KR101591088B1 - 가열 처리 장치 - Google Patents

가열 처리 장치 Download PDF

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Publication number
KR101591088B1
KR101591088B1 KR1020090026382A KR20090026382A KR101591088B1 KR 101591088 B1 KR101591088 B1 KR 101591088B1 KR 1020090026382 A KR1020090026382 A KR 1020090026382A KR 20090026382 A KR20090026382 A KR 20090026382A KR 101591088 B1 KR101591088 B1 KR 101591088B1
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KR
South Korea
Prior art keywords
substrate
chamber
heating means
processing space
members
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Active
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KR1020090026382A
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English (en)
Korean (ko)
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KR20100086399A (ko
Inventor
히토시 이케다
사토히로 오카야마
고이치 마츠모토
야와라 모리오카
요시노리 메자키
Original Assignee
가부시키가이샤 알박
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Application filed by 가부시키가이샤 알박 filed Critical 가부시키가이샤 알박
Publication of KR20100086399A publication Critical patent/KR20100086399A/ko
Application granted granted Critical
Publication of KR101591088B1 publication Critical patent/KR101591088B1/ko
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Muffle Furnaces And Rotary Kilns (AREA)
  • Furnace Details (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
KR1020090026382A 2009-01-22 2009-03-27 가열 처리 장치 Active KR101591088B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009012401A JP5274275B2 (ja) 2009-01-22 2009-01-22 加熱処理装置
JPJP-P-2009-012401 2009-01-22

Publications (2)

Publication Number Publication Date
KR20100086399A KR20100086399A (ko) 2010-07-30
KR101591088B1 true KR101591088B1 (ko) 2016-02-02

Family

ID=42532520

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020090026382A Active KR101591088B1 (ko) 2009-01-22 2009-03-27 가열 처리 장치

Country Status (4)

Country Link
JP (1) JP5274275B2 (enExample)
KR (1) KR101591088B1 (enExample)
CN (1) CN101789358B (enExample)
TW (1) TWI452251B (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7272639B1 (en) 1995-06-07 2007-09-18 Soverain Software Llc Internet server access control and monitoring systems
US9900305B2 (en) 1998-01-12 2018-02-20 Soverain Ip, Llc Internet server access control and monitoring systems
US7257132B1 (en) 1998-02-26 2007-08-14 Hitachi, Ltd. Receiver set, information apparatus and receiving system
CN104197668B (zh) * 2014-09-24 2016-03-02 南京耀天干燥设备有限公司 一种改进的低温真空干燥箱
JP7406749B2 (ja) * 2019-06-28 2023-12-28 日新イオン機器株式会社 加熱装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000114151A (ja) * 1998-10-08 2000-04-21 Hitachi Ltd 基板加熱装置
JP2008124366A (ja) * 2006-11-15 2008-05-29 Tokyo Electron Ltd 減圧乾燥装置
KR100837599B1 (ko) * 2007-03-27 2008-06-13 주식회사 에스에프에이 기판 지지용 스테이지
JP2008197374A (ja) * 2007-02-13 2008-08-28 Ulvac Japan Ltd 真空チャンバ、ロードロックチャンバ、及び処理装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0769391A (ja) * 1993-01-19 1995-03-14 Gold Kogyo Kk 精密部品搬送用トレー
JP2008311250A (ja) * 2007-06-12 2008-12-25 Tokyo Electron Ltd リフローシステムおよびリフロー方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000114151A (ja) * 1998-10-08 2000-04-21 Hitachi Ltd 基板加熱装置
JP2008124366A (ja) * 2006-11-15 2008-05-29 Tokyo Electron Ltd 減圧乾燥装置
JP2008197374A (ja) * 2007-02-13 2008-08-28 Ulvac Japan Ltd 真空チャンバ、ロードロックチャンバ、及び処理装置
KR100837599B1 (ko) * 2007-03-27 2008-06-13 주식회사 에스에프에이 기판 지지용 스테이지

Also Published As

Publication number Publication date
CN101789358A (zh) 2010-07-28
CN101789358B (zh) 2014-02-19
JP2010171206A (ja) 2010-08-05
TW201028629A (en) 2010-08-01
KR20100086399A (ko) 2010-07-30
JP5274275B2 (ja) 2013-08-28
TWI452251B (zh) 2014-09-11

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