TWI439557B - 電漿反應器系統之工件旋轉設備 - Google Patents

電漿反應器系統之工件旋轉設備 Download PDF

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Publication number
TWI439557B
TWI439557B TW096126716A TW96126716A TWI439557B TW I439557 B TWI439557 B TW I439557B TW 096126716 A TW096126716 A TW 096126716A TW 96126716 A TW96126716 A TW 96126716A TW I439557 B TWI439557 B TW I439557B
Authority
TW
Taiwan
Prior art keywords
workpiece
bracket
mask
arm
support plane
Prior art date
Application number
TW096126716A
Other languages
English (en)
Chinese (zh)
Other versions
TW200821397A (en
Inventor
禮文頓理查
古延基姆
庫默亞傑
伊波拉罕伊波拉罕Ｍ
仙卓須德麥哈維
安德森史考特艾倫
Original Assignee
應用材料股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 應用材料股份有限公司 filed Critical 應用材料股份有限公司
Publication of TW200821397A publication Critical patent/TW200821397A/zh
Application granted granted Critical
Publication of TWI439557B publication Critical patent/TWI439557B/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/20—Dry etching; Plasma etching; Reactive-ion etching
    • H10P50/24—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials
    • H10P50/242—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials of Group IV materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3402—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0418—Apparatus for fluid treatment for etching
    • H10P72/0421—Apparatus for fluid treatment for etching for drying etching

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Drying Of Semiconductors (AREA)
TW096126716A 2006-10-30 2007-07-20 電漿反應器系統之工件旋轉設備 TWI439557B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/589,498 US20080099451A1 (en) 2006-10-30 2006-10-30 Workpiece rotation apparatus for a plasma reactor system

Publications (2)

Publication Number Publication Date
TW200821397A TW200821397A (en) 2008-05-16
TWI439557B true TWI439557B (zh) 2014-06-01

Family

ID=38481584

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096126716A TWI439557B (zh) 2006-10-30 2007-07-20 電漿反應器系統之工件旋轉設備

Country Status (6)

Country Link
US (1) US20080099451A1 (cg-RX-API-DMAC7.html)
EP (1) EP1918977A3 (cg-RX-API-DMAC7.html)
JP (1) JP5392941B2 (cg-RX-API-DMAC7.html)
KR (1) KR101457342B1 (cg-RX-API-DMAC7.html)
CN (1) CN101174098A (cg-RX-API-DMAC7.html)
TW (1) TWI439557B (cg-RX-API-DMAC7.html)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI639885B (zh) * 2017-12-11 2018-11-01 旺宏電子股份有限公司 形成對準罩幕的方法、半導體裝置以及形成一組對準罩幕的方法
US10474027B2 (en) 2017-11-13 2019-11-12 Macronix International Co., Ltd. Method for forming an aligned mask

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101748386B (zh) * 2008-12-18 2013-06-05 北京北方微电子基地设备工艺研究中心有限责任公司 一种等离子体加工设备
CN102486988A (zh) * 2010-12-03 2012-06-06 上海凯世通半导体有限公司 真空传输制程设备
JP6256909B2 (ja) * 2013-10-21 2018-01-10 株式会社アルバック 基板搬送装置および基板処理装置
CN104752275B (zh) * 2013-12-29 2018-01-09 北京北方华创微电子装备有限公司 工艺腔室以及半导体加工设备
CN105047512B (zh) * 2015-05-29 2017-03-15 光驰科技(上海)有限公司 具备多层载物能力的离子束刻蚀系统及其刻蚀方法
US20170352562A1 (en) * 2016-06-02 2017-12-07 Applied Materials, Inc. Dodecadon transfer chamber and processing system having the same
US9966292B2 (en) * 2016-07-12 2018-05-08 Globalfoundries Inc. Centering fixture for electrostatic chuck system
CN111211082B (zh) * 2018-11-22 2022-10-25 拓荆科技股份有限公司 晶圆传输装置

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08213444A (ja) * 1995-02-02 1996-08-20 Kokusai Electric Co Ltd 基板搬送装置
JPH106166A (ja) * 1996-06-19 1998-01-13 Metsukusu:Kk 方向性を有するワークの搬送装置
JP3445918B2 (ja) * 1997-04-24 2003-09-16 株式会社三協精機製作所 多関節ロボット
US6216873B1 (en) * 1999-03-19 2001-04-17 Asyst Technologies, Inc. SMIF container including a reticle support structure
JP3927758B2 (ja) * 1999-06-03 2007-06-13 東京エレクトロン株式会社 基板搬送装置及び処理装置
US6537011B1 (en) * 2000-03-10 2003-03-25 Applied Materials, Inc. Method and apparatus for transferring and supporting a substrate
US20030000645A1 (en) * 2001-06-27 2003-01-02 Dornfest Charles N. Apparatus and method for reducing leakage in a capacitor stack
US6841006B2 (en) * 2001-08-23 2005-01-11 Applied Materials, Inc. Atmospheric substrate processing apparatus for depositing multiple layers on a substrate
JP2003068620A (ja) * 2001-08-28 2003-03-07 Sendai Nikon:Kk 露光装置
JP4821074B2 (ja) * 2001-08-31 2011-11-24 東京エレクトロン株式会社 処理システム
WO2005036617A1 (ja) * 2003-10-14 2005-04-21 Fuji Research Institute Corporation ワーク枚葉処理システム
JP4665468B2 (ja) * 2004-09-15 2011-04-06 凸版印刷株式会社 フォトマスク及びフォトマスクブランクスの載置方向変更装置
JP2007158011A (ja) * 2005-12-05 2007-06-21 Sharp Corp 基板搬送装置、及び基板搬送システム

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10474027B2 (en) 2017-11-13 2019-11-12 Macronix International Co., Ltd. Method for forming an aligned mask
TWI639885B (zh) * 2017-12-11 2018-11-01 旺宏電子股份有限公司 形成對準罩幕的方法、半導體裝置以及形成一組對準罩幕的方法

Also Published As

Publication number Publication date
JP2008112963A (ja) 2008-05-15
US20080099451A1 (en) 2008-05-01
CN101174098A (zh) 2008-05-07
EP1918977A2 (en) 2008-05-07
KR101457342B1 (ko) 2014-11-03
KR20080039195A (ko) 2008-05-07
EP1918977A3 (en) 2009-12-02
TW200821397A (en) 2008-05-16
JP5392941B2 (ja) 2014-01-22

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