KR101048818B1 - 카메라 비젼을 통한 오토 티칭 원점 측정 방법 - Google Patents
카메라 비젼을 통한 오토 티칭 원점 측정 방법 Download PDFInfo
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- KR101048818B1 KR101048818B1 KR1020080113730A KR20080113730A KR101048818B1 KR 101048818 B1 KR101048818 B1 KR 101048818B1 KR 1020080113730 A KR1020080113730 A KR 1020080113730A KR 20080113730 A KR20080113730 A KR 20080113730A KR 101048818 B1 KR101048818 B1 KR 101048818B1
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- 238000000034 method Methods 0.000 claims abstract description 21
- 238000000691 measurement method Methods 0.000 claims description 8
- 238000012545 processing Methods 0.000 claims description 2
- 238000012546 transfer Methods 0.000 claims description 2
- 235000012431 wafers Nutrition 0.000 description 23
- 238000004519 manufacturing process Methods 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 2
- 238000007792 addition Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form
- G05B19/402—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by control arrangements for positioning, e.g. centring a tool relative to a hole in the workpiece, additional detection means to correct position
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/37—Measurements
- G05B2219/37608—Center and diameter of hole, wafer, object
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Abstract
Description
Claims (5)
- 웨이퍼 처리장치에서 제조되는 웨이퍼의 정확한 위치의 검출, 정확한 이송 상태 또는 상기 웨이퍼를 검사하기 위해 카메라의 원점을 설정하기 위한 카메라 비젼을 통한 자동 티칭 원점 측정 방법에 있어서,하나의 원판형 지그를 회전 가능하게 고정시키고 상기 지그 주변에 카메라를 고정시켜 카메라 비젼을 이용하여 지그홀의 3개의 중심좌표를 구하는 단계;상기 카메라의 비젼을 통해 구해진 각각의 중심좌표를 연결하는 원의 원점좌표를 구하는 단계;상기 원점좌표와 일치하도록 카메라의 원점을 이동시키는 단계; 및상기 이동된 카메라의 원점과 상기 지그홀의 원점인 상기 원점좌표가 일치하는지를 최종 확인 한 후 카메라의 최종 위치를 설정하는 단계를 포함하는 카메라 비젼을 통한 자동 티칭 원점 측정 방법.
- 제1항에 있어서,상기 지그홀의 3개의 중심좌표를 구하는 단계는, 카메라를 지그의 지그홀에 일치시켜 상기 지그홀의 중심위치를 나타내는 제1중심좌표를 구하는 단계와, 상기 지그를 일 방향으로 120°회전시켜 정지시킨 상태에서 지그의 지그홀에 카메라를 일치시켜 중심위치를 나타내는 제2중심좌표를 구하는 단계와, 상기 지그를 동일 회 전방향으로 120° 더 회전시켜 정지시킨 상태에서 지그의 지그홀에 카메라를 일치시켜 중심위치를 나타내는 제3중심좌표를 구하는 단계를 포함하는 카메라 비젼을 통한 자동 티칭 원점 측정 방법.
- 제1항 또는 제2항에 있어서,상기 원점좌표를 구하는 단계는,상기 각각의 중심좌표를 직선으로 연결하는 단계와,상기 상호 연결된 각각의 중심좌표를 원으로 연결하는 단계와,상기 각각의 중심좌표를 연결하는 원을 이용하여 상기 원점좌표를 구하는 단계를 포함하는 카메라 비젼을 통한 자동 티칭 원점 측정 방법.
- 제3항에 있어서,상기 원점좌표를 구하는 단계는, 상기 각각의 중심좌표의 x축과 y축의 값이 각각 1(a,b), 2(c,d) 및 3(e,f)로 주어지는 경우, 식 (x-a)2 + (y-b)2 = (x-c)2 + (y-d)2 및 (x-e)2 + (y-f)2 = (x-c)2 + (y-d)2 좌표값을 대입하여 원점좌표의 x, y의 좌표값을 구하는 단계를 포함하는 카메라 비젼을 통한 자동 티칭 원점 측정 방법.
- 제1항에 있어서,상기 카메라의 원점 이동단계는 상기 원점좌표를 확인하는 단계와, 확인된 원점좌표로 카메라의 원점을 이동시킨 후 각각의 중심좌표를 소거시키는 단계를 포 함하는 카메라 비젼을 통한 자동 티칭 원점 측정 방법.
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KR1020080113730A KR101048818B1 (ko) | 2008-11-16 | 2008-11-16 | 카메라 비젼을 통한 오토 티칭 원점 측정 방법 |
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KR1020080113730A KR101048818B1 (ko) | 2008-11-16 | 2008-11-16 | 카메라 비젼을 통한 오토 티칭 원점 측정 방법 |
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KR20100054908A KR20100054908A (ko) | 2010-05-26 |
KR101048818B1 true KR101048818B1 (ko) | 2011-07-12 |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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US9966285B2 (en) | 2015-05-29 | 2018-05-08 | Semes Co. Ltd. | Teaching method and substrate treating apparatus using the same |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
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KR101817209B1 (ko) | 2016-06-24 | 2018-02-22 | 세메스 주식회사 | 기판 처리 장치 및 방법 |
KR101987895B1 (ko) | 2017-02-02 | 2019-06-12 | 주식회사 투윈테크 | 반도체 또는 디스플레이 시스템 분야에서 사용되는 이송 위치 측정용 테스트 더미 및 상기 이송 위치 측정용 테스트 더미를 이용한 정밀 이송 측정 방법 |
KR102292337B1 (ko) * | 2020-02-18 | 2021-08-24 | 무진전자 주식회사 | 기판이송로봇 자동 티칭 장치 |
KR102682279B1 (ko) | 2022-04-27 | 2024-07-05 | 주식회사 투윈테크 | 반도체 및 디스플레이 제조 설비에 적용되는 웨이퍼 이동 위치 조정 지그 |
Citations (3)
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JP2008078210A (ja) * | 2006-09-19 | 2008-04-03 | Tokyo Electron Ltd | ウエハの中心検出方法及びその方法を記録した記録媒体 |
JP2008198797A (ja) * | 2007-02-13 | 2008-08-28 | Tokyo Electron Ltd | 基板位置検出装置及びその撮像手段位置調整方法 |
JP2008216249A (ja) * | 2007-02-28 | 2008-09-18 | Vistec Semiconductor Systems Gmbh | ウエハの幾何学的変数の測定方法 |
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Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2008078210A (ja) * | 2006-09-19 | 2008-04-03 | Tokyo Electron Ltd | ウエハの中心検出方法及びその方法を記録した記録媒体 |
JP2008198797A (ja) * | 2007-02-13 | 2008-08-28 | Tokyo Electron Ltd | 基板位置検出装置及びその撮像手段位置調整方法 |
JP2008216249A (ja) * | 2007-02-28 | 2008-09-18 | Vistec Semiconductor Systems Gmbh | ウエハの幾何学的変数の測定方法 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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US9966285B2 (en) | 2015-05-29 | 2018-05-08 | Semes Co. Ltd. | Teaching method and substrate treating apparatus using the same |
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