TWI488934B - Adhesive composition, adhesive and adhesive tape using the same - Google Patents

Adhesive composition, adhesive and adhesive tape using the same Download PDF

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Publication number
TWI488934B
TWI488934B TW100144795A TW100144795A TWI488934B TW I488934 B TWI488934 B TW I488934B TW 100144795 A TW100144795 A TW 100144795A TW 100144795 A TW100144795 A TW 100144795A TW I488934 B TWI488934 B TW I488934B
Authority
TW
Taiwan
Prior art keywords
acrylate
meth
ethylenically unsaturated
adhesive
unsaturated compound
Prior art date
Application number
TW100144795A
Other languages
English (en)
Chinese (zh)
Other versions
TW201229181A (en
Inventor
Kousou Kanda
Original Assignee
Nippon Synthetic Chem Ind
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Synthetic Chem Ind filed Critical Nippon Synthetic Chem Ind
Publication of TW201229181A publication Critical patent/TW201229181A/zh
Application granted granted Critical
Publication of TWI488934B publication Critical patent/TWI488934B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/062—Copolymers with monomers not covered by C09J133/06
    • C09J133/066—Copolymers with monomers not covered by C09J133/06 containing -OH groups
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/385—Acrylic polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10—Esters
    • C08F220/12—Esters of monohydric alcohols or phenols
    • C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
    • C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
    • C08F220/1804—C4-(meth)acrylate, e.g. butyl (meth)acrylate, isobutyl (meth)acrylate or tert-butyl (meth)acrylate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10—Esters
    • C08F220/12—Esters of monohydric alcohols or phenols
    • C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
    • C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
    • C08F220/1808—C8-(meth)acrylate, e.g. isooctyl (meth)acrylate or 2-ethylhexyl (meth)acrylate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
    • C08F222/10—Esters
    • C08F222/1006—Esters of polyhydric alcohols or polyhydric phenols
    • C08F222/102—Esters of polyhydric alcohols or polyhydric phenols of dialcohols, e.g. ethylene glycol di(meth)acrylate or 1,4-butanediol dimethacrylate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
TW100144795A 2010-12-06 2011-12-06 Adhesive composition, adhesive and adhesive tape using the same TWI488934B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010271653 2010-12-06

Publications (2)

Publication Number Publication Date
TW201229181A TW201229181A (en) 2012-07-16
TWI488934B true TWI488934B (zh) 2015-06-21

Family

ID=46207101

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100144795A TWI488934B (zh) 2010-12-06 2011-12-06 Adhesive composition, adhesive and adhesive tape using the same

Country Status (5)

Country Link
JP (1) JP5954972B2 (ja)
KR (1) KR101881618B1 (ja)
CN (1) CN103249791B (ja)
TW (1) TWI488934B (ja)
WO (1) WO2012077613A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111281762A (zh) * 2018-12-07 2020-06-16 广州幻境科技有限公司 一种视力康复训练方法及系统

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KR20140012623A (ko) * 2010-12-10 2014-02-03 히타치가세이가부시끼가이샤 광학용 점착재 수지 조성물, 그것을 사용한 광학용 점착재 시트 및 화상 표시 장치
JP6057600B2 (ja) * 2012-08-09 2017-01-11 日東電工株式会社 粘着剤、粘着剤層、および粘着シート
EP2938485A1 (en) * 2012-12-27 2015-11-04 3M Innovative Properties Company Coatings for indium-tin oxide layers
CN105765024A (zh) * 2013-11-26 2016-07-13 株式会社E-Tec 光硬化型粘着剂组合物、粘着片及层叠体
JP6106148B2 (ja) * 2013-11-27 2017-03-29 日東電工株式会社 導電性粘着テープ、電子部材及び粘着剤
JP2017066407A (ja) * 2013-11-27 2017-04-06 日東電工株式会社 導電性粘着テープ、電子部材及び粘着剤
JP6610263B2 (ja) 2014-01-29 2019-11-27 日立化成株式会社 半導体装置の製造方法及び固体撮像素子
JP6547632B2 (ja) 2014-01-29 2019-07-24 日立化成株式会社 接着剤組成物、接着剤組成物から得られる樹脂硬化物、接着剤組成物を用いた半導体装置の製造方法、及び固体撮像素子
CN108359390A (zh) 2014-01-29 2018-08-03 日立化成株式会社 粘接剂组合物、使用了粘接剂组合物的半导体装置的制造方法、以及固体摄像元件
WO2016047361A1 (ja) * 2014-09-26 2016-03-31 富士フイルム株式会社 活性エネルギー線硬化型粘着剤組成物、粘着シート、タッチパネル用積層体および静電容量式タッチパネル
JP2016092299A (ja) * 2014-11-07 2016-05-23 日立化成株式会社 電子部品の製造方法、光半導体素子封止用フィルム状硬化性樹脂組成物及び電子部品
JP6691813B2 (ja) * 2015-06-16 2020-05-13 日東電工株式会社 粘着剤組成物
EP3106498B1 (en) 2015-06-16 2021-08-11 Nitto Denko Corporation Pressure-sensitive adhesive composition
JP6389198B2 (ja) * 2016-02-22 2018-09-12 リンテック株式会社 粘着シート、表示体およびそれらの製造方法
JP6740897B2 (ja) * 2016-12-28 2020-08-19 三菱ケミカル株式会社 活性エネルギー線硬化性接着剤組成物、偏光板用接着剤組成物、偏光板用接着剤およびそれを用いた偏光板
WO2019075418A1 (en) 2017-10-12 2019-04-18 Avery Dennison Corporation CLEAN ADHESIVE WITH LOW DEGASSING
CN111448222A (zh) * 2017-12-13 2020-07-24 迪睿合株式会社 光固化性树脂组合物
KR102317975B1 (ko) 2018-10-10 2021-10-27 삼성에스디아이 주식회사 점착 필름, 이를 포함하는 광학 부재 및 이를 포함하는 광학표시장치
KR102375038B1 (ko) * 2020-05-27 2022-03-16 한국화학연구원 무용제형 광경화 점착제 조성물 및 무용제형 광경화 점착제의 제조방법

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CN101511959A (zh) * 2005-06-21 2009-08-19 汉高公司 可光固化的弹性体组合物
CN101506298B (zh) * 2006-10-31 2011-10-05 日立化成工业株式会社 光学用树脂组合物和使用它的光学用树脂材料、用于图像显示用装置的光学滤光器以及图像显示用装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111281762A (zh) * 2018-12-07 2020-06-16 广州幻境科技有限公司 一种视力康复训练方法及系统

Also Published As

Publication number Publication date
CN103249791A (zh) 2013-08-14
TW201229181A (en) 2012-07-16
JP2012136696A (ja) 2012-07-19
KR101881618B1 (ko) 2018-07-24
CN103249791B (zh) 2015-05-13
WO2012077613A1 (ja) 2012-06-14
JP5954972B2 (ja) 2016-07-20
KR20130129236A (ko) 2013-11-27

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