TWI456169B - 發光元件之檢查裝置及檢查方法 - Google Patents
發光元件之檢查裝置及檢查方法 Download PDFInfo
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- TWI456169B TWI456169B TW101124448A TW101124448A TWI456169B TW I456169 B TWI456169 B TW I456169B TW 101124448 A TW101124448 A TW 101124448A TW 101124448 A TW101124448 A TW 101124448A TW I456169 B TWI456169 B TW I456169B
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- light
- wafer
- emitting elements
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- 238000007689 inspection Methods 0.000 title claims 19
- 238000000034 method Methods 0.000 title claims 8
- 235000012431 wafers Nutrition 0.000 claims 41
- 239000000523 sample Substances 0.000 claims 19
- 238000004070 electrodeposition Methods 0.000 claims 12
- 230000003287 optical effect Effects 0.000 claims 8
- 238000005259 measurement Methods 0.000 claims 3
- 230000033001 locomotion Effects 0.000 claims 2
- 238000001514 detection method Methods 0.000 claims 1
- 230000026058 directional locomotion Effects 0.000 claims 1
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2601—Apparatus or methods therefor
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1347—Arrangement of liquid crystal layers or cells in which the final condition of one light beam is achieved by the addition of the effects of two or more layers or cells
- G02F1/13471—Arrangement of liquid crystal layers or cells in which the final condition of one light beam is achieved by the addition of the effects of two or more layers or cells in which all the liquid crystal cells or layers remain transparent, e.g. FLC, ECB, DAP, HAN, TN, STN, SBE-LC cells
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J1/00—Photometry, e.g. photographic exposure meter
- G01J1/42—Photometry, e.g. photographic exposure meter using electric radiation detectors
- G01J2001/4247—Photometry, e.g. photographic exposure meter using electric radiation detectors for testing lamps or other light sources
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2607—Circuits therefor
- G01R31/2632—Circuits therefor for testing diodes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Led Devices (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Testing Of Optical Devices Or Fibers (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Claims (7)
