TWI490372B - 釋氫用的電極及其製法和使用 - Google Patents

釋氫用的電極及其製法和使用 Download PDF

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Publication number
TWI490372B
TWI490372B TW099129779A TW99129779A TWI490372B TW I490372 B TWI490372 B TW I490372B TW 099129779 A TW099129779 A TW 099129779A TW 99129779 A TW99129779 A TW 99129779A TW I490372 B TWI490372 B TW I490372B
Authority
TW
Taiwan
Prior art keywords
coating film
electrode
deposition
catalytic coating
physical vapor
Prior art date
Application number
TW099129779A
Other languages
English (en)
Chinese (zh)
Other versions
TW201114948A (en
Inventor
Christian Urgeghe
Stefania Mora
Antonio Lorenzo Antozzi
Original Assignee
Industrie De Nora Spa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Industrie De Nora Spa filed Critical Industrie De Nora Spa
Publication of TW201114948A publication Critical patent/TW201114948A/zh
Application granted granted Critical
Publication of TWI490372B publication Critical patent/TWI490372B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25B—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTION OF COMPOUNDS OR NON-METALS; APPARATUS THEREFOR
    • C25B11/00—Electrodes; Manufacture thereof not otherwise provided for
    • C25B11/04—Electrodes; Manufacture thereof not otherwise provided for characterised by the material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/02—Pretreatment of the material to be coated
    • C23C14/021—Cleaning or etching treatments
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/02—Pretreatment of the material to be coated
    • C23C14/024—Deposition of sublayers, e.g. to promote adhesion of the coating
    • C23C14/025—Metallic sublayers
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/02—Pretreatment of the material to be coated
    • C23C14/028—Physical treatment to alter the texture of the substrate surface, e.g. grinding, polishing
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/08—Oxides
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • C23C14/16—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon
    • C23C14/165—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon by cathodic sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/06—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25B—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTION OF COMPOUNDS OR NON-METALS; APPARATUS THEREFOR
    • C25B1/00—Electrolytic production of inorganic compounds or non-metals
    • C25B1/01—Products
    • C25B1/02—Hydrogen or oxygen
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25B—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTION OF COMPOUNDS OR NON-METALS; APPARATUS THEREFOR
    • C25B11/00—Electrodes; Manufacture thereof not otherwise provided for
    • C25B11/04—Electrodes; Manufacture thereof not otherwise provided for characterised by the material
    • C25B11/051—Electrodes formed of electrocatalysts on a substrate or carrier
    • C25B11/073—Electrodes formed of electrocatalysts on a substrate or carrier characterised by the electrocatalyst material
    • C25B11/075—Electrodes formed of electrocatalysts on a substrate or carrier characterised by the electrocatalyst material consisting of a single catalytic element or catalytic compound
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25B—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTION OF COMPOUNDS OR NON-METALS; APPARATUS THEREFOR
    • C25B11/00—Electrodes; Manufacture thereof not otherwise provided for
    • C25B11/04—Electrodes; Manufacture thereof not otherwise provided for characterised by the material
    • C25B11/051—Electrodes formed of electrocatalysts on a substrate or carrier
    • C25B11/073—Electrodes formed of electrocatalysts on a substrate or carrier characterised by the electrocatalyst material
    • C25B11/075—Electrodes formed of electrocatalysts on a substrate or carrier characterised by the electrocatalyst material consisting of a single catalytic element or catalytic compound
    • C25B11/081—Electrodes formed of electrocatalysts on a substrate or carrier characterised by the electrocatalyst material consisting of a single catalytic element or catalytic compound the element being a noble metal

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Catalysts (AREA)
  • Electrodes For Compound Or Non-Metal Manufacture (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Electrolytic Production Of Non-Metals, Compounds, Apparatuses Therefor (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Electrolytic Production Of Metals (AREA)
TW099129779A 2009-09-23 2010-09-03 釋氫用的電極及其製法和使用 TWI490372B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT001621A ITMI20091621A1 (it) 2009-09-23 2009-09-23 Elettrodo per processi elettrolitici con struttura cristallina controllata

Publications (2)

Publication Number Publication Date
TW201114948A TW201114948A (en) 2011-05-01
TWI490372B true TWI490372B (zh) 2015-07-01

Family

ID=42138977

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099129779A TWI490372B (zh) 2009-09-23 2010-09-03 釋氫用的電極及其製法和使用

Country Status (17)

