JP5392941B2 - プラズマリアクタシステム用のワークピース回転装置 - Google Patents

プラズマリアクタシステム用のワークピース回転装置 Download PDF

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Publication number
JP5392941B2
JP5392941B2 JP2007185461A JP2007185461A JP5392941B2 JP 5392941 B2 JP5392941 B2 JP 5392941B2 JP 2007185461 A JP2007185461 A JP 2007185461A JP 2007185461 A JP2007185461 A JP 2007185461A JP 5392941 B2 JP5392941 B2 JP 5392941B2
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Japan
Prior art keywords
workpiece
mask
frame
bracket
stationary
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2007185461A
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English (en)
Japanese (ja)
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JP2008112963A (ja
JP2008112963A5 (cg-RX-API-DMAC7.html
Inventor
レウイントン リチャード
ケイ ヌグエン キヒエム
クマー アジャイ
エム イブラヒム イブラヒム
アール チャンドラチュッド マドハビ
アラン アンダーソン スコット
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Applied Materials Inc
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Applied Materials Inc
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Publication of JP2008112963A publication Critical patent/JP2008112963A/ja
Publication of JP2008112963A5 publication Critical patent/JP2008112963A5/ja
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Publication of JP5392941B2 publication Critical patent/JP5392941B2/ja
Expired - Fee Related legal-status Critical Current
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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/20—Dry etching; Plasma etching; Reactive-ion etching
    • H10P50/24—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials
    • H10P50/242—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials of Group IV materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3402—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0418—Apparatus for fluid treatment for etching
    • H10P72/0421—Apparatus for fluid treatment for etching for drying etching

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Drying Of Semiconductors (AREA)
JP2007185461A 2006-10-30 2007-07-17 プラズマリアクタシステム用のワークピース回転装置 Expired - Fee Related JP5392941B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/589498 2006-10-30
US11/589,498 US20080099451A1 (en) 2006-10-30 2006-10-30 Workpiece rotation apparatus for a plasma reactor system

Publications (3)

Publication Number Publication Date
JP2008112963A JP2008112963A (ja) 2008-05-15
JP2008112963A5 JP2008112963A5 (cg-RX-API-DMAC7.html) 2010-09-02
JP5392941B2 true JP5392941B2 (ja) 2014-01-22

Family

ID=38481584

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007185461A Expired - Fee Related JP5392941B2 (ja) 2006-10-30 2007-07-17 プラズマリアクタシステム用のワークピース回転装置

Country Status (6)

Country Link
US (1) US20080099451A1 (cg-RX-API-DMAC7.html)
EP (1) EP1918977A3 (cg-RX-API-DMAC7.html)
JP (1) JP5392941B2 (cg-RX-API-DMAC7.html)
KR (1) KR101457342B1 (cg-RX-API-DMAC7.html)
CN (1) CN101174098A (cg-RX-API-DMAC7.html)
TW (1) TWI439557B (cg-RX-API-DMAC7.html)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101748386B (zh) * 2008-12-18 2013-06-05 北京北方微电子基地设备工艺研究中心有限责任公司 一种等离子体加工设备
CN102486988A (zh) * 2010-12-03 2012-06-06 上海凯世通半导体有限公司 真空传输制程设备
JP6256909B2 (ja) * 2013-10-21 2018-01-10 株式会社アルバック 基板搬送装置および基板処理装置
CN104752275B (zh) * 2013-12-29 2018-01-09 北京北方华创微电子装备有限公司 工艺腔室以及半导体加工设备
CN105047512B (zh) * 2015-05-29 2017-03-15 光驰科技(上海)有限公司 具备多层载物能力的离子束刻蚀系统及其刻蚀方法
US20170352562A1 (en) * 2016-06-02 2017-12-07 Applied Materials, Inc. Dodecadon transfer chamber and processing system having the same
US9966292B2 (en) * 2016-07-12 2018-05-08 Globalfoundries Inc. Centering fixture for electrostatic chuck system
US10474027B2 (en) 2017-11-13 2019-11-12 Macronix International Co., Ltd. Method for forming an aligned mask
TWI639885B (zh) * 2017-12-11 2018-11-01 旺宏電子股份有限公司 形成對準罩幕的方法、半導體裝置以及形成一組對準罩幕的方法
CN111211082B (zh) * 2018-11-22 2022-10-25 拓荆科技股份有限公司 晶圆传输装置

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08213444A (ja) * 1995-02-02 1996-08-20 Kokusai Electric Co Ltd 基板搬送装置
JPH106166A (ja) * 1996-06-19 1998-01-13 Metsukusu:Kk 方向性を有するワークの搬送装置
JP3445918B2 (ja) * 1997-04-24 2003-09-16 株式会社三協精機製作所 多関節ロボット
US6216873B1 (en) * 1999-03-19 2001-04-17 Asyst Technologies, Inc. SMIF container including a reticle support structure
JP3927758B2 (ja) * 1999-06-03 2007-06-13 東京エレクトロン株式会社 基板搬送装置及び処理装置
US6537011B1 (en) * 2000-03-10 2003-03-25 Applied Materials, Inc. Method and apparatus for transferring and supporting a substrate
US20030000645A1 (en) * 2001-06-27 2003-01-02 Dornfest Charles N. Apparatus and method for reducing leakage in a capacitor stack
US6841006B2 (en) * 2001-08-23 2005-01-11 Applied Materials, Inc. Atmospheric substrate processing apparatus for depositing multiple layers on a substrate
JP2003068620A (ja) * 2001-08-28 2003-03-07 Sendai Nikon:Kk 露光装置
JP4821074B2 (ja) * 2001-08-31 2011-11-24 東京エレクトロン株式会社 処理システム
WO2005036617A1 (ja) * 2003-10-14 2005-04-21 Fuji Research Institute Corporation ワーク枚葉処理システム
JP4665468B2 (ja) * 2004-09-15 2011-04-06 凸版印刷株式会社 フォトマスク及びフォトマスクブランクスの載置方向変更装置
JP2007158011A (ja) * 2005-12-05 2007-06-21 Sharp Corp 基板搬送装置、及び基板搬送システム

Also Published As

Publication number Publication date
JP2008112963A (ja) 2008-05-15
US20080099451A1 (en) 2008-05-01
CN101174098A (zh) 2008-05-07
EP1918977A2 (en) 2008-05-07
KR101457342B1 (ko) 2014-11-03
KR20080039195A (ko) 2008-05-07
EP1918977A3 (en) 2009-12-02
TW200821397A (en) 2008-05-16
TWI439557B (zh) 2014-06-01

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