- 一種發光元件之檢查裝置,屬於擴片(expanded)晶圓上的發光元件之檢查裝置,其特徵為,具備:(1)位置測定部,其具備:晶圓夾片台,具有複數個晶圓夾頭;及位置測定裝置,測定載入至前述各晶圓夾頭之擴片晶圓上的發光元件之相對於基準位置的相對位置,並記憶成為發光元件位置資訊,且測定各發光元件中的電極之相對於基準位置的相對位置並記憶成為電極位置資訊,或是將另行提供之晶圓資訊中所包含之各發光元件的電極位置記憶成為電極位置參考資訊;(2)檢查部,其具備:光偵檢器及1或2個以上的探針,對應於載入至前述各晶圓夾頭之各個擴片晶圓而設置;及探針移動平台,使前述各個探針獨立地於XYZ軸方向移動;以及(3)控制裝置,其具備:依據前述發光元件位置資訊,令前述晶圓夾片台於XY軸方向移動,以使各擴片晶圓上的發光元件來到依序對應之1或2個以上的探針的下方之手段;及依據前述發光元件位置資訊與各發光元件之電極位置資訊或是依據前述發光元件位置資訊與各發光元件之電極位置參考資訊,令前述探針移動平台作動,使各探針於XY軸方向移動,以使各個前述探針來到位於下方之發光元件的電極位置之對應位置之手段;以及令前述探針相對於前述晶圓夾片台於Z軸方向移動,使前述探針與對應之各個發光元件的電極接觸之手段; 對於1台前述檢查部係具備2台以上之各自具備晶圓夾片台的前述位置測定部,前述檢查部與前述2台以上之位置測定部的各者彼此分別位於不同位置;前述控制裝置具備:令前述晶圓夾片台在前述檢查部與前述各位置測定部之間移動之手段;及其他的位置測定部的晶圓夾片台不存在於前述檢查部時,令已藉由前述位置測定裝置而記憶完成前述發光元件位置資訊與前述電極位置資訊,或已記憶完成前述發光元件位置資訊與前述電極位置參考資訊之晶圓夾片台,從其位置測定部移動至前述檢查部之手段;以及令在前述檢查部檢查完成之晶圓夾片台,從前述檢查部移動至原來的位置測定部之手段。
- 如申請專利範圍第1項之發光元件之檢查裝置,其中,前述檢查部具有:令各個前述光偵檢器獨立地於XYZ軸方向移動之光偵檢器移動平台,以及令各個前述光偵檢器與對應之1或2個以上的探針之任一者連動,而於XYZ軸方向移動之手段。
- 一種發光元件之檢查方法,屬於擴片晶圓上的發光元件之檢查方法,其特徵為,包含:(a)將擴片晶圓載入晶圓夾片台所具備之複數個晶圓夾頭的各個之工程;(b)測定載入至前述各晶圓夾頭之擴片晶圓上的發光元件之相對於基準位置的相對位置,並記憶成為發光元件位置資訊,且測定各發光元件中的電極之相對於基準位置的相對位置並記憶成為電極位置資訊,或是將另行提供 之晶圓資訊中所包含之各發光元件的電極位置記憶成為電極位置參考資訊之工程;(c)依據前述發光元件位置資訊,令前述晶圓夾片台於XY軸方向移動,以使各擴片晶圓上作為檢查對象之發光元件,來到與載入至前述晶圓夾頭上之各個擴片晶圓對應而設置之光偵檢器及1或2個以上的探針的下方之工程;(d)依據前述發光元件位置資訊與各發光元件之電極位置資訊或是依據前述發光元件位置資訊與電極位置參考資訊,使各探針於XY軸方向移動,以使前述探針來到位於下方之發光元件的電極位置之對應位置之工程;(e)令前述探針相對於前述晶圓夾片台於Z軸方向移動,使前述探針與對應之各個發光元件的電極接觸,以進行發光元件的檢查之工程;(f)改變各擴片晶圓上作為檢查對象之發光元件,針對各擴片晶圓上作為檢查對象之所有發光元件,反覆進行上述(c)(d)(e)工程之工程;令2台以上之前述晶圓夾片台,在各自的位置測定位置與該些2台以上之前述晶圓夾片台所共通的1個檢查位置之間移動,針對前述各晶圓夾片台,係進行(g)在各自之位置測定位置,進行前述(a)(b)工程之工程;(h)從前述位置測定位置移動至共通的檢查位置之工程; (i)在前述共通的檢查位置,進行前述(c)~(f)工程之工程;(j)從前述共通的檢查位置移動至前述位置測定位置之工程;及(k)在前述位置測定位置,從複數個晶圓夾頭的各個,將擴片晶圓卸載之工程;且,針對1個前述晶圓夾片台之前述(i)工程、與針對1個以上之另一前述晶圓夾片台之前述(g)工程,彼此至少部分並行而同時進行。
- 如申請專利範圍第3項之發光元件之檢查方法,其中,前述(d)工程係包含:令前述光偵檢器與相對應之任一個探針於XY軸方向之移動連動,而於XY軸方向移動之工程。
- 如申請專利範圍第3或4項之發光元件之檢查方法,其中,前述(e)工程係包含:令前述光偵檢器與相對應之任一個探針於Z軸方向之移動連動,而於Z軸方向移動之工程。
- 如申請專利範圍第3或4項之發光元件之檢查方法,其中,針對各擴片晶圓上作為檢查對象之所有發光元件所進行之前述(e)工程當中,至少最先進行之前述(e)工程係包含:令各個前述光偵檢器獨立於相對應之前述探針而於XY軸方向移動,將前述各光偵檢器定位至受檢測之光量成為最大之位置之工程。
- 如申請專利範圍第5項之發光元件之檢查方法,其 中,針對各擴片晶圓上作為檢查對象之所有發光元件所進行之前述(e)工程當中,至少最先進行之前述(e)工程係包含:令各個前述光偵檢器獨立於相對應之前述探針而於XY軸方向移動,將前述各光偵檢器定位至受檢測之光量成為最大之位置之工程。
Applications Claiming Priority (1)
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JP2011183622A JP5781864B2 (ja) | 2011-08-25 | 2011-08-25 | 発光素子の検査装置及び検査方法 |
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TW201315973A TW201315973A (zh) | 2013-04-16 |
TWI456169B true TWI456169B (zh) | 2014-10-11 |
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TW101124448A TWI456169B (zh) | 2011-08-25 | 2012-07-06 | 發光元件之檢查裝置及檢查方法 |
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US (1) | US8699035B2 (zh) |
JP (1) | JP5781864B2 (zh) |
KR (1) | KR101337200B1 (zh) |
CN (1) | CN102980742B (zh) |
DE (1) | DE102012016685B4 (zh) |
