TWI487623B - Laminated material and its manufacturing method - Google Patents

Laminated material and its manufacturing method Download PDF

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TWI487623B
TWI487623B TW099123738A TW99123738A TWI487623B TW I487623 B TWI487623 B TW I487623B TW 099123738 A TW099123738 A TW 099123738A TW 99123738 A TW99123738 A TW 99123738A TW I487623 B TWI487623 B TW I487623B
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Taiwan
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layer
resin
adhesive
polymer
polymer resin
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TW099123738A
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TW201204561A (en
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San Fang Chemical Industry Co
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Priority to US13/170,718 priority patent/US20120021662A1/en
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Description

積層材及其製造方法
本發明係關於一種積層材及其製造方法，特別是一種底部具有一接著層之積層材及其製造方法。
習知積層材(譬如皮料(leather)或片材(sheet))係為塑料堆積而成，或者是塑料堆積和基材(例如：織布或不織布)結合而成。在加工應用過程中，會利用高週波或熱壓等各種方法，使二個以上之積層材進行接著。然而，因為習知積層材底部本身無接著性，以致上述應用加工之接著效果不佳，故須再利用上糊或多次上糊或車縫補強，以改善接著性，如此會造成工程的複雜化及成本增加。
該習知積層材應用於製鞋業或其它皮革後加工產業，大都應用大量人力於車縫，上糊貼合或其它加工程序，這些加工過程不但繁複，效果不佳，且需耗費大量人力與工時，徒增成本。
因此，有必要提供一創新且富進步性的積層材及其製造方法，以解決上述問題。
本發明係提供一種積層材，其包括一主體層、一面層及一接著層。該主體層至少包含一第一高分子樹脂。該面層係位於該主體層上，該面層之材質係為第二高分子樹脂，該第二高分子樹脂之固形份係小於該第一高分子樹脂之固形份。該接著層係位於該主體層下，該接著層之材質係為熱可塑性樹脂，其受熱時具有黏著性，使得該積層材得以直接貼附於另一元件上，該接著層之軟化點係為35℃至180℃。
本發明另提供一種積層材之製造方法，其包括以下步驟：(a)形成一第二高分子混合物於一離型紙上，其中該第二高分子混合物包含一第二高分子樹脂；(b)烘乾該第二高分子混合物以形成一面層；(c)形成一主體層於該面層上，該主體層至少包含一第一高分子樹脂，該第一高分子樹脂之固形份係大於該第二高分子樹脂之固形份；(d)形成一熱可塑性樹脂於該主體層上；及(e)烘乾該熱可塑性樹脂以形成一接著層，而得一積層材，該接著層之軟化點係為35℃至180℃。
