TWI440647B - 改質樹脂組成物、其製造方法及含該組成物之硬化性樹脂組成物 - Google Patents

改質樹脂組成物、其製造方法及含該組成物之硬化性樹脂組成物 Download PDF

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Publication number
TWI440647B
TWI440647B TW098122385A TW98122385A TWI440647B TW I440647 B TWI440647 B TW I440647B TW 098122385 A TW098122385 A TW 098122385A TW 98122385 A TW98122385 A TW 98122385A TW I440647 B TWI440647 B TW I440647B
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TW
Taiwan
Prior art keywords
resin composition
group
less
alkoxydecane compound
general formula
Prior art date
Application number
TW098122385A
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English (en)
Chinese (zh)
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TW201004993A (en
Inventor
Mitsuyo Akimoto
Akitake Nakamura
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Asahi Kasei Chemicals Corp
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Publication of TW201004993A publication Critical patent/TW201004993A/zh
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Publication of TWI440647B publication Critical patent/TWI440647B/zh

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/14—Polycondensates modified by chemical after-treatment
    • C08G59/1433—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
    • C08G59/306—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen containing silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45147—Copper (Cu) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/49105—Connecting at different heights
    • H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Epoxy Resins (AREA)
TW098122385A 2008-07-03 2009-07-02 改質樹脂組成物、其製造方法及含該組成物之硬化性樹脂組成物 TWI440647B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2008175096 2008-07-03
JP2008314273 2008-12-10

Publications (2)

Publication Number Publication Date
TW201004993A TW201004993A (en) 2010-02-01
TWI440647B true TWI440647B (zh) 2014-06-11

Family

ID=41466082

Family Applications (1)

Application Number Title Priority Date Filing Date
TW098122385A TWI440647B (zh) 2008-07-03 2009-07-02 改質樹脂組成物、其製造方法及含該組成物之硬化性樹脂組成物

Country Status (3)

Country Link
CN (1) CN102076734B (fr)
TW (1) TWI440647B (fr)
WO (1) WO2010001992A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI752996B (zh) * 2016-09-05 2022-01-21 日商住友電木股份有限公司 環氧樹脂組成物及半導體裝置

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JP5253260B2 (ja) * 2009-03-26 2013-07-31 旭化成ケミカルズ株式会社 Ｌｅｄ用蛍光樹脂組成物、それを用いた封止材及び蓄光材料
CN102194970B (zh) * 2010-03-12 2014-06-25 四川新力光源股份有限公司 脉冲电流驱动的白光led照明装置
CN102192422B (zh) * 2010-03-12 2014-06-25 四川新力光源股份有限公司 白光led照明装置
JP2011208094A (ja) * 2010-03-30 2011-10-20 Asahi Kasei Chemicals Corp ポリオルガノシロキサン及びその製造方法、並びに、それを含む硬化性樹脂組成物とその用途
CN102751420A (zh) * 2011-04-19 2012-10-24 菱生精密工业股份有限公司 发光二极管封装结构
KR101332507B1 (ko) * 2011-12-28 2013-11-26 주식회사 포스코 Ｍｃｃｌ용 절연 접착제 조성물, 이를 이용한 도장 금속판 및 그 제조방법
CN103450797A (zh) * 2012-06-05 2013-12-18 武汉赫斯特涂层材料股份有限公司 一种可常温固化的环氧聚硅氧烷树脂
US20140057115A1 (en) * 2012-08-22 2014-02-27 The Walman Optical Company Coating composition and method
JP2014102348A (ja) * 2012-11-19 2014-06-05 Nitto Denko Corp 光導波路形成用樹脂組成物およびそれを用いた光導波路ならびに光伝送用フレキシブルプリント基板、およびその光導波路の製法
CN102911584B (zh) * 2012-11-21 2015-10-21 戚城 一种防涂鸦抗粘贴纳米涂料及其制备方法
CN103926349B (zh) * 2014-04-24 2015-06-10 金坛市产品质量监督检验所 一种乙基三苯基溴化膦中溴乙烷的测定方法
KR101630769B1 (ko) * 2014-06-24 2016-06-16 매그나칩 반도체 유한회사 방열 반도체 칩 패키지 및 그 제조 방법
US11198795B2 (en) 2015-02-17 2021-12-14 The Walman Optical Company Glycidyl ether based optical coating compositions
CN107828057B (zh) * 2017-11-13 2021-01-29 唐山三友硅业有限责任公司 Led封装用硅氧烷改性环氧树脂制备方法及其应用
CN109021675B (zh) * 2018-08-17 2021-06-15 广州市红太电子科技有限公司 一种pcb油墨
CN109874702B (zh) * 2019-04-12 2021-09-10 云南农业大学 一种利用温度脱模的环氧树脂巢房模型制作方法
CN112552781A (zh) * 2020-11-26 2021-03-26 戚城 一种环保型防涂鸦纳米涂料及其制备方法

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JPS54129096A (en) * 1978-03-30 1979-10-06 Japan Atom Energy Res Inst Thermosetting resin composition
JPS59174658A (ja) * 1983-03-23 1984-10-03 Toray Silicone Co Ltd プライマ−組成物
JP3077695B1 (ja) * 1999-06-17 2000-08-14 荒川化学工業株式会社 アルコキシ基含有シラン変性エポキシ樹脂の製造方法
JP4723272B2 (ja) * 2004-04-02 2011-07-13 大阪瓦斯株式会社 光重合性樹脂組成物およびその硬化物
JP4639054B2 (ja) * 2004-04-02 2011-02-23 旭化成株式会社 透明ハイブリッドシート
JP4979963B2 (ja) * 2006-03-10 2012-07-18 株式会社Ａｄｅｋａ 光学材料用硬化性組成物及び光導波路

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI752996B (zh) * 2016-09-05 2022-01-21 日商住友電木股份有限公司 環氧樹脂組成物及半導體裝置

Also Published As

Publication number Publication date
WO2010001992A1 (fr) 2010-01-07
CN102076734A (zh) 2011-05-25
CN102076734B (zh) 2013-02-27
TW201004993A (en) 2010-02-01

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