TWI479972B - Multi - layer flexible printed wiring board and manufacturing method thereof - Google Patents

Multi - layer flexible printed wiring board and manufacturing method thereof Download PDF

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Publication number
TWI479972B
TWI479972B TW098103413A TW98103413A TWI479972B TW I479972 B TWI479972 B TW I479972B TW 098103413 A TW098103413 A TW 098103413A TW 98103413 A TW98103413 A TW 98103413A TW I479972 B TWI479972 B TW I479972B
Authority
TW
Taiwan
Prior art keywords
layer
hole
conductive
stacked
conductive layer
Prior art date
Application number
TW098103413A
Other languages
English (en)
Chinese (zh)
Other versions
TW200945987A (en
Inventor
Fumihiko Matsuda
Original Assignee
Nippon Mektron Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mektron Kk filed Critical Nippon Mektron Kk
Publication of TW200945987A publication Critical patent/TW200945987A/zh
Application granted granted Critical
Publication of TWI479972B publication Critical patent/TWI479972B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
TW098103413A 2008-04-21 2009-02-03 Multi - layer flexible printed wiring board and manufacturing method thereof TWI479972B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008110232A JP5259240B2 (ja) 2008-04-21 2008-04-21 多層フレキシブルプリント配線板およびその製造方法

Publications (2)

Publication Number Publication Date
TW200945987A TW200945987A (en) 2009-11-01
TWI479972B true TWI479972B (zh) 2015-04-01

Family

ID=41284089

Family Applications (1)

Application Number Title Priority Date Filing Date
TW098103413A TWI479972B (zh) 2008-04-21 2009-02-03 Multi - layer flexible printed wiring board and manufacturing method thereof

Country Status (3)

Country Link
JP (1) JP5259240B2 (ja)
CN (1) CN101568226B (ja)
TW (1) TWI479972B (ja)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5485299B2 (ja) * 2010-02-08 2014-05-07 日本メクトロン株式会社 多層プリント配線板の製造方法
CN102686052A (zh) * 2011-03-16 2012-09-19 钒创科技股份有限公司 软性印刷电路板及其制造方法
CN103037625B (zh) * 2011-09-30 2016-01-13 无锡江南计算技术研究所 带有芯片窗口的印刷线路板的去短路方法
CN103052281A (zh) * 2011-10-14 2013-04-17 富葵精密组件(深圳)有限公司 嵌入式多层电路板及其制作方法
CN103579008B (zh) * 2012-07-26 2017-11-10 中芯国际集成电路制造(上海)有限公司 一种焊盘结构及其制备方法
CN104131278B (zh) * 2013-04-30 2016-08-10 富葵精密组件(深圳)有限公司 黑化药水及电路板的制作方法
JP6240007B2 (ja) * 2014-03-18 2017-11-29 日本メクトロン株式会社 フレキシブルプリント基板の製造方法およびフレキシブルプリント基板の製造に用いられる中間生成物
CN106231788A (zh) * 2016-09-30 2016-12-14 深圳天珑无线科技有限公司 电路板
JP6732723B2 (ja) * 2017-12-14 2020-07-29 日本メクトロン株式会社 高周波伝送用プリント配線板
CN114430626B (zh) * 2020-10-29 2024-07-19 鹏鼎控股(深圳)股份有限公司 印刷线路板对印刷线路板连接结构及其制作方法
CN114698225B (zh) * 2020-12-31 2024-09-13 深南电路股份有限公司 一种电池保护板及其制程方法和电子装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003078062A (ja) * 2001-09-05 2003-03-14 Hitachi Cable Ltd 配線基板及びその製造方法
TW200814893A (en) * 2006-04-12 2008-03-16 Nippon Mektron Kk Multilayer circuit board having cable section, and manufacturing method thereof

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7256354B2 (en) * 2000-06-19 2007-08-14 Wyrzykowska Aneta O Technique for reducing the number of layers in a multilayer circuit board
JP2002329966A (ja) * 2001-04-27 2002-11-15 Sumitomo Bakelite Co Ltd 多層配線板製造用配線基板及び多層配線板
JP2006310543A (ja) * 2005-04-28 2006-11-09 Ngk Spark Plug Co Ltd 配線基板及びその製造方法、半導体回路素子付き配線基板
JP4527045B2 (ja) * 2005-11-01 2010-08-18 日本メクトロン株式会社 ケーブル部を有する多層配線基板の製造方法
TWI278268B (en) * 2006-02-23 2007-04-01 Via Tech Inc Arrangement of non-signal through vias and wiring board applying the same

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003078062A (ja) * 2001-09-05 2003-03-14 Hitachi Cable Ltd 配線基板及びその製造方法
TW200814893A (en) * 2006-04-12 2008-03-16 Nippon Mektron Kk Multilayer circuit board having cable section, and manufacturing method thereof

Also Published As

Publication number Publication date
CN101568226B (zh) 2012-07-11
JP5259240B2 (ja) 2013-08-07
TW200945987A (en) 2009-11-01
CN101568226A (zh) 2009-10-28
JP2009260186A (ja) 2009-11-05

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