TWI459439B - 熱輻射單元及曝光裝置 - Google Patents

熱輻射單元及曝光裝置 Download PDF

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Publication number
TWI459439B
TWI459439B TW099105351A TW99105351A TWI459439B TW I459439 B TWI459439 B TW I459439B TW 099105351 A TW099105351 A TW 099105351A TW 99105351 A TW99105351 A TW 99105351A TW I459439 B TWI459439 B TW I459439B
Authority
TW
Taiwan
Prior art keywords
heat
heat radiating
light
plate
heat sink
Prior art date
Application number
TW099105351A
Other languages
English (en)
Chinese (zh)
Other versions
TW201034559A (en
Inventor
Takaaki Terashi
Manabu Arai
Original Assignee
Canon Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Kk filed Critical Canon Kk
Publication of TW201034559A publication Critical patent/TW201034559A/zh
Application granted granted Critical
Publication of TWI459439B publication Critical patent/TWI459439B/zh

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70883—Environment aspects, e.g. pressure of beam-path gas, temperature of optical system
    • G03F7/70891—Temperature
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/7055—Exposure light control in all parts of the microlithographic apparatus, e.g. pulse length control or light interruption
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3731—Ceramic materials or glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Materials Engineering (AREA)
  • Atmospheric Sciences (AREA)
  • Public Health (AREA)
  • Epidemiology (AREA)
  • Environmental & Geological Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Toxicology (AREA)
  • Thermal Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Discharge Lamps And Accessories Thereof (AREA)
TW099105351A 2009-03-02 2010-02-24 熱輻射單元及曝光裝置 TWI459439B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009047466A JP5305987B2 (ja) 2009-03-02 2009-03-02 放熱ユニット及び露光装置

Publications (2)

Publication Number Publication Date
TW201034559A TW201034559A (en) 2010-09-16
TWI459439B true TWI459439B (zh) 2014-11-01

Family

ID=42967051

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099105351A TWI459439B (zh) 2009-03-02 2010-02-24 熱輻射單元及曝光裝置

Country Status (3)

Country Link
JP (1) JP5305987B2 (ja)
KR (1) KR101240018B1 (ja)
TW (1) TWI459439B (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101238453B1 (ko) * 2012-07-26 2013-02-28 유버 주식회사 광 경화 장치

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003089841A1 (en) * 2002-04-20 2003-10-30 Ewington Christopher James Lighting module
CN2833884Y (zh) * 2005-06-27 2006-11-01 杨开艳 一种散热器的结构改良

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05326762A (ja) * 1992-05-20 1993-12-10 Ibiden Co Ltd 半導体素子搭載装置用放熱板
JP2002097372A (ja) * 2000-09-20 2002-04-02 Polymatech Co Ltd 熱伝導性高分子組成物及び熱伝導性成形体
JP2002329651A (ja) * 2001-04-27 2002-11-15 Nikon Corp 露光装置、露光装置の製造方法、及びマイクロデバイスの製造方法
JP2004157219A (ja) * 2002-11-05 2004-06-03 Fuji Photo Film Co Ltd 露光ヘッドおよび露光装置
JP4548317B2 (ja) * 2004-11-18 2010-09-22 三菱マテリアル株式会社 絶縁回路基板及びこれを備えるパワーモジュール構造体
JP2007242820A (ja) 2006-03-08 2007-09-20 Asahi Kasei Corp 発光デバイス及び発光デバイスモジュール
JP2007323879A (ja) * 2006-05-31 2007-12-13 Fujitsu General Ltd 光源装置及び光源装置を用いたプロジェクタ
JP5188120B2 (ja) * 2007-08-10 2013-04-24 新光電気工業株式会社 半導体装置
JP4692908B2 (ja) 2008-04-14 2011-06-01 電気化学工業株式会社 モジュール構造体

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003089841A1 (en) * 2002-04-20 2003-10-30 Ewington Christopher James Lighting module
CN2833884Y (zh) * 2005-06-27 2006-11-01 杨开艳 一种散热器的结构改良

Also Published As

Publication number Publication date
KR20100099050A (ko) 2010-09-10
JP5305987B2 (ja) 2013-10-02
JP2010205806A (ja) 2010-09-16
KR101240018B1 (ko) 2013-03-06
TW201034559A (en) 2010-09-16

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