201234468A (en) 2012-08-16
TWI492290B true TWI492290B (zh) 2015-07-11

Family

ID=46337314

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100142706A TWI492290B (zh) 2010-12-10 2011-11-22 Machining devices and machining methods

Country Status (4)

Country Link
JP (1) JP5610487B2 (https=)
KR (1) KR101325295B1 (https=)
CN (1) CN102528624B (https=)
TW (1) TWI492290B (https=)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013111713A (ja) * 2011-11-29 2013-06-10 Tokyo Seimitsu Co Ltd 切削水の供給装置及び供給方法
JP6200685B2 (ja) * 2013-05-09 2017-09-20 株式会社ディスコ 加工装置
JP6991130B2 (ja) * 2017-03-16 2022-01-12 Idec株式会社 研削液生成装置、研削液生成方法、研削装置および研削液
CN109382922A (zh) * 2018-11-28 2019-02-26 江苏晶成光学有限公司 一种单晶硅片用线切割机切削液供给装置
JP2020104230A (ja) * 2018-12-28 2020-07-09 株式会社ナガセインテグレックス ワーク切削方法
JP7165079B2 (ja) * 2019-03-12 2022-11-02 日本タングステン株式会社 加工用クーラント供給機構、および、加工用クーラントの供給方法
JP7712132B2 (ja) * 2021-07-29 2025-07-23 株式会社ディスコ 加工装置
JP2024050022A (ja) * 2022-09-29 2024-04-10 株式会社ディスコ 切削装置及び切削方法
CN116460654A (zh) * 2023-04-11 2023-07-21 宁波长净环保材料工程有限公司 一种提升金属加工品质和效率的工艺

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003068677A (ja) * 2001-08-21 2003-03-07 Sony Corp ダイシング装置およびダイシング方法
JP2007160175A (ja) * 2005-12-12 2007-06-28 Sharp Corp 洗浄装置
TW201042019A (en) * 2009-04-20 2010-12-01 Hitachi Chemical Co Ltd Polishing agent for semiconductor substrate and method for polishing semiconductor substrate

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3105057B2 (ja) * 1992-02-20 2000-10-30 株式会社東京精密 ダイシング装置及びダイシング装置の目立て方法
US5632886A (en) * 1993-04-02 1997-05-27 Harvey Universal, Inc. Cutting oil treatment apparatus
EP1350596B1 (en) * 1996-02-15 2005-04-27 Zeta Heiwa Ltd. Apparatus for separating impurites from coolant liquid in cutting or grinding machine
US7048863B2 (en) * 2003-07-08 2006-05-23 Ashland Licensing And Intellectual Property Llc Device and process for treating cutting fluids using ultrasound
JP2006012966A (ja) 2004-06-23 2006-01-12 Seiko Epson Corp 切削方法
JP2007331088A (ja) * 2006-06-15 2007-12-27 Kazumasa Onishi マイクロバブルを用いた機械加工装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003068677A (ja) * 2001-08-21 2003-03-07 Sony Corp ダイシング装置およびダイシング方法
JP2007160175A (ja) * 2005-12-12 2007-06-28 Sharp Corp 洗浄装置
TW201042019A (en) * 2009-04-20 2010-12-01 Hitachi Chemical Co Ltd Polishing agent for semiconductor substrate and method for polishing semiconductor substrate

Also Published As

Publication number Publication date
KR20120065239A (ko) 2012-06-20
JP2012135869A (ja) 2012-07-19
CN102528624B (zh) 2014-08-27
CN102528624A (zh) 2012-07-04
KR101325295B1 (ko) 2013-11-08
TW201234468A (en) 2012-08-16
JP5610487B2 (ja) 2014-10-22

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MM4A Annulment or lapse of patent due to non-payment of fees