TWI458795B - 異向性導電膜、該膜之組成物及包含該膜之裝置 - Google Patents
異向性導電膜、該膜之組成物及包含該膜之裝置 Download PDFInfo
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- TWI458795B TWI458795B TW100135255A TW100135255A TWI458795B TW I458795 B TWI458795 B TW I458795B TW 100135255 A TW100135255 A TW 100135255A TW 100135255 A TW100135255 A TW 100135255A TW I458795 B TWI458795 B TW I458795B
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- NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 description 1
- 238000005191 phase separation Methods 0.000 description 1
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- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L33/04—Homopolymers or copolymers of esters
- C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
- C08L33/10—Homopolymers or copolymers of methacrylic acid esters
- C08L33/12—Homopolymers or copolymers of methyl methacrylate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L35/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical, and containing at least one other carboxyl radical in the molecule, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L35/04—Homopolymers or copolymers of nitriles
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
- C09J175/14—Polyurethanes having carbon-to-carbon unsaturated bonds
- C09J175/16—Polyurethanes having carbon-to-carbon unsaturated bonds having terminal carbon-to-carbon unsaturated bonds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/06—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances
- H01B1/12—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances organic substances
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Dispersion Chemistry (AREA)
- Non-Insulated Conductors (AREA)
- Conductive Materials (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020100138221A KR101279980B1 (ko) | 2010-12-29 | 2010-12-29 | 이방 전도성 필름 조성물 및 이로부터 제조된 이방 전도성 필름 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201226497A TW201226497A (en) | 2012-07-01 |
| TWI458795B true TWI458795B (zh) | 2014-11-01 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW100135255A TWI458795B (zh) | 2010-12-29 | 2011-09-29 | 異向性導電膜、該膜之組成物及包含該膜之裝置 |
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| JP (2) | JP6338810B2 (enExample) |
| KR (1) | KR101279980B1 (enExample) |
| CN (1) | CN102559075B (enExample) |
| TW (1) | TWI458795B (enExample) |
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| KR101279980B1 (ko) * | 2010-12-29 | 2013-07-05 | 제일모직주식회사 | 이방 전도성 필름 조성물 및 이로부터 제조된 이방 전도성 필름 |
| US9281097B2 (en) * | 2010-12-29 | 2016-03-08 | Cheil Industries, Inc. | Anisotropic conductive film, composition for the same, and apparatus including the same |
| KR101385032B1 (ko) * | 2010-12-31 | 2014-04-14 | 제일모직주식회사 | 이방 전도성 필름 조성물 및 이로부터 제조된 이방 전도성 필름 |
| KR101479658B1 (ko) * | 2011-11-18 | 2015-01-06 | 제일모직 주식회사 | 가압착 공정성이 개선된 이방성 도전 필름 |
| KR101631359B1 (ko) | 2013-08-30 | 2016-06-16 | 제일모직주식회사 | 인체에 무해한 이방 도전성 필름용 조성물, 이방 도전성 필름, 및 상기 필름에 의해 접속된 회로접속물 |
| JP6460344B2 (ja) * | 2013-09-24 | 2019-01-30 | エルジー・ケム・リミテッド | 粘着性組成物 |
| KR101594483B1 (ko) | 2013-10-18 | 2016-02-16 | 제일모직주식회사 | 인체에 무해한 이방 도전성 필름용 조성물, 이방 도전성 필름, 및 상기 필름에 의해 접속된 디스플레이 장치 |
| US10611932B2 (en) | 2014-08-12 | 2020-04-07 | Mitsubishi Chemical Corporation | Transparent adhesive sheet |
| CN104531041B (zh) * | 2014-12-05 | 2017-05-10 | 烟台泰盛精化科技有限公司 | 一种聚醚型聚氨酯丙烯酸酯紫外光固化胶粘剂及其制备方法 |
| WO2016114279A1 (ja) * | 2015-01-14 | 2016-07-21 | 東洋紡株式会社 | 導電性銀ペースト |
| JP6320660B1 (ja) * | 2016-05-23 | 2018-05-09 | タツタ電線株式会社 | 導電性接着剤組成物 |
| WO2018181589A1 (ja) * | 2017-03-29 | 2018-10-04 | 日立化成株式会社 | 接着剤組成物及び構造体 |
| JP7264598B2 (ja) * | 2018-04-02 | 2023-04-25 | デクセリアルズ株式会社 | 接着剤組成物及び接続構造体 |
| KR102813180B1 (ko) * | 2018-12-28 | 2025-05-28 | 엘지디스플레이 주식회사 | 측면 접속 구조를 갖는 표시 장치 및 이의 본딩 방법 |
| CN110564337B (zh) * | 2019-09-12 | 2021-06-29 | 天津伟景诺兰达科技有限公司 | 一种acf导电胶带及其制备工艺和应用 |
| CN116685652A (zh) * | 2020-11-12 | 2023-09-01 | 株式会社力森诺科 | 电路连接用黏合剂薄膜及其制造方法、以及连接结构体及其制造方法 |
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2010
- 2010-12-29 KR KR1020100138221A patent/KR101279980B1/ko not_active Expired - Fee Related
-
2011
- 2011-09-23 US US13/241,811 patent/US8608985B2/en active Active
- 2011-09-28 CN CN201110301310.3A patent/CN102559075B/zh active Active
- 2011-09-29 TW TW100135255A patent/TWI458795B/zh active
- 2011-10-11 JP JP2011224131A patent/JP6338810B2/ja active Active
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2013
- 2013-10-10 US US14/050,555 patent/US9384869B2/en active Active
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2016
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| TW200823274A (en) * | 2006-11-30 | 2008-06-01 | Feedpool Technology Co Ltd | Conductive adhesive composition and the packaging process used conductive adhesive |
| TW200932855A (en) * | 2007-08-08 | 2009-08-01 | Hitachi Chemical Co Ltd | Adhesive composition, film-like adhesive, and connection structure for circuit member |
Also Published As
| Publication number | Publication date |
|---|---|
| JP6338810B2 (ja) | 2018-06-06 |
| JP2012140589A (ja) | 2012-07-26 |
| KR20120076185A (ko) | 2012-07-09 |
| TW201226497A (en) | 2012-07-01 |
| US8608985B2 (en) | 2013-12-17 |
| KR101279980B1 (ko) | 2013-07-05 |
| JP6357501B2 (ja) | 2018-07-11 |
| JP2016189334A (ja) | 2016-11-04 |
| US20120168683A1 (en) | 2012-07-05 |
| US20140034882A1 (en) | 2014-02-06 |
| CN102559075B (zh) | 2014-09-10 |
| CN102559075A (zh) | 2012-07-11 |
| US9384869B2 (en) | 2016-07-05 |
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