本發明另提供一種積層材之製造方法，其包括以下步驟：(a)形成一第二高分子混合物於一離型紙上，其中該第二高分子混合物包含一第二高分子樹脂；(b)烘乾該第二高分子混合物以形成一面層；(c)形成一第一膠合層於該面層上；(d)提供一半成品層，其包含一基材及一發泡層，該基材係為織布、超纖布或不織布：(e)貼合該半成品層於該第一膠合層；(f)形成一熱可塑性樹脂於另一離型紙上；(g)烘乾該熱可塑性樹脂以形成一接著層，該接著層之軟化點係為35℃至180℃；(h)形成一第一高分子混合物於該接著層上，其中該第一高分子混合物包含一第一高分子樹脂，該第一高分子樹脂之固形份係大於該第二高分子樹脂之固形份；(i)烘乾該第一高分子混合物以形成一高固層；(j)形成一第二膠合層於該高固層上；及(k)將該步驟(e)之結構貼合於該步驟(j)之結構上，其中該半成品層接觸該第二膠合層，而得一積層材，其中該半成品層及該高固層形成一主體層。
由於該接著層可於受熱時具有黏著性，因此使得該積層材得以利用高週波或熱壓等各種方法而直接貼附於另一元件上，不用再上膠、上糊、手縫或車縫，達到工程簡化及降低成本之效益。
參考圖1至圖4，顯示本發明積層材之第一實施例之製造方法之製程步驟示意圖。參考圖1，利用塗佈方式形成一第二高分子混合物於一離型紙10上，其中該第二高分子混合物包含一第二高分子樹脂。該第二高分子樹脂之固形份係小於50重量%，其係為聚氨酯樹脂，例如：熱可塑性聚氨酯彈性體(Thermoplastic Urethane,TPU)、水溶解型彈性體樹脂或水分散型(water dispersed)彈性體樹脂。接著，於50℃至120℃溫度下烘乾該第二高分子混合物以形成一面層12。較佳地，該離型紙10具有一離型紋路，使得該面層12具有對應之一表面紋路。
參考圖2，形成一主體層14於該面層12上，該主體層14至少包含一第一高分子樹脂，該第一高分子樹脂之固形份係大於該第二高分子樹脂之固形份。該主體層14可以是單層或多層結構，在本實施例中，該主體層14係為單層結構，可具發泡或不發泡結構，其形成方式如下。首先，利用塗佈或熱熔貼合方式形成一第一高分子混合物於該面層12上，其中該第一高分子混合物包含該第一高分子樹脂，該第一高分子樹脂之固形份係大於70重量%，其係為聚氨酯樹脂、熱可塑性聚氨酯彈性體(Thermoplastic Urethane,TPU)、乙烯-醋酸乙烯酯共聚合物(EVA)、苯乙烯-丁二烯(SB)、苯乙烯-丁二烯-苯乙烯(SBS)、聚氯乙烯(PVC)、聚乙烯(PE)、聚對苯二甲酸乙二醇脂或聚苯乙烯(PS)。接著，於100℃至150℃溫度下烘乾該第一高分子混合物以形成該主體層14。較佳地，該主體層14之厚度係為0.2mm至6.5mm。
參考圖3，利用塗佈方式形成一熱可塑性樹脂於該主體層14上，該熱可塑性樹脂係為聚氨酯(PU)接著劑、聚氯乙烯(PVC)接著劑、乙烯/醋酸乙烯酯共聚物(EVA)接著劑、熱熔膠或其混合物。該聚氨酯(PU)接著劑之固形份係大於10重量%。接著，於60℃至140℃溫度下烘乾該熱可塑性樹脂以形成一接著層16，離型後即得一積層材1(圖4)。可以理解的是，如果該熱可塑性樹脂係為一層薄膜，則其係利用熱熔貼合於該主體層14上。該接著層16之軟化點係為35℃至180℃
參考圖4，顯示本發明積層材之第一實施例之示意圖。該積層材1包括一主體層14、一面層12及一接著層16。該主體層14至少包含一第一高分子樹脂。在本實施例中，該主體層14係為單層結構，其材質係為該第一高分子樹脂。該第一高分子樹脂係為聚氨酯樹脂。該主體層14之厚度係 為0.2mm。
該面層12係位於該主體層14上，該面層12之材質係為第二高分子樹脂，該第二高分子樹脂之固形份係小於該第一高分子樹脂之固形份。該第二高分子樹脂係為聚氨酯樹脂，本實施例採用水溶解型彈性體樹脂。較佳地，該面層12具有一表面紋路。
該接著層16係位於該主體層14下，該接著層16之材質係為熱可塑性樹脂。該接著層16之軟化點係為180℃。該接著層16係為聚氨酯(PU)接著劑。
