TWI436074B - Test handler for semiconductor device, and inpection method for semiconductor device - Google Patents

Description

Semiconductor device detecting device and semiconductor device detecting method

The present invention relates to a semiconductor device detecting device, and more particularly to a semiconductor device detecting device and a semiconductor device detecting method for detecting electrical characteristics of a semiconductor device after heating to a test temperature.

After the semiconductor device finishes the packaging process, various detections such as reliability detection of electrical characteristics, heat or pressure are performed by the semiconductor device detecting device.

As an example of the conventional semiconductor device detecting device, the structure includes: a loading portion for loading a plurality of semiconductor devices; a heating plate receiving the semiconductor device from the loading portion for heating for a predetermined time until the temperature reaches a temperature for testing; Testing the electrical characteristics of the semiconductor device or the like after the semiconductor device heated by the heating plate is mounted on the test socket; the unloading portion classifies the semiconductor device according to the test result of the test portion.

On the other hand, as the market competitiveness becomes more and more fierce, semiconductor devices also need to reduce their costs.

Therefore, the semiconductor device detecting apparatus having the above structure also needs to increase the processing speed per unit time to improve the productivity.

Further, the semiconductor device detecting device is disposed in a clean room in which a clean environment is maintained, which requires reduction in the overall production cost of the semiconductor device by reducing the space occupied by the device.

The present invention has been made in view of the above-described necessity, and an object thereof is to provide a semiconductor device detecting device and a semiconductor device detecting method capable of improving productivity by increasing a detection speed for a semiconductor device.

Another object of the present invention is to provide a semiconductor device detecting device and a semiconductor device detecting method capable of reducing the overall production cost of a semiconductor device by reducing the installation space of the semiconductor device detecting device.

The present invention has been made to achieve the above object of the present invention, and a semiconductor device detecting apparatus comprising: a loading portion for loading one or more trays in which a plurality of semiconductor devices are loaded; a heating plate And receiving the semiconductor device from the tray of the loading unit by the first transfer tool to perform heating; and inverting the loading unit, picking up the semiconductor device from the heating plate portion, and inverting the bottom surface of the semiconductor device toward the upper side; the test portion, A test element, a pair of pickup portions, a rotational movement portion, and a linear movement portion, the test element having a test socket for mounting a semiconductor device to detect electrical characteristics with respect to a semiconductor device heated by the heating plate portion, the pickup portion For picking up a plurality of semiconductor devices, the rotating moving portion rotates the pair of pick-up portions between a device replacement position and a device test position, and the linear moving portion linearly moves the pick-up portion to be picked up by the pick-up portion The semiconductor device is mounted on the above test socket or inserted from the above test Separating; a third transfer tool transferring the semiconductor device from the first reverse loading portion to the pick-up portion at the device replacement position; and a fourth transfer tool picking up the semiconductor from the pick-up portion at the device replacement position a device; a reverse unloading portion that reverses and receives the semiconductor device in a state of receiving the semiconductor device from the fourth transfer tool and picks up the same; and unloads the plate portion for loading by the reverse unloading portion The obtained semiconductor device; and the unloading portion classify and load the semiconductor device loaded in the unloading plate portion by the second transfer tool based on the result of the above-described test element.

The heating plate portion includes: a plate-shaped plate member having a plurality of loading grooves formed on an upper surface thereof to enable loading of the semiconductor device; and a heating device disposed on the inner or bottom surface of the plate member for using the semiconductor The device is heated to a predetermined test temperature.

Each of the loading grooves of the plate member is disposed according to the interval between the test sockets described above or at an interval corresponding to the interval of the storage slots of the tray.

The interval between the respective loading grooves of the plate member is 1/2 of the interval between the respective pick-up tools constituting the reverse loading portion.

The heating plate portion includes a pair of plate members that are alternately movable.

The pair of plate members are provided to alternately move between a loading position at which the semiconductor device can be received from the tray of the loading portion and a transfer position at which the reverse loading portion can take out the semiconductor device.

The pair of plate members are disposed to be spaced apart from each other so as not to hinder mutual movement, and the plate member includes one or more guide members for guiding linear movement of the plate members and a linear driving device for driving linear movement of the plate members.

The reverse loading portion includes: a plurality of pick-up tools for picking up the semiconductor device to transfer the plurality of semiconductor devices; and a support portion configured to support the respective pick-up tools and move in the XY direction by the XY linear moving device to The heating plate portion takes out the semiconductor device.

The reverse loading unit further includes a rotation moving device that rotates the support portion to pick up and rotate the semiconductor device from the heating plate portion to be reversed so that the bottom surface of the semiconductor device faces upward.

The reverse unloading portion includes: a plurality of pick-up tools for picking up the semiconductor device to transfer the plurality of semiconductor devices; and a support portion configured to support the respective pick-up tools and move in the XY direction by the XY linear moving device to The semiconductor device is loaded into the above unloading plate.

The reverse unloading portion further includes a rotation moving device that rotates the support portion to pick up and rotate the semiconductor device to be reversed so that the bottom surface of the semiconductor device faces downward.

The third transfer tool and the fourth transfer tool are moved in conjunction with each other by a moving device.

The present invention also provides a semiconductor device detecting method comprising the steps of: a device loading step of loading more than one tray in which a plurality of semiconductor devices are loaded; and a heating step of transferring the semiconductor device from the device by the first transfer tool The tray of the loading step is heated to be received by the heating plate; the first inverting step picks up the semiconductor device heated in the heating step, and inverts the bottom surface of the semiconductor device toward the upper side; the test step passes through the pair at the device replacement position Any one of the pick-up portions receives the semiconductor device reversed by the first inversion step, and the semiconductor device picked up by the pick-up portion after being rotated from the device replacement position to the device test position by the state picked up by the pick-up portion Mounted on the test socket of the test component for testing, and simultaneously picking up the semiconductor device to the remaining pickup portion located at the device replacement position by the rotation of the pickup portion, receiving the semiconductor device inverted by the first inversion step, and After the test is finished, the semiconductor device is removed from above. The test socket is separated to rotate from the device test position to the device replacement position; and the second inverting step receives the semiconductor device that is tested at the end of the test step from the pick-up portion, and inverts it to the lower side in the picked-up state. Performing a transfer; a first unloading step of loading the semiconductor device picked up in the second inversion step to the unloading plate; and a second unloading step loading the second transfer tool pair according to the test result of the test component The semiconductor device of the above unloading plate portion is sorted and loaded.

The reverse loading portion includes: a plurality of pick-up tools for picking up the semiconductor device to transfer the plurality of semiconductor devices; and a support portion configured to support the respective pick-up tools and move in the XY direction by the XY linear moving device to The heating plate portion takes out the semiconductor device; and the rotation moving device rotates the support portion to pick up the semiconductor device from the heating plate portion and rotate it to be reversed so that the bottom surface of each of the conductor devices faces upward.

The reverse unloading portion includes: a plurality of pick-up tools for picking up the semiconductor device to transfer the plurality of semiconