TWI488779B - A manufacturing method of a tape manufacturing apparatus and a carrier tape - Google Patents

A manufacturing method of a tape manufacturing apparatus and a carrier tape Download PDF

Info

Publication number
TWI488779B
TWI488779B TW100121952A TW100121952A TWI488779B TW I488779 B TWI488779 B TW I488779B TW 100121952 A TW100121952 A TW 100121952A TW 100121952 A TW100121952 A TW 100121952A TW I488779 B TWI488779 B TW I488779B
Authority
TW
Taiwan
Prior art keywords
comb
substrate
carrier tape
perforator
last row
Prior art date
Application number
TW100121952A
Other languages
English (en)
Chinese (zh)
Other versions
TW201213207A (en
Inventor
Shogo Tokoi
Yasuhiro Shimizu
Original Assignee
Murata Manufacturing Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co filed Critical Murata Manufacturing Co
Publication of TW201213207A publication Critical patent/TW201213207A/zh
Application granted granted Critical
Publication of TWI488779B publication Critical patent/TWI488779B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
    • B26F1/38—Cutting-out; Stamping-out
    • B26F1/44—Cutters therefor; Dies therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
    • B26F1/38—Cutting-out; Stamping-out
    • B26F1/40—Cutting-out; Stamping-out using a press, e.g. of the ram type
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
    • B26F1/38—Cutting-out; Stamping-out
    • B26F1/44—Cutters therefor; Dies therefor
    • B26F2001/4472—Cutting edge section features
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0417—Feeding with belts or tapes

Landscapes

  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Packages (AREA)
  • Containers And Plastic Fillers For Packaging (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
TW100121952A 2010-09-17 2011-06-23 A manufacturing method of a tape manufacturing apparatus and a carrier tape TWI488779B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010208712A JP5273114B2 (ja) 2010-09-17 2010-09-17 キャリアテープ製造装置及びキャリアテープの製造方法

Publications (2)

Publication Number Publication Date
TW201213207A TW201213207A (en) 2012-04-01
TWI488779B true TWI488779B (zh) 2015-06-21

Family

ID=46058226

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100121952A TWI488779B (zh) 2010-09-17 2011-06-23 A manufacturing method of a tape manufacturing apparatus and a carrier tape

Country Status (4)

Country Link
JP (1) JP5273114B2 (ko)
KR (1) KR101347740B1 (ko)
CN (1) CN102527872B (ko)
TW (1) TWI488779B (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108861069A (zh) * 2018-08-23 2018-11-23 长电科技（滁州）有限公司 一种防粘黏压纹载带及载带制造方法

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08156081A (ja) * 1994-11-29 1996-06-18 Shin Etsu Polymer Co Ltd キャリアテープの製造方法
JPH0919958A (ja) * 1995-07-05 1997-01-21 Matsushita Electric Ind Co Ltd フィルム成形装置
TW360610B (en) * 1996-07-15 1999-06-11 Santoku Trading Co Ltd Emboss carrier tape for chiplike electronic elements and method to manufacture the same
TW473943B (en) * 1999-08-03 2002-01-21 Mitsui Mining & Amp Smelting C Method for making a film carrier tape for mounting electronic components
TW503207B (en) * 1999-05-17 2002-09-21 Tokyo Wells Kk Method and device for manufacturing carrier tape
JP2003104315A (ja) * 2001-09-27 2003-04-09 Tokyo Weld Co Ltd 部品収納体、部品収納体成形方法、および部品収納体成形装置
JP2006272952A (ja) * 2005-03-03 2006-10-12 Shin Etsu Polymer Co Ltd エンボスキャリアテープおよびその製造方法
JP2007229910A (ja) * 2006-03-02 2007-09-13 Honma Seisakusho:Kk ミシン目加工用金型

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59188406A (ja) * 1983-04-12 1984-10-25 Maruho Jidoki Kk Ｐｔｐ用ポケツト成形装置
JP2000334700A (ja) 1999-05-25 2000-12-05 Sony Corp Ｔ／ｆ金型パンチ
JP4010796B2 (ja) * 2001-11-16 2007-11-21 三井金属鉱業株式会社 順送用打抜き金型及び順送用打抜き装置
CN2664885Y (zh) * 2003-12-24 2004-12-22 天津市双鹿电子元件包装材料有限责任公司 深型腔载带成型模具
CN201089180Y (zh) * 2007-07-16 2008-07-23 欣竑科技有限公司 电子组件料带的冲孔用冲头及模具

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08156081A (ja) * 1994-11-29 1996-06-18 Shin Etsu Polymer Co Ltd キャリアテープの製造方法
JPH0919958A (ja) * 1995-07-05 1997-01-21 Matsushita Electric Ind Co Ltd フィルム成形装置
TW360610B (en) * 1996-07-15 1999-06-11 Santoku Trading Co Ltd Emboss carrier tape for chiplike electronic elements and method to manufacture the same
TW503207B (en) * 1999-05-17 2002-09-21 Tokyo Wells Kk Method and device for manufacturing carrier tape
TW473943B (en) * 1999-08-03 2002-01-21 Mitsui Mining & Amp Smelting C Method for making a film carrier tape for mounting electronic components
JP2003104315A (ja) * 2001-09-27 2003-04-09 Tokyo Weld Co Ltd 部品収納体、部品収納体成形方法、および部品収納体成形装置
JP2006272952A (ja) * 2005-03-03 2006-10-12 Shin Etsu Polymer Co Ltd エンボスキャリアテープおよびその製造方法
JP2007229910A (ja) * 2006-03-02 2007-09-13 Honma Seisakusho:Kk ミシン目加工用金型

Also Published As

Publication number Publication date
TW201213207A (en) 2012-04-01
KR101347740B1 (ko) 2014-01-03
CN102527872A (zh) 2012-07-04
KR20120030314A (ko) 2012-03-28
JP2012062095A (ja) 2012-03-29
JP5273114B2 (ja) 2013-08-28
CN102527872B (zh) 2014-09-24

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