參考圖5，顯示本發明積層材之第一實施例之使用狀態示意圖。該積層材1之使用方式如下，首先將該積層材1置放於另一元件18(例如：另一積層材、皮料、片材或基材)上，使該接著層16接觸該另一元件18。接著，利用高週波或熱壓等各種方法，以進行接著。由於該接著層16可於受熱時具有黏著性，因此使得該積層材1得以直接貼附於另一元件18上。藉此，該積層材1和其它物件間易於接合，不用再上膠、上糊、手縫或車縫，達到工程簡化及降低成本之效益。
參考圖6至圖10，顯示本發明積層材之第二實施例之製造方法之製程步驟示意圖。參考圖6，利用塗佈方式形成一第二高分子混合物於一離型紙20上，其中該第二高分子混合物包含一第二高分子樹脂。該第二高分子樹脂之固形份係小於50重量%，其係為聚氨酯樹脂，例如：熱可塑性聚氨酯彈性體(Thermoplastic Urethane,TPU)、水溶解型彈 性體樹脂或水分散型(water dispersed)彈性體樹脂。接著，於50℃至120℃溫度下烘乾該第二高分子混合物以形成一面層22。較佳地，該離型紙20具有一離型紋路，使得該面層22具有對應之一表面紋路。
參考圖7，利用塗佈方式形成一第一膠合層24於該面層22上。
參考圖8，形成一主體層30於該面層22上，使得該主體層30利用該第一膠合層24貼合於該面層22上。該主體層30至少包含一第一高分子樹脂，該第一高分子樹脂之固形份係大於該第二高分子樹脂之固形份。在本實施例中，該主體層30係為雙層結構，其形成方式如下。首先，提供一半成品層。在本實施例中，該半成品層係為濕式製程之半成品，其包含一基材28及一發泡層26。該基材28係為織布、超纖布或不織布，該發泡層26之材質係為該第一高分子樹脂，且其係為聚氨酯樹脂、熱可塑性聚氨酯樹酯(Thermoplastic Urethane,TPU)、乙烯-醋酸乙烯共聚合物(EVA)、苯乙烯-丁二烯(SB)、苯乙烯-丁二烯-苯乙烯(SBS)、聚氯乙烯(PVC)、聚乙烯(PE)、聚對苯二甲酸乙二醇脂或聚苯乙烯(PS)。接著，貼合該半成品層於該第一膠合層24，其中該半成品層即為該主體層30。
參考圖9，利用塗佈方式形成一熱可塑性樹脂於該主體層30上，該熱可塑性樹脂係為聚氨酯(PU)接著劑、聚氯乙烯(PVC)接著劑、乙烯/醋酸乙烯酯共聚物(EVA)接著劑、熱熔膠或其混合物。該聚氨酯(PU)接著劑之固形份係大於 10重量%。接著，於60℃至140℃溫度下烘乾該熱可塑性樹脂以形成一接著層32，離型後即得一積層材2(圖10)。該接著層32之軟化點係為35℃至180℃。
參考圖10，顯示本發明積層材之第二實施例之示意圖。該積層材2包括一主體層30、一面層22及一接著層32。該主體層30係為雙層結構，其係為一半成品層。在本實施例中，該半成品層係為濕式製程之半成品，其包含一基材28及一發泡層26。該基材28係為織布、超纖布或不織布，該發泡層26之材質係為該第一高分子樹脂，且其係為聚氨酯樹脂。該主體層30之厚度係為2.0mm，其係利用一第一膠合層24黏附於該面層22。
該面層22係位於該主體層30上，該面層22之材質係為第二高分子樹脂，該第二高分子樹脂之固形份係小於該第一高分子樹脂之固形份。該第二高分子樹脂係為聚氨酯樹脂，本實施例採用水溶解型彈性體樹脂。較佳地，該面層22具有一表面紋路。
該接著層32係位於該主體層30下，該接著層32之材質係為熱可塑性樹脂。該接著層32係為聚氨酯(PU)接著劑。該接著層32受熱時具有黏著性，使得該積層材2得以直接貼附於另一元件上。該接著層32之軟化點係為180℃。
參考圖11至圖17，顯示本發明積層材之第三實施例之製造方法之製程步驟示意圖。參考圖11，利用塗佈方式形成一第二高分子混合物於一離型紙40上，其中該第二高分子混合物包含一第二高分子樹脂。該第二高分子樹脂之固形 份係小於50重量%，其係為聚氨酯樹脂，例如：熱可塑性聚氨酯彈性體(Thermoplastic Urethane,TPU)、水溶解型彈性體樹脂或水分散型(water dispersed)彈性體樹脂。接著，於50℃至120℃溫度下烘乾該第二高分子混合物以形成一面層42。較佳地，該離型紙40具有一離型紋路，使得該面層42具有對應之一表面紋路。
參考圖12，利用塗佈方式形成一第一膠合層44於該面層42上。
參考圖13，提供一半成品層50，在本實施例中，該半成品層50係為濕式製程之半成品，其包含一基材48及一發泡層46。該基材48係為織布、超纖布或不織布，該發泡層46係為高分子樹酯，且其係為聚氨酯樹脂。接著，貼合該半成品層50於該第一膠合層44上，以形成一第一半品結構A。
參考圖14，利用塗佈方式形成一熱可塑性樹脂於另一離型紙52上，該熱可塑性樹脂係為聚氨酯(PU)接著劑、聚氯乙烯(PVC)接著劑、乙烯/醋酸乙烯酯共聚物(EVA)接著劑、熱熔膠或其混合物。該聚氨酯(PU)接著劑之固形份係大於10重量%。接著，於60℃至140℃溫度下烘乾該熱可塑性樹脂以形成一接著層54。該接著層54之軟化點係為35℃至180℃。
參考圖15，利用塗佈方式形成一第一高分子混合物於該接著層54上，其中該第一高分子混合物包含該第一高分子樹脂，該第一高分子樹脂之固形份係大於該第二高分子樹 脂之固形份。在本實施例中，該第一高分子樹脂之固形份係大於70重量%，其係為聚氨酯樹脂、熱可塑性聚氨酯樹酯(Thermoplastic Urethane,TPU)、乙烯-醋酸乙烯共聚合物(EVA)、苯乙烯-丁二烯(SB)、苯乙烯-丁二烯-苯乙烯(SBS)、聚氯乙烯(PVC)、聚乙烯(PE)、聚對苯二甲酸乙二醇脂或聚苯乙烯(PS)。接著，於100℃至150℃溫度下烘乾該第一高分子混合物以形成一高固層56。
參考圖16，利用塗佈方式形成一第二膠合層58於該高固層56上。
參考圖17，將圖13之第一半品結構A貼合於圖16之結構上，其中該半成品層50接觸該第二膠合層58，且離型後即得一積層材5，其中該半成品層50及該高固層56形成一主體層60，且該接著層54可於受熱時具有黏著性，使得該積層材5得以直接貼附於另一元件上。
要注意的是，本實施例中上述步驟可以互換，亦即可以先製造出圖16之結構再製造出圖13之第一半品結構A，之後再貼合。
參考圖17，顯示本發明積層材之第三實施例之示意圖。該積層材5包括一主體層60、一面層42及一接著層54。該主體層60包括一高固層56及一半成品層50，在本實施例中，該半成品層50係為濕式製程之半成品，其包含一基材48及一發泡層46。該基材48係為織布、超纖布或不織布，該發泡層46係為高分子樹酯，且其係為聚氨酯樹脂。該主體層60之厚度係為0.5mm。該半成品層50係利用一第一膠 合層44黏附於該面層42，且該半成品層50係利用一第二膠合層58黏附於該高固層56。因此，該面層42係位於該半成品層50上，該高固層56係位於該半成品層50下，該接著層54係位於該高固層56下。
該高固層56之材質係為第一高分子樹脂，且其係為聚氨酯樹脂。
該面層42係位於該主體層60上，該面層42之材質係為第二高分子樹脂，該第二高分子樹脂之固形份係小於該第一高分子樹脂之固形份。該第二高分子樹脂係為聚氨酯樹脂，本實施例採用水分散型(water dispersed)彈性體樹脂。較佳地，該面層42具有一表面紋路。
該接著層54係位於該主體層60下，該接著層54之材質係為熱可塑性樹脂。該接著層54係為聚氨酯(PU)接著劑。該接著層54受熱時具有黏著性，使得該積層材5得以直接貼附於另一元件上。該接著層54之軟化點係為180℃。
上述實施例僅為說明本發明之原理及其功效，並非限制本發明，因此習於此技術之人士對上述實施例進行修改及變化仍不脫本發明之精神。本發明之權利範圍應如後述之申請專利範圍所列。
1‧‧‧本發明積層材之第一實施例
2‧‧‧本發明積層材之第二實施例
5‧‧‧本發明積層材之第三實施例
10‧‧‧離型紙
12‧‧‧面層
14‧‧‧主體層
16‧‧‧接著層
18‧‧‧另一元件
20‧‧‧離型紙
22‧‧‧面層
24‧‧‧第一膠合層
26‧‧‧發泡層
28‧‧‧基材
30‧‧‧主體層
32‧‧‧接著層
40‧‧‧離型紙
