JP5824454B2 - 制御された結晶構造を有する電解プロセス用電極 - Google Patents
制御された結晶構造を有する電解プロセス用電極 Download PDFInfo
- Publication number
- JP5824454B2 JP5824454B2 JP2012530263A JP2012530263A JP5824454B2 JP 5824454 B2 JP5824454 B2 JP 5824454B2 JP 2012530263 A JP2012530263 A JP 2012530263A JP 2012530263 A JP2012530263 A JP 2012530263A JP 5824454 B2 JP5824454 B2 JP 5824454B2
- Authority
- JP
- Japan
- Prior art keywords
- ruthenium
- electrode
- deposition
- coating
- vapor deposition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000000034 method Methods 0.000 title claims description 19
- 230000008569 process Effects 0.000 title claims description 8
- 238000005868 electrolysis reaction Methods 0.000 title claims description 7
- 239000013078 crystal Substances 0.000 title description 3
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 claims description 27
- 229910052707 ruthenium Inorganic materials 0.000 claims description 26
- 229910052751 metal Inorganic materials 0.000 claims description 24
- 239000002184 metal Substances 0.000 claims description 24
- 238000000576 coating method Methods 0.000 claims description 22
- 239000011248 coating agent Substances 0.000 claims description 19
- 238000000151 deposition Methods 0.000 claims description 19
- 230000008021 deposition Effects 0.000 claims description 18
- 239000003054 catalyst Substances 0.000 claims description 17
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 14
- 239000001257 hydrogen Substances 0.000 claims description 14
- 229910052739 hydrogen Inorganic materials 0.000 claims description 14
- 239000000758 substrate Substances 0.000 claims description 12
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 11
- 238000005240 physical vapour deposition Methods 0.000 claims description 11
- 230000003197 catalytic effect Effects 0.000 claims description 8
- 238000005259 measurement Methods 0.000 claims description 7
- 239000007789 gas Substances 0.000 claims description 6
- 238000005229 chemical vapour deposition Methods 0.000 claims description 5
- 239000000126 substance Substances 0.000 claims description 5
- 238000005979 thermal decomposition reaction Methods 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 238000004070 electrodeposition Methods 0.000 claims description 2
- 239000007864 aqueous solution Substances 0.000 claims 1
- 230000003647 oxidation Effects 0.000 claims 1
- 238000007254 oxidation reaction Methods 0.000 claims 1
- 150000003303 ruthenium Chemical class 0.000 claims 1
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 15
- 229910052593 corundum Inorganic materials 0.000 description 10
- 239000010431 corundum Substances 0.000 description 10
- XKRFYHLGVUSROY-UHFFFAOYSA-N argon Substances [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 7
- 238000009835 boiling Methods 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 5
- 238000002294 plasma sputter deposition Methods 0.000 description 5
- 235000011121 sodium hydroxide Nutrition 0.000 description 5
- 229910052786 argon Inorganic materials 0.000 description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 4
- 238000004140 cleaning Methods 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 239000001301 oxygen Substances 0.000 description 4
- 229910052760 oxygen Inorganic materials 0.000 description 4
- WOCIAKWEIIZHES-UHFFFAOYSA-N ruthenium(iv) oxide Chemical compound O=[Ru]=O WOCIAKWEIIZHES-UHFFFAOYSA-N 0.000 description 4
- 238000002441 X-ray diffraction Methods 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 239000002243 precursor Substances 0.000 description 3
- 238000005507 spraying Methods 0.000 description 3
- 230000001960 triggered effect Effects 0.000 description 3
- 238000007740 vapor deposition Methods 0.000 description 3
- 238000005169 Debye-Scherrer Methods 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- 230000003213 activating effect Effects 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 229910000510 noble metal Inorganic materials 0.000 description 2
- 238000000197 pyrolysis Methods 0.000 description 2
- -1 ruthenium ions Chemical class 0.000 description 2
- 229910001925 ruthenium oxide Inorganic materials 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 230000003750 conditioning effect Effects 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000011066 ex-situ storage Methods 0.000 description 1
- 238000007735 ion beam assisted deposition Methods 0.000 description 1
- 238000010884 ion-beam technique Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25B—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTION OF COMPOUNDS OR NON-METALS; APPARATUS THEREFOR
- C25B11/00—Electrodes; Manufacture thereof not otherwise provided for
- C25B11/04—Electrodes; Manufacture thereof not otherwise provided for characterised by the material
- C25B11/051—Electrodes formed of electrocatalysts on a substrate or carrier
- C25B11/073—Electrodes formed of electrocatalysts on a substrate or carrier characterised by the electrocatalyst material
- C25B11/075—Electrodes formed of electrocatalysts on a substrate or carrier characterised by the electrocatalyst material consisting of a single catalytic element or catalytic compound
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25B—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTION OF COMPOUNDS OR NON-METALS; APPARATUS THEREFOR
- C25B11/00—Electrodes; Manufacture thereof not otherwise provided for
- C25B11/04—Electrodes; Manufacture thereof not otherwise provided for characterised by the material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/02—Pretreatment of the material to be coated
- C23C14/021—Cleaning or etching treatments
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/02—Pretreatment of the material to be coated
- C23C14/024—Deposition of sublayers, e.g. to promote adhesion of the coating
- C23C14/025—Metallic sublayers
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/02—Pretreatment of the material to be coated
- C23C14/028—Physical treatment to alter the texture of the substrate surface, e.g. grinding, polishing
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/08—Oxides
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
- C23C14/16—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon
- C23C14/165—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon by cathodic sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/06—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25B—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTION OF COMPOUNDS OR NON-METALS; APPARATUS THEREFOR
- C25B1/00—Electrolytic production of inorganic compounds or non-metals
- C25B1/01—Products
- C25B1/02—Hydrogen or oxygen
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25B—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTION OF COMPOUNDS OR NON-METALS; APPARATUS THEREFOR
- C25B11/00—Electrodes; Manufacture thereof not otherwise provided for
- C25B11/04—Electrodes; Manufacture thereof not otherwise provided for characterised by the material
- C25B11/051—Electrodes formed of electrocatalysts on a substrate or carrier
- C25B11/073—Electrodes formed of electrocatalysts on a substrate or carrier characterised by the electrocatalyst material
- C25B11/075—Electrodes formed of electrocatalysts on a substrate or carrier characterised by the electrocatalyst material consisting of a single catalytic element or catalytic compound
- C25B11/081—Electrodes formed of electrocatalysts on a substrate or carrier characterised by the electrocatalyst material consisting of a single catalytic element or catalytic compound the element being a noble metal
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Electrochemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Catalysts (AREA)
- Electrodes For Compound Or Non-Metal Manufacture (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Electrolytic Production Of Non-Metals, Compounds, Apparatuses Therefor (AREA)
- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
- Electrolytic Production Of Metals (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| ITMI2009A001621 | 2009-09-23 | ||
| IT001621A ITMI20091621A1 (it) | 2009-09-23 | 2009-09-23 | Elettrodo per processi elettrolitici con struttura cristallina controllata |
| PCT/EP2010/064081 WO2011036225A1 (en) | 2009-09-23 | 2010-09-23 | Electrode for electrolytic processes with controlled crystalline structure |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2013505363A JP2013505363A (ja) | 2013-02-14 |
| JP2013505363A5 JP2013505363A5 (enExample) | 2015-04-23 |
| JP5824454B2 true JP5824454B2 (ja) | 2015-11-25 |
Family
ID=42138977
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012530263A Expired - Fee Related JP5824454B2 (ja) | 2009-09-23 | 2010-09-23 | 制御された結晶構造を有する電解プロセス用電極 |
Country Status (17)
| Country | Link |
|---|---|
| US (1) | US9090982B2 (enExample) |
| EP (1) | EP2480705B1 (enExample) |
| JP (1) | JP5824454B2 (enExample) |
| KR (1) | KR101742011B1 (enExample) |
| CN (1) | CN102575363B (enExample) |
| AR (1) | AR078442A1 (enExample) |
| AU (1) | AU2010299850B2 (enExample) |
| BR (1) | BR112012006530A2 (enExample) |
| CA (1) | CA2769824C (enExample) |
| DK (1) | DK2480705T3 (enExample) |
| EA (1) | EA023083B1 (enExample) |
| IL (1) | IL217859A (enExample) |
| IT (1) | ITMI20091621A1 (enExample) |
| MX (1) | MX2012003517A (enExample) |
| TW (1) | TWI490372B (enExample) |
| WO (1) | WO2011036225A1 (enExample) |
