TWI456342B - 防塵薄膜組件框架以及防塵薄膜組件 - Google Patents

防塵薄膜組件框架以及防塵薄膜組件 Download PDF

Info

Publication number
TWI456342B
TWI456342B TW100139146A TW100139146A TWI456342B TW I456342 B TWI456342 B TW I456342B TW 100139146 A TW100139146 A TW 100139146A TW 100139146 A TW100139146 A TW 100139146A TW I456342 B TWI456342 B TW I456342B
Authority
TW
Taiwan
Prior art keywords
pellicle
frame
resin
film
resin film
Prior art date
Application number
TW100139146A
Other languages
English (en)
Other versions
TW201224644A (en
Inventor
Kazutoshi Sekihara
Original Assignee
Shinetsu Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinetsu Chemical Co filed Critical Shinetsu Chemical Co
Publication of TW201224644A publication Critical patent/TW201224644A/zh
Application granted granted Critical
Publication of TWI456342B publication Critical patent/TWI456342B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/62—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof
    • G03F1/64—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof characterised by the frames, e.g. structure or material, including bonding means therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/62—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/04—Layered products comprising a layer of synthetic resin as impregnant, bonding, or embedding substance
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B1/00—Layered products having a non-planar shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/71—Resistive to light or to UV
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/14—Semiconductor wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
    • B32B2457/202—LCD, i.e. liquid crystal displays
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/23—Sheet including cover or casing
    • Y10T428/239—Complete cover or casing

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Packaging Frangible Articles (AREA)
  • Laminated Bodies (AREA)

Claims (3)

  1. 一種防塵薄膜組件框架，其係由構成自碳纖維片疊層體與浸滲於該碳纖維片疊層體之樹脂的複合材料、與施加於該複合材料之表面之樹脂膜構成，且藉由該樹脂膜使碳纖維不露出於表面，該樹脂膜的材質為氟樹脂。
  2. 如申請專利範圍第1項之防塵薄膜組件框架，其中該樹脂膜為黑色。
  3. 一種防塵薄膜組件，其特徵在於：使用如申請專利範圍第1或2項之防塵薄膜組件框架而構成。
TW100139146A 2010-10-28 2011-10-27 防塵薄膜組件框架以及防塵薄膜組件 TWI456342B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010241603A JP2012093595A (ja) 2010-10-28 2010-10-28 ペリクルフレームおよびペリクル

Publications (2)

Publication Number Publication Date
TW201224644A TW201224644A (en) 2012-06-16
TWI456342B true TWI456342B (zh) 2014-10-11

Family

ID=45997081

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100139146A TWI456342B (zh) 2010-10-28 2011-10-27 防塵薄膜組件框架以及防塵薄膜組件

Country Status (5)

Country Link
US (1) US8449966B2 (zh)
JP (1) JP2012093595A (zh)
KR (1) KR20120069521A (zh)
CN (1) CN102455589A (zh)
TW (1) TWI456342B (zh)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5940283B2 (ja) * 2011-11-04 2016-06-29 信越化学工業株式会社 ペリクル
JP5822401B2 (ja) * 2012-12-25 2015-11-24 信越化学工業株式会社 リソグラフィ用ペリクル
JP5950467B2 (ja) * 2013-09-24 2016-07-13 信越化学工業株式会社 ペリクル
JP6313161B2 (ja) * 2014-08-27 2018-04-18 信越化学工業株式会社 ペリクルフレーム及びペリクル
KR101915912B1 (ko) 2014-09-19 2018-11-06 미쯔이가가꾸가부시끼가이샤 펠리클, 그 제조 방법 및 노광 방법
CN106796391B (zh) 2014-09-19 2020-02-11 三井化学株式会社 防护膜组件、防护膜组件的制造方法及使用了防护膜组件的曝光方法
JP6304884B2 (ja) * 2014-09-22 2018-04-04 信越化学工業株式会社 ペリクルの貼り付け方法
US9395621B2 (en) * 2014-11-17 2016-07-19 Globalfoundries Singapore Pte. Ltd. Pellicles and devices comprising a photomask and the pellicle
JP6308676B2 (ja) * 2014-12-18 2018-04-11 信越化学工業株式会社 リソグラフィ用ペリクル容器。
CN104536524A (zh) * 2014-12-23 2015-04-22 重庆宝丽佰格电子科技有限公司 带有隐私保护功能的显示器防尘罩
CN104451538B (zh) * 2014-12-30 2017-06-06 合肥鑫晟光电科技有限公司 掩膜板及其制作方法
JP6564846B2 (ja) * 2015-02-19 2019-08-21 株式会社ブイ・テクノロジー ペリクルフレーム把持装置及びペリクルフレーム把持方法
JP6275067B2 (ja) * 2015-02-24 2018-02-07 信越化学工業株式会社 ペリクル収納容器
JP7082546B2 (ja) * 2018-08-01 2022-06-08 旭化成株式会社 ペリクル及びその製造方法
WO2020056080A1 (en) 2018-09-12 2020-03-19 Photronics, Inc. Pellicle for flat panel display photomask
JP7442291B2 (ja) * 2019-10-09 2024-03-04 信越化学工業株式会社 ペリクルとその専用ペリクルケースからなるアセンブリ