42‧‧‧面層
44‧‧‧第一膠合層
46‧‧‧發泡層
48‧‧‧基材
50‧‧‧半成品層
52‧‧‧另一離型紙
54‧‧‧接著層
56‧‧‧高固層
58‧‧‧第二膠合層
60‧‧‧主體層
A‧‧‧第一半品結構
圖1至圖4顯示本發明積層材之第一實施例之製造方法之製程步驟示意圖；圖5顯示本發明積層材之第一實施例之使用狀態示意圖； 圖6至圖10顯示本發明積層材之第二實施例之製造方法之製程步驟示意圖；及圖11至圖17顯示本發明積層材之第三實施例之製造方法之製程步驟示意圖。
1．．．本發明積層材之第一實施例
12．．．面層
14．．．主體層
16．．．接著層

Claims (34)

  1. 一種積層材，包括：一主體層，至少包含一第一高分子樹脂；一面層，位於該主體層上，該面層之材質係為第二高分子樹脂，該第二高分子樹脂之固形份係小於該第一高分子樹脂之固形份；及一接著層，位於該主體層下，該接著層之材質係為熱可塑性樹脂，其受熱時具有黏著性，使得該積層材得以直接貼附於另一元件上，該接著層之軟化點係為35℃至180℃。
  2. 如請求項1之積層材，其中該第一高分子樹脂之固形份係大於70重量%。
  3. 如請求項1之積層材，其中該第一高分子樹脂係為聚氨酯樹脂、熱可塑性聚氨酯樹酯(Thermoplastic Urethane,TPU)、乙烯-醋酸乙烯共聚合物(EVA)、苯乙烯-丁二烯(SB)、苯乙烯-丁二烯-苯乙烯(SBS)、聚氯乙烯(PVC)、聚乙烯(PE)、聚對苯二甲酸乙二醇脂或聚苯乙烯(PS)。
  4. 如請求項1之積層材，其中該主體層之厚度係為0.2 mm至6.5 mm。
  5. 如請求項1之積層材，其中該第二高分子樹脂之固形份係小於50重量%。
  6. 如請求項1之積層材，其中該第二高分子樹脂係為聚氨酯樹脂。
  7. 如請求項6之積層材，其中該第二高分子樹脂係為熱可塑性聚氨酯彈性體(Thermoplastic Urethane,TPU)、水溶解型彈性體樹脂或水分散型(water dispersed)彈性體樹脂。
  8. 如請求項1之積層材，其中該面層具有一表面紋路。
  9. 如請求項1之積層材，其中該接著層係為聚氨酯(PU)接著劑、聚氯乙烯(PVC)接著劑、乙烯/醋酸乙烯酯共聚物(EVA)接著劑、熱熔膠或其混合物。
  10. 如請求項9之積層材，其中該聚氨酯(PU)接著劑之固形份係大於10重量%。
  11. 如請求項1之積層材，其中該主體層係為單層結構，其材質係為該第一高分子樹脂，且該主體層、該面層及該接著層皆係利用塗佈方式形成。
  12. 如請求項1之積層材，其中該主體層包含一半成品層及一高固層，該半成品層包含一基材及一發泡層，該基材係為織布、超纖布或不織布，該高固層之材質係為該第一高分子樹脂。
  13. 如請求項12之積層材，其中該面層係位於該半成品層上，該高固層係位於該半成品層下，該接著層係位於該高固層下。
  14. 如請求項12之積層材，其中該發泡層之材質係為聚氨酯樹脂。
  15. 如請求項12之積層材，其中該半成品層係利用一第一膠合層黏附於該面層，該半成品層係利用一第二膠合層黏附於該高固層。
  16. 如請求項1之積層材，其中該主體層係為一半成品層，其包含一基材及一發泡層，該基材係為織布、超纖布或不織布，該發泡層之材質係為該第一高分子樹脂，其係為聚氨酯樹脂。
  17. 如請求項16之積層材，其中該主體層係利用一第一膠合層黏附於該面層。
  18. 一種積層材之製造方法，包括以下步驟：(a)　形成一第二高分子混合物於一離型紙上，其中該第二高分子混合物包含一第二高分子樹脂；(b)　烘乾該第二高分子混合物以形成一面層；(c)　形成一主體層於該面層上，該主體層至少包含一第一高分子樹脂，該第一高分子樹脂之固形份係大於該第二高分子樹脂之固形份；(d)　形成一熱可塑性樹脂於該主體層上；及(e)　烘乾該熱可塑性樹脂以形成一接著層，而得一積層材，其中該接著層可於受熱時具有黏著性，使得該積層材得以直接貼附於另一元件上，該接著層之軟化點係為35℃至180℃。
