TWI452251B - Heat treatment device - Google Patents

Heat treatment device Download PDF

Info

Publication number
TWI452251B
TWI452251B TW098109525A TW98109525A TWI452251B TW I452251 B TWI452251 B TW I452251B TW 098109525 A TW098109525 A TW 098109525A TW 98109525 A TW98109525 A TW 98109525A TW I452251 B TWI452251 B TW I452251B
Authority
TW
Taiwan
Prior art keywords
processing chamber
substrate
heat treatment
heating means
processing
Prior art date
Application number
TW098109525A
Other languages
English (en)
Chinese (zh)
Other versions
TW201028629A (en
Inventor
池田均
岡山智彥
松本浩一
森岡和
目崎芳則
Original Assignee
愛發科股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 愛發科股份有限公司 filed Critical 愛發科股份有限公司
Publication of TW201028629A publication Critical patent/TW201028629A/zh
Application granted granted Critical
Publication of TWI452251B publication Critical patent/TWI452251B/zh

Links

Classifications

    • H10P72/0431—
    • H10P72/0441—
    • H10P72/76—

Landscapes

  • Muffle Furnaces And Rotary Kilns (AREA)
  • Furnace Details (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
TW098109525A 2009-01-22 2009-03-24 Heat treatment device TWI452251B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009012401A JP5274275B2 (ja) 2009-01-22 2009-01-22 加熱処理装置

Publications (2)

Publication Number Publication Date
TW201028629A TW201028629A (en) 2010-08-01
TWI452251B true TWI452251B (zh) 2014-09-11

Family

ID=42532520

Family Applications (1)

Application Number Title Priority Date Filing Date
TW098109525A TWI452251B (zh) 2009-01-22 2009-03-24 Heat treatment device

Country Status (4)

Country Link
JP (1) JP5274275B2 (enExample)
KR (1) KR101591088B1 (enExample)
CN (1) CN101789358B (enExample)
TW (1) TWI452251B (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7272639B1 (en) 1995-06-07 2007-09-18 Soverain Software Llc Internet server access control and monitoring systems
US9900305B2 (en) 1998-01-12 2018-02-20 Soverain Ip, Llc Internet server access control and monitoring systems
US7257132B1 (en) 1998-02-26 2007-08-14 Hitachi, Ltd. Receiver set, information apparatus and receiving system
CN104197668B (zh) * 2014-09-24 2016-03-02 南京耀天干燥设备有限公司 一种改进的低温真空干燥箱
JP7406749B2 (ja) * 2019-06-28 2023-12-28 日新イオン機器株式会社 加熱装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000114151A (ja) * 1998-10-08 2000-04-21 Hitachi Ltd 基板加熱装置
JP2008197374A (ja) * 2007-02-13 2008-08-28 Ulvac Japan Ltd 真空チャンバ、ロードロックチャンバ、及び処理装置
JP2008311250A (ja) * 2007-06-12 2008-12-25 Tokyo Electron Ltd リフローシステムおよびリフロー方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0769391A (ja) * 1993-01-19 1995-03-14 Gold Kogyo Kk 精密部品搬送用トレー
KR100837599B1 (ko) * 2007-03-27 2008-06-13 주식회사 에스에프에이 기판 지지용 스테이지
JP4312787B2 (ja) * 2006-11-15 2009-08-12 東京エレクトロン株式会社 減圧乾燥装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000114151A (ja) * 1998-10-08 2000-04-21 Hitachi Ltd 基板加熱装置
JP2008197374A (ja) * 2007-02-13 2008-08-28 Ulvac Japan Ltd 真空チャンバ、ロードロックチャンバ、及び処理装置
JP2008311250A (ja) * 2007-06-12 2008-12-25 Tokyo Electron Ltd リフローシステムおよびリフロー方法

Also Published As

Publication number Publication date
TW201028629A (en) 2010-08-01
CN101789358A (zh) 2010-07-28
KR20100086399A (ko) 2010-07-30
JP5274275B2 (ja) 2013-08-28
KR101591088B1 (ko) 2016-02-02
JP2010171206A (ja) 2010-08-05
CN101789358B (zh) 2014-02-19

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