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001291757A (ja) * 2000-02-03 2001-10-19 Nippon Mitsubishi Oil Corp 加工面を被覆処理したｃｆｒｐ製搬送用部材およびその処理方法
WO2007061044A1 (ja) * 2005-11-25 2007-05-31 Hamamatsu Foundation For Science And Technology Promotion 超音波振動切削方法及びそれにより得られる繊維強化樹脂
TW200919081A (en) * 2007-07-06 2009-05-01 Asahi Kasei Emd Corp Large pellicle frame and a method for holding such a frame
JP2010134280A (ja) * 2008-12-05 2010-06-17 Shin Etsu Polymer Co Ltd ペリクル収納容器

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3050615B2 (ja) * 1991-02-07 2000-06-12 旭化成工業株式会社 液晶製造用マスクのための防塵体
JPH10207041A (ja) * 1997-01-24 1998-08-07 Mitsui Chem Inc ペリクル
JP2002161157A (ja) * 2000-11-27 2002-06-04 Toho Tenax Co Ltd 硬質被膜を有する炭素繊維強化樹脂複合材料製板材
JP4286194B2 (ja) 2004-08-18 2009-06-24 信越化学工業株式会社 ペリクルフレーム、および該フレームを用いたフォトリソグラフィー用ペリクル
JP4577069B2 (ja) 2005-03-31 2010-11-10 日本軽金属株式会社 ペリクル用支持枠、ペリクル用枠体およびペリクル用枠体の製造方法
JP2007082645A (ja) * 2005-09-21 2007-04-05 Asahi Glass Matex Co Ltd 洗浄用ブラシ
JP2007333910A (ja) * 2006-06-14 2007-12-27 Shin Etsu Chem Co Ltd ペリクル
JP2009139879A (ja) * 2007-12-11 2009-06-25 Toppan Printing Co Ltd ペリクル
JP5134418B2 (ja) * 2008-04-01 2013-01-30 信越化学工業株式会社 リソグラフィ用ペリクル
JP4605305B2 (ja) * 2010-02-19 2011-01-05 日本軽金属株式会社 ペリクル枠

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001291757A (ja) * 2000-02-03 2001-10-19 Nippon Mitsubishi Oil Corp 加工面を被覆処理したｃｆｒｐ製搬送用部材およびその処理方法
WO2007061044A1 (ja) * 2005-11-25 2007-05-31 Hamamatsu Foundation For Science And Technology Promotion 超音波振動切削方法及びそれにより得られる繊維強化樹脂
TW200919081A (en) * 2007-07-06 2009-05-01 Asahi Kasei Emd Corp Large pellicle frame and a method for holding such a frame
JP2010134280A (ja) * 2008-12-05 2010-06-17 Shin Etsu Polymer Co Ltd ペリクル収納容器

Also Published As

Publication number Publication date
US8449966B2 (en) 2013-05-28
CN102455589A (zh) 2012-05-16
US20120107548A1 (en) 2012-05-03
TW201224644A (en) 2012-06-16
JP2012093595A (ja) 2012-05-17
KR20120069521A (ko) 2012-06-28

Similar Documents

Publication Publication Date Title
TWI456342B (zh) 防塵薄膜組件框架以及防塵薄膜組件
MY163302A (en) Interlaminar toughening of thermoplastics
SG164316A1 (en) Battery and battery pack
JP2011518683A5 (zh)
JP2013515348A5 (zh)
JP2011516929A5 (zh)
JP2010537723A5 (zh)
WO2011159521A3 (en) Composite pressure vessels
JP2010104523A5 (zh)
JP2016514634A5 (zh)
WO2012075294A3 (en) Polymer nanocomposite precursors with carbon nanotubes and/or graphene and related thin films and patterning
EP3208079A3 (en) Improved composite materials
WO2010006252A3 (en) Laminate with natural fiber composite
EA201190241A1 (ru) Стеклянное изделие
MX339394B (es) Material compuesto de capas multiples, produccion y uso del mismo.
ES2586129T3 (es) Bisagra de material compuesto y proceso para su fabricación
RU2008106771A (ru) Композиционный теплоизоляционный материал
JP2012506328A5 (zh)
JP2012523912A5 (zh)
CL2012002707A1 (es) Un panel de fibras de densidad media comprende fibras de madera cuya mayor dimension es de 7 mm o menos, prensadas junto con un adhesivo, donde el panel tiene una proporcion de aspecto de por lo menos 100 y un area superficial de por lo menos 1 m2, donde las fibras de madera son de madera acetilada; uso de fibras de madera.
GB0619254D0 (en) Double skin tank lining with interstitial spacer
JP2015189082A5 (zh)
JP2015232392A5 (zh)
CN104139588B (zh) 离型膜
BRPI0906380A2 (pt) Material plano flexivel com diversas camadas