  19. 如請求項18之方法，其中該步驟(a)中該離型紙具有一離型紋路，使得該步驟(b)中該面層具有對應之一表面紋路。
  20. 如請求項18之方法，其中該步驟(a)中該第二高分子樹脂之固形份係小於50重量%。
  21. 如請求項18之方法，其中該步驟(a)中該第二高分子樹脂係為無溶劑型聚氨酯樹脂。
  22. 如請求項18之方法，其中該步驟(c)包括：(c1)　形成一第一高分子混合物於該面層上，其中該第一高分子混合物包含該第一高分子樹脂；及(c2)　烘乾該第一高分子混合物以形成該主體層，其中該主體層係為單層結構。
  23. 如請求項18之方法，其中該步驟(c)包括：(c1)　形成一第一膠合層於該面層上；(c2)　提供一半成品層，其包含一基材及一發泡層，該基材係為織布、超纖布或不織布，該發泡層之材質係為該第一高分子樹脂，其係為聚氨酯樹脂：及(c3)　貼合該半成品層於該第一膠合層，其中該半成品層係為該主體層。
  24. 如請求項18之方法，其中該步驟(c)中該第一高分子樹脂之固形份係大於70重量%。
  25. 如請求項18之方法，其中該步驟(c)中該第一高分子樹脂係為聚氨酯樹脂。
  26. 如請求項18之方法，其中該步驟(d)中該熱可塑性樹脂係為聚氨酯(PU)接著劑、聚氯乙烯(PVC)接著劑、乙烯/醋酸乙烯酯共聚物(EVA)接著劑、熱熔膠或其混合物。
  27. 如請求項18之方法，其中該步驟(a)中第二高分子混合物係利用塗佈方式形成於該離型紙，該步驟(d)中該熱可塑性樹脂係利用塗佈方式或熱熔貼合形成於該主體層上。
  28. 一種積層材之製造方法，包括以下步驟：(a)　形成一第二高分子混合物於一離型紙上，其中該第二高分子混合物包含一第二高分子樹脂；(b)　烘乾該第二高分子混合物以形成一面層；(c)　形成一第一膠合層於該面層上；(d)　提供一半成品層，其包含一基材及一發泡層，該基材係為織布、超纖布或不織布：(e)　貼合該半成品層於該第一膠合層；(f)　形成一熱可塑性樹脂於另一離型紙上；(g)　烘乾該熱可塑性樹脂以形成一接著層，該接著層之軟化點係為35℃至180℃；(h)　形成一第一高分子混合物於該接著層上，其中該第一高分子混合物包含一第一高分子樹脂，該第一高分子樹脂之固形份係大於該第二高分子樹脂之固形份；(i)　烘乾該第一高分子混合物以形成一高固層；(j)　形成一第二膠合層於該高固層上；及(k)　將該步驟(e)之結構貼合於該步驟(j)之結構上，其中該半成品層接觸該第二膠合層，而得一積層材，其中該半成品層及該高固層形成一主體層，且該接著層可於受熱時具有黏著性，使得該積層材得以直接貼附於另一元件上。
  29. 如請求項28之方法，其中該步驟(a)中該離型紙具有一離型紋路，使得該步驟(b)中該面層具有對應之一表面紋路。
  30. 如請求項28之方法，其中該步驟(a)中該第二高分子樹脂之固形份係小於50重量%。
  31. 如請求項28之方法，其中該步驟(a)中該第二高分子樹脂係為聚氨酯樹脂。
  32. 如請求項28之方法，其中該步驟(f)中該熱可塑性樹脂係為聚氨酯(PU)接著劑、聚氯乙烯(PVC)接著劑、乙烯/醋酸乙烯酯共聚物(EVA)接著劑、熱熔膠或其混合物。
  33. 如請求項28之方法，其中該步驟(h)中該第一高分子樹脂係為聚氨酯樹脂。
  34. 如請求項28之方法，其中該步驟(a)中第二高分子混合物係利用塗佈方式形成於該離型紙，該步驟(f)中該熱可塑性樹脂係利用塗佈方式形成於另一離型紙上，及該步驟(h)中該第一高分子混合物係利用塗佈方式或熱熔貼合形成於該接著層上。
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CN113199845A (zh) * 2020-02-03 2021-08-03 三芳化学工业股份有限公司 易高周波熔断积层材
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