CN101174098A - 用于等离子体反应器系统的工件旋转装置 - Google Patents

用于等离子体反应器系统的工件旋转装置 Download PDF

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Publication number
CN101174098A
CN101174098A CNA2007101299773A CN200710129977A CN101174098A CN 101174098 A CN101174098 A CN 101174098A CN A2007101299773 A CNA2007101299773 A CN A2007101299773A CN 200710129977 A CN200710129977 A CN 200710129977A CN 101174098 A CN101174098 A CN 101174098A
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CN
China
Prior art keywords
workpiece
carriage
mask
arm
support plane
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA2007101299773A
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English (en)
Chinese (zh)
Inventor
理查德·莱温顿
吉姆·K·尼古恩
阿杰伊·库玛
伊伯拉希姆·M·伊伯拉希姆
马德哈唯·R·钱德拉乔德
斯科特·艾伦·安德森
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of CN101174098A publication Critical patent/CN101174098A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/20—Dry etching; Plasma etching; Reactive-ion etching
    • H10P50/24—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials
    • H10P50/242—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials of Group IV materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3402—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0418—Apparatus for fluid treatment for etching
    • H10P72/0421—Apparatus for fluid treatment for etching for drying etching

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Drying Of Semiconductors (AREA)
CNA2007101299773A 2006-10-30 2007-07-20 用于等离子体反应器系统的工件旋转装置 Pending CN101174098A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/589,498 2006-10-30
US11/589,498 US20080099451A1 (en) 2006-10-30 2006-10-30 Workpiece rotation apparatus for a plasma reactor system

Publications (1)

Publication Number Publication Date
CN101174098A true CN101174098A (zh) 2008-05-07

Family

ID=38481584

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA2007101299773A Pending CN101174098A (zh) 2006-10-30 2007-07-20 用于等离子体反应器系统的工件旋转装置

Country Status (6)

Country Link
US (1) US20080099451A1 (cg-RX-API-DMAC7.html)
EP (1) EP1918977A3 (cg-RX-API-DMAC7.html)
JP (1) JP5392941B2 (cg-RX-API-DMAC7.html)
KR (1) KR101457342B1 (cg-RX-API-DMAC7.html)
CN (1) CN101174098A (cg-RX-API-DMAC7.html)
TW (1) TWI439557B (cg-RX-API-DMAC7.html)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102486988A (zh) * 2010-12-03 2012-06-06 上海凯世通半导体有限公司 真空传输制程设备
CN101748386B (zh) * 2008-12-18 2013-06-05 北京北方微电子基地设备工艺研究中心有限责任公司 一种等离子体加工设备
CN105047512A (zh) * 2015-05-29 2015-11-11 光驰科技(上海)有限公司 具备多层载物能力的离子束刻蚀系统及其刻蚀方法
CN109314071A (zh) * 2016-06-02 2019-02-05 应用材料公司 十二边形传送腔室和具有十二边形传送腔室的处理系统

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6256909B2 (ja) * 2013-10-21 2018-01-10 株式会社アルバック 基板搬送装置および基板処理装置
CN104752275B (zh) * 2013-12-29 2018-01-09 北京北方华创微电子装备有限公司 工艺腔室以及半导体加工设备
US9966292B2 (en) * 2016-07-12 2018-05-08 Globalfoundries Inc. Centering fixture for electrostatic chuck system
US10474027B2 (en) 2017-11-13 2019-11-12 Macronix International Co., Ltd. Method for forming an aligned mask
TWI639885B (zh) * 2017-12-11 2018-11-01 旺宏電子股份有限公司 形成對準罩幕的方法、半導體裝置以及形成一組對準罩幕的方法
CN111211082B (zh) * 2018-11-22 2022-10-25 拓荆科技股份有限公司 晶圆传输装置

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08213444A (ja) * 1995-02-02 1996-08-20 Kokusai Electric Co Ltd 基板搬送装置
JPH106166A (ja) * 1996-06-19 1998-01-13 Metsukusu:Kk 方向性を有するワークの搬送装置
JP3445918B2 (ja) * 1997-04-24 2003-09-16 株式会社三協精機製作所 多関節ロボット
US6216873B1 (en) * 1999-03-19 2001-04-17 Asyst Technologies, Inc. SMIF container including a reticle support structure
JP3927758B2 (ja) * 1999-06-03 2007-06-13 東京エレクトロン株式会社 基板搬送装置及び処理装置
US6537011B1 (en) * 2000-03-10 2003-03-25 Applied Materials, Inc. Method and apparatus for transferring and supporting a substrate
US20030000645A1 (en) * 2001-06-27 2003-01-02 Dornfest Charles N. Apparatus and method for reducing leakage in a capacitor stack
US6841006B2 (en) * 2001-08-23 2005-01-11 Applied Materials, Inc. Atmospheric substrate processing apparatus for depositing multiple layers on a substrate
JP2003068620A (ja) * 2001-08-28 2003-03-07 Sendai Nikon:Kk 露光装置
JP4821074B2 (ja) * 2001-08-31 2011-11-24 東京エレクトロン株式会社 処理システム
WO2005036617A1 (ja) * 2003-10-14 2005-04-21 Fuji Research Institute Corporation ワーク枚葉処理システム
JP4665468B2 (ja) * 2004-09-15 2011-04-06 凸版印刷株式会社 フォトマスク及びフォトマスクブランクスの載置方向変更装置
JP2007158011A (ja) * 2005-12-05 2007-06-21 Sharp Corp 基板搬送装置、及び基板搬送システム

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101748386B (zh) * 2008-12-18 2013-06-05 北京北方微电子基地设备工艺研究中心有限责任公司 一种等离子体加工设备
CN102486988A (zh) * 2010-12-03 2012-06-06 上海凯世通半导体有限公司 真空传输制程设备
CN105047512A (zh) * 2015-05-29 2015-11-11 光驰科技(上海)有限公司 具备多层载物能力的离子束刻蚀系统及其刻蚀方法
CN109314071A (zh) * 2016-06-02 2019-02-05 应用材料公司 十二边形传送腔室和具有十二边形传送腔室的处理系统

Also Published As

Publication number Publication date
JP2008112963A (ja) 2008-05-15
US20080099451A1 (en) 2008-05-01
EP1918977A2 (en) 2008-05-07
KR101457342B1 (ko) 2014-11-03
KR20080039195A (ko) 2008-05-07
EP1918977A3 (en) 2009-12-02
TW200821397A (en) 2008-05-16
JP5392941B2 (ja) 2014-01-22
TWI439557B (zh) 2014-06-01

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C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C53 Correction of patent of invention or patent application
CB02 Change of applicant information

Address after: American California

Applicant after: Applied Materials Inc.

Address before: American California

Applicant before: Applied Materials Inc.

C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20080507