TW (1) | TWI456169B (zh) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
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CN103389156A (zh) * | 2012-05-08 | 2013-11-13 | 全亿大科技(佛山)有限公司 | 发光二极管检测量具 |
KR101541853B1 (ko) * | 2014-04-24 | 2015-08-13 | 주식회사 세미콘라이트 | 발광소자 검사장치 |
KR20170096258A (ko) * | 2016-02-15 | 2017-08-24 | 삼성전자주식회사 | 검사장치 |
TWI699639B (zh) * | 2016-10-13 | 2020-07-21 | 原相科技股份有限公司 | 充電系統以及充電方法 |
CN108010873B (zh) * | 2017-12-29 | 2024-04-19 | 无锡固电半导体股份有限公司 | 一种晶圆自动扩晶机 |
KR102038556B1 (ko) * | 2018-03-09 | 2019-10-31 | 주식회사 효광 | 마이크로 엘이디 검사장치 |
TWI687363B (zh) * | 2019-08-02 | 2020-03-11 | 鴻勁精密股份有限公司 | 電子元件作業設備 |
CN110581096B (zh) * | 2019-09-27 | 2023-09-05 | 江西兆驰半导体有限公司 | 一种led芯片光电性与外观一体化检测设备 |
CN110931382B (zh) * | 2019-12-11 | 2022-04-08 | 湘能华磊光电股份有限公司 | 一种led晶粒的光电性能检测方法 |
TWI741674B (zh) * | 2020-07-10 | 2021-10-01 | 鴻勁精密股份有限公司 | 電子元件作業裝置及其應用之作業設備 |
JP7492881B2 (ja) | 2020-08-03 | 2024-05-30 | 株式会社日本マイクロニクス | 測定システムおよび測定方法 |
KR20240021532A (ko) | 2022-08-10 | 2024-02-19 | 경상국립대학교산학협력단 | 라이다스캐너를 활용한 리모델링 건축물의 마감재료 수량 산출 및 가공정보 자동 추출 시스템 및 이를 이용한 리모델링 건축물의 마감재료 수량 산출 및 가공정보 자동 추출 방법 |
CN117524945B (zh) * | 2024-01-08 | 2024-04-19 | 矽电半导体设备(深圳)股份有限公司 | 一种扩膜后晶圆检查测试一体机及检查方法 |
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2011
- 2011-08-25 JP JP2011183622A patent/JP5781864B2/ja active Active
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2012
- 2012-07-06 TW TW101124448A patent/TWI456169B/zh active
- 2012-07-20 KR KR1020120079185A patent/KR101337200B1/ko active IP Right Grant
- 2012-08-24 CN CN201210306546.0A patent/CN102980742B/zh not_active Expired - Fee Related
- 2012-08-24 DE DE102012016685.0A patent/DE102012016685B4/de not_active Expired - Fee Related
- 2012-08-27 US US13/595,576 patent/US8699035B2/en active Active
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TW201024765A (en) * | 2008-12-23 | 2010-07-01 | Chroma Ate Inc | The inspection method for semiconductor chip prober, and the prober |
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Also Published As
Publication number | Publication date |
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DE102012016685B4 (de) | 2017-03-30 |
CN102980742B (zh) | 2015-06-03 |
KR101337200B1 (ko) | 2013-12-05 |
KR20130023065A (ko) | 2013-03-07 |
US20130050691A1 (en) | 2013-02-28 |
TW201315973A (zh) | 2013-04-16 |
US8699035B2 (en) | 2014-04-15 |
JP2013044665A (ja) | 2013-03-04 |
DE102012016685A1 (de) | 2013-02-28 |
CN102980742A (zh) | 2013-03-20 |
JP5781864B2 (ja) | 2015-09-24 |
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