| ZA (1) | ZA201201825B (enExample) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| ITMI20122035A1 (it) * | 2012-11-29 | 2014-05-30 | Industrie De Nora Spa | Elettrodo per evoluzione di ossigeno in processi elettrochimici industriali |
| DK3351659T3 (da) * | 2015-09-18 | 2019-12-16 | Asahi Chemical Ind | Positiv elektrode til vandelektrolyse, elektrolysecelle og fremgangsmåde til at fremstille en positiv elektrode til vandelektrolyse |
| WO2019204578A1 (en) * | 2018-04-18 | 2019-10-24 | Materion Corporation | Electrodes for biosensors |
| CN113073336B (zh) * | 2021-03-26 | 2022-07-08 | 浙江工业大学 | 一种RuO2泡沫镍复合电极及其制备方法和应用 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2088659A5 (enExample) * | 1970-04-21 | 1972-01-07 | Progil | |
| AU5889880A (en) * | 1979-07-02 | 1981-01-15 | Olin Corporation | Manufacture of low overvoltage electrodes by cathodic sputtering |
| EP0107612A3 (en) * | 1982-09-02 | 1985-12-27 | Eltech Systems Limited | Method of conditioning a porous gas-diffusion electrode |
| CN1008543B (zh) * | 1985-11-21 | 1990-06-27 | 中国科学院大连化学物理研究所 | 一种电解水方法 |
| GB8617325D0 (en) * | 1986-07-16 | 1986-08-20 | Johnson Matthey Plc | Poison-resistant cathodes |
| US6171460B1 (en) * | 1993-05-10 | 2001-01-09 | John L. Bill | Chemically protected electrode system |
| FR2775486B1 (fr) * | 1998-03-02 | 2000-04-07 | Atochem Elf Sa | Cathode specifique, utilisable pour la preparation d'un chlorate de metal alcalin et son procede de fabrication |
| WO2003016592A2 (en) * | 2001-08-14 | 2003-02-27 | 3-One-2, Llc | Electrolytic cell and electrodes for use in electrochemical processes |
| US6686308B2 (en) * | 2001-12-03 | 2004-02-03 | 3M Innovative Properties Company | Supported nanoparticle catalyst |
| BRPI0616332A2 (pt) * | 2005-09-23 | 2011-06-14 | Mecs Inc | processo para a oxidaÇço catalÍtica de diàxido de enxofre em triàxido de enxofre e processo para fabricar Ácido sulférico e/ou àleo de um gÁs de fonte que compreende dÍàxido de enxofre |
| WO2010045483A2 (en) * | 2008-10-15 | 2010-04-22 | California Institute Of Technology | Ir-doped ruthenium oxide catalyst for oxygen evolution |
| US8221599B2 (en) * | 2009-04-03 | 2012-07-17 | The Board Of Trustees Of The Leland Stanford Junior University | Corrosion-resistant anodes, devices including the anodes, and methods of using the anodes |
| CN101525760B (zh) * | 2009-04-17 | 2011-03-23 | 中南大学 | 一种用于制备超级电容器RuO2电极材料的电沉积工艺 |
-
2009
- 2009-09-23 IT IT001621A patent/ITMI20091621A1/it unknown
-
2010
- 2010-09-03 TW TW099129779A patent/TWI490372B/zh not_active IP Right Cessation
- 2010-09-23 CA CA2769824A patent/CA2769824C/en not_active Expired - Fee Related
- 2010-09-23 DK DK10755197.0T patent/DK2480705T3/en active
- 2010-09-23 EA EA201270451A patent/EA023083B1/ru not_active IP Right Cessation
- 2010-09-23 CN CN201080042171.0A patent/CN102575363B/zh not_active Expired - Fee Related
- 2010-09-23 BR BR112012006530A patent/BR112012006530A2/pt not_active IP Right Cessation
- 2010-09-23 AU AU2010299850A patent/AU2010299850B2/en not_active Ceased
- 2010-09-23 MX MX2012003517A patent/MX2012003517A/es active IP Right Grant
- 2010-09-23 AR ARP100103474A patent/AR078442A1/es active IP Right Grant
- 2010-09-23 WO PCT/EP2010/064081 patent/WO2011036225A1/en not_active Ceased
- 2010-09-23 EP EP10755197.0A patent/EP2480705B1/en not_active Not-in-force
- 2010-09-23 KR KR1020127010290A patent/KR101742011B1/ko not_active Expired - Fee Related
- 2010-09-23 JP JP2012530263A patent/JP5824454B2/ja not_active Expired - Fee Related
-
2012
- 2012-01-31 IL IL217859A patent/IL217859A/en active IP Right Grant
- 2012-03-13 ZA ZA2012/01825A patent/ZA201201825B/en unknown
- 2012-03-22 US US13/427,153 patent/US9090982B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN102575363A (zh) | 2012-07-11 |
| EP2480705B1 (en) | 2018-11-21 |
| WO2011036225A1 (en) | 2011-03-31 |
| ZA201201825B (en) | 2013-05-29 |
| IL217859A0 (en) | 2012-03-29 |
| KR101742011B1 (ko) | 2017-05-31 |
| AR078442A1 (es) | 2011-11-09 |
| ITMI20091621A1 (it) | 2011-03-24 |
| CN102575363B (zh) | 2015-07-01 |
| JP2013505363A (ja) | 2013-02-14 |
| EA023083B1 (ru) | 2016-04-29 |
| CA2769824A1 (en) | 2011-03-31 |
| EP2480705A1 (en) | 2012-08-01 |
| AU2010299850B2 (en) | 2014-11-20 |
| HK1172936A1 (en) | 2013-05-03 |
| US9090982B2 (en) | 2015-07-28 |
| BR112012006530A2 (pt) | 2016-04-26 |
| AU2010299850A1 (en) | 2012-03-01 |
| IL217859A (en) | 2017-10-31 |
| TW201114948A (en) | 2011-05-01 |
| EA201270451A1 (ru) | 2012-08-30 |
| DK2480705T3 (en) | 2019-02-18 |
| TWI490372B (zh) | 2015-07-01 |
| CA2769824C (en) | 2017-12-19 |
| KR20120085787A (ko) | 2012-08-01 |
| US20120175270A1 (en) | 2012-07-12 |
| MX2012003517A (es) | 2012-04-19 |
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