Country Link
US (1) US9090982B2 (enExample)
EP (1) EP2480705B1 (enExample)
JP (1) JP5824454B2 (enExample)
KR (1) KR101742011B1 (enExample)
CN (1) CN102575363B (enExample)
AR (1) AR078442A1 (enExample)
AU (1) AU2010299850B2 (enExample)
BR (1) BR112012006530A2 (enExample)
CA (1) CA2769824C (enExample)
DK (1) DK2480705T3 (enExample)
EA (1) EA023083B1 (enExample)
IL (1) IL217859A (enExample)
IT (1) ITMI20091621A1 (enExample)
MX (1) MX2012003517A (enExample)
TW (1) TWI490372B (enExample)
WO (1) WO2011036225A1 (enExample)
ZA (1) ZA201201825B (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ITMI20122035A1 (it) * 2012-11-29 2014-05-30 Industrie De Nora Spa Elettrodo per evoluzione di ossigeno in processi elettrochimici industriali
DK3351659T3 (da) * 2015-09-18 2019-12-16 Asahi Chemical Ind Positiv elektrode til vandelektrolyse, elektrolysecelle og fremgangsmåde til at fremstille en positiv elektrode til vandelektrolyse
WO2019204578A1 (en) * 2018-04-18 2019-10-24 Materion Corporation Electrodes for biosensors
CN113073336B (zh) * 2021-03-26 2022-07-08 浙江工业大学 一种RuO2泡沫镍复合电极及其制备方法和应用

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6171460B1 (en) * 1993-05-10 2001-01-09 John L. Bill Chemically protected electrode system
TW580524B (en) * 1998-03-02 2004-03-21 Atochem Elf Sa Specific cathode, which can be used for the preparation of an alkali metal chlorate, and its manufacturing process

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Publication number Priority date Publication date Assignee Title
FR2088659A5 (enExample) * 1970-04-21 1972-01-07 Progil
AU5889880A (en) * 1979-07-02 1981-01-15 Olin Corporation Manufacture of low overvoltage electrodes by cathodic sputtering
EP0107612A3 (en) * 1982-09-02 1985-12-27 Eltech Systems Limited Method of conditioning a porous gas-diffusion electrode
CN1008543B (zh) * 1985-11-21 1990-06-27 中国科学院大连化学物理研究所 一种电解水方法
GB8617325D0 (en) * 1986-07-16 1986-08-20 Johnson Matthey Plc Poison-resistant cathodes
WO2003016592A2 (en) * 2001-08-14 2003-02-27 3-One-2, Llc Electrolytic cell and electrodes for use in electrochemical processes
US6686308B2 (en) * 2001-12-03 2004-02-03 3M Innovative Properties Company Supported nanoparticle catalyst
BRPI0616332A2 (pt) * 2005-09-23 2011-06-14 Mecs Inc processo para a oxidaÇço catalÍtica de diàxido de enxofre em triàxido de enxofre e processo para fabricar Ácido sulférico e/ou àleo de um gÁs de fonte que compreende dÍàxido de enxofre
WO2010045483A2 (en) * 2008-10-15 2010-04-22 California Institute Of Technology Ir-doped ruthenium oxide catalyst for oxygen evolution
US8221599B2 (en) * 2009-04-03 2012-07-17 The Board Of Trustees Of The Leland Stanford Junior University Corrosion-resistant anodes, devices including the anodes, and methods of using the anodes
CN101525760B (zh) * 2009-04-17 2011-03-23 中南大学 一种用于制备超级电容器RuO2电极材料的电沉积工艺

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6171460B1 (en) * 1993-05-10 2001-01-09 John L. Bill Chemically protected electrode system
TW580524B (en) * 1998-03-02 2004-03-21 Atochem Elf Sa Specific cathode, which can be used for the preparation of an alkali metal chlorate, and its manufacturing process

Also Published As

Publication number Publication date
CN102575363A (zh) 2012-07-11
EP2480705B1 (en) 2018-11-21
WO2011036225A1 (en) 2011-03-31
ZA201201825B (en) 2013-05-29
IL217859A0 (en) 2012-03-29
KR101742011B1 (ko) 2017-05-31
AR078442A1 (es) 2011-11-09
ITMI20091621A1 (it) 2011-03-24
CN102575363B (zh) 2015-07-01
JP2013505363A (ja) 2013-02-14
EA023083B1 (ru) 2016-04-29
CA2769824A1 (en) 2011-03-31
EP2480705A1 (en) 2012-08-01
AU2010299850B2 (en) 2014-11-20
JP5824454B2 (ja) 2015-11-25
HK1172936A1 (en) 2013-05-03
US9090982B2 (en) 2015-07-28
BR112012006530A2 (pt) 2016-04-26
AU2010299850A1 (en) 2012-03-01
IL217859A (en) 2017-10-31
TW201114948A (en) 2011-05-01
EA201270451A1 (ru) 2012-08-30
DK2480705T3 (en) 2019-02-18
CA2769824C (en) 2017-12-19
KR20120085787A (ko) 2012-08-01
US20120175270A1 (en) 2012-07-12
MX2012003517A (es) 2012-04-19

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