CN102575363B - 具有受控晶态结构的电解工艺电极 - Google Patents

具有受控晶态结构的电解工艺电极 Download PDF

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Publication number
CN102575363B
CN102575363B CN201080042171.0A CN201080042171A CN102575363B CN 102575363 B CN102575363 B CN 102575363B CN 201080042171 A CN201080042171 A CN 201080042171A CN 102575363 B CN102575363 B CN 102575363B
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China
Prior art keywords
ruthenium
electrode
deposition
catalyst coatings
metal
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Expired - Fee Related
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CN201080042171.0A
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English (en)
Chinese (zh)
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CN102575363A (zh
Inventor
C·厄戈赫
S·莫拉
A·L·安托齐
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Industrie de Nora SpA
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Industrie de Nora SpA
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25B—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTION OF COMPOUNDS OR NON-METALS; APPARATUS THEREFOR
    • C25B11/00—Electrodes; Manufacture thereof not otherwise provided for
    • C25B11/04—Electrodes; Manufacture thereof not otherwise provided for characterised by the material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/02—Pretreatment of the material to be coated
    • C23C14/021—Cleaning or etching treatments
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/02—Pretreatment of the material to be coated
    • C23C14/024—Deposition of sublayers, e.g. to promote adhesion of the coating
    • C23C14/025—Metallic sublayers
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/02—Pretreatment of the material to be coated
    • C23C14/028—Physical treatment to alter the texture of the substrate surface, e.g. grinding, polishing
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/08—Oxides
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • C23C14/16—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon
    • C23C14/165—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon by cathodic sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/06—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25B—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTION OF COMPOUNDS OR NON-METALS; APPARATUS THEREFOR
    • C25B1/00—Electrolytic production of inorganic compounds or non-metals
    • C25B1/01—Products
    • C25B1/02—Hydrogen or oxygen
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25B—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTION OF COMPOUNDS OR NON-METALS; APPARATUS THEREFOR
    • C25B11/00—Electrodes; Manufacture thereof not otherwise provided for
    • C25B11/04—Electrodes; Manufacture thereof not otherwise provided for characterised by the material
    • C25B11/051—Electrodes formed of electrocatalysts on a substrate or carrier
    • C25B11/073—Electrodes formed of electrocatalysts on a substrate or carrier characterised by the electrocatalyst material
    • C25B11/075—Electrodes formed of electrocatalysts on a substrate or carrier characterised by the electrocatalyst material consisting of a single catalytic element or catalytic compound
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25B—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTION OF COMPOUNDS OR NON-METALS; APPARATUS THEREFOR
    • C25B11/00—Electrodes; Manufacture thereof not otherwise provided for
    • C25B11/04—Electrodes; Manufacture thereof not otherwise provided for characterised by the material
    • C25B11/051—Electrodes formed of electrocatalysts on a substrate or carrier
    • C25B11/073—Electrodes formed of electrocatalysts on a substrate or carrier characterised by the electrocatalyst material
    • C25B11/075—Electrodes formed of electrocatalysts on a substrate or carrier characterised by the electrocatalyst material consisting of a single catalytic element or catalytic compound
    • C25B11/081—Electrodes formed of electrocatalysts on a substrate or carrier characterised by the electrocatalyst material consisting of a single catalytic element or catalytic compound the element being a noble metal

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Catalysts (AREA)
  • Physical Vapour Deposition (AREA)
  • Electrodes For Compound Or Non-Metal Manufacture (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Electrolytic Production Of Non-Metals, Compounds, Apparatuses Therefor (AREA)
CN201080042171.0A 2009-09-23 2010-09-23 具有受控晶态结构的电解工艺电极 Expired - Fee Related CN102575363B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
ITMI2009A001621 2009-09-23
IT001621A ITMI20091621A1 (it) 2009-09-23 2009-09-23 Elettrodo per processi elettrolitici con struttura cristallina controllata
PCT/EP2010/064081 WO2011036225A1 (en) 2009-09-23 2010-09-23 Electrode for electrolytic processes with controlled crystalline structure

Publications (2)

Publication Number Publication Date
CN102575363A CN102575363A (zh) 2012-07-11
CN102575363B true CN102575363B (zh) 2015-07-01

Family

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CN201080042171.0A Expired - Fee Related CN102575363B (zh) 2009-09-23 2010-09-23 具有受控晶态结构的电解工艺电极

Country Status (17)

Country Link
US (1) US9090982B2 (enExample)
EP (1) EP2480705B1 (enExample)
JP (1) JP5824454B2 (enExample)
KR (1) KR101742011B1 (enExample)
CN (1) CN102575363B (enExample)
AR (1) AR078442A1 (enExample)
AU (1) AU2010299850B2 (enExample)
BR (1) BR112012006530A2 (enExample)
CA (1) CA2769824C (enExample)
DK (1) DK2480705T3 (enExample)
EA (1) EA023083B1 (enExample)
IL (1) IL217859A (enExample)
IT (1) ITMI20091621A1 (enExample)
MX (1) MX2012003517A (enExample)
TW (1) TWI490372B (enExample)
WO (1) WO2011036225A1 (enExample)
ZA (1) ZA201201825B (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ITMI20122035A1 (it) * 2012-11-29 2014-05-30 Industrie De Nora Spa Elettrodo per evoluzione di ossigeno in processi elettrochimici industriali
WO2017047792A1 (ja) * 2015-09-18 2017-03-23 旭化成株式会社 水電解用陽極、電解セル、並びに水電解用陽極の製造方法
WO2019204578A1 (en) * 2018-04-18 2019-10-24 Materion Corporation Electrodes for biosensors
CN113073336B (zh) * 2021-03-26 2022-07-08 浙江工业大学 一种RuO2泡沫镍复合电极及其制备方法和应用

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1307956A (en) * 1970-04-21 1973-02-21 Progil Process for depositing precious metals on a metallic support
US4501803A (en) * 1982-09-02 1985-02-26 Eltech Systems Corporation Porous gas diffusion-electrode
CN85108341A (zh) * 1985-11-21 1987-05-20 中国科学院大连化学物理研究所 铂钌活性涂层电极
EP0256673B1 (en) * 1986-07-16 1992-01-29 Johnson Matthey Public Limited Company Cathode suitable for use in electrochemical processes evolving hydrogen
CN101525760A (zh) * 2009-04-17 2009-09-09 中南大学 一种用于制备超级电容器RuO2电极材料的电沉积工艺

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU5889880A (en) * 1979-07-02 1981-01-15 Olin Corporation Manufacture of low overvoltage electrodes by cathodic sputtering
US6171460B1 (en) * 1993-05-10 2001-01-09 John L. Bill Chemically protected electrode system
FR2775486B1 (fr) * 1998-03-02 2000-04-07 Atochem Elf Sa Cathode specifique, utilisable pour la preparation d'un chlorate de metal alcalin et son procede de fabrication
AU2002336358A1 (en) * 2001-08-14 2003-03-03 3-One-2, Llc Electrolytic cell and electrodes for use in electrochemical processes
US6686308B2 (en) * 2001-12-03 2004-02-03 3M Innovative Properties Company Supported nanoparticle catalyst
RU2422357C2 (ru) * 2005-09-23 2011-06-27 Мекс, Инк. Катализаторы на основе оксида рутения для конверсии диоксида серы в триоксид серы
WO2010045483A2 (en) * 2008-10-15 2010-04-22 California Institute Of Technology Ir-doped ruthenium oxide catalyst for oxygen evolution
US8221599B2 (en) * 2009-04-03 2012-07-17 The Board Of Trustees Of The Leland Stanford Junior University Corrosion-resistant anodes, devices including the anodes, and methods of using the anodes

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1307956A (en) * 1970-04-21 1973-02-21 Progil Process for depositing precious metals on a metallic support
US4501803A (en) * 1982-09-02 1985-02-26 Eltech Systems Corporation Porous gas diffusion-electrode
CN85108341A (zh) * 1985-11-21 1987-05-20 中国科学院大连化学物理研究所 铂钌活性涂层电极
EP0256673B1 (en) * 1986-07-16 1992-01-29 Johnson Matthey Public Limited Company Cathode suitable for use in electrochemical processes evolving hydrogen
CN101525760A (zh) * 2009-04-17 2009-09-09 中南大学 一种用于制备超级电容器RuO2电极材料的电沉积工艺

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
Reactive sputtering of RuO2 films;E.Kolawa et.al;《Thin solid films》;19850615;第173卷(第2期);第217-224页 *
Ruthenium dioxide as cathode material for hydrogen evolution in hydroxide and chlorate solutions;Ann Cornell et al.;《Journal of the electrochemical society》;19930101;第140卷(第11期);第3123-3129页 *
Ruthenium oxide deposits prepared by cathodic electrosynthesis;I.Zhitomirsky et al.;《Materials Letters》;19970501;第31卷(第1-2期);第155-159页 *

Also Published As

Publication number Publication date
ITMI20091621A1 (it) 2011-03-24
AR078442A1 (es) 2011-11-09
WO2011036225A1 (en) 2011-03-31
AU2010299850B2 (en) 2014-11-20
JP2013505363A (ja) 2013-02-14
KR20120085787A (ko) 2012-08-01
IL217859A (en) 2017-10-31
EP2480705A1 (en) 2012-08-01
EA023083B1 (ru) 2016-04-29
TW201114948A (en) 2011-05-01
ZA201201825B (en) 2013-05-29
HK1172936A1 (en) 2013-05-03
BR112012006530A2 (pt) 2016-04-26
US9090982B2 (en) 2015-07-28
AU2010299850A1 (en) 2012-03-01
CA2769824A1 (en) 2011-03-31
MX2012003517A (es) 2012-04-19
EA201270451A1 (ru) 2012-08-30
JP5824454B2 (ja) 2015-11-25
US20120175270A1 (en) 2012-07-12
EP2480705B1 (en) 2018-11-21
CN102575363A (zh) 2012-07-11
TWI490372B (zh) 2015-07-01
CA2769824C (en) 2017-12-19
DK2480705T3 (en) 2019-02-18
IL217859A0 (en) 2012-03-29
KR101742011B1 (ko) 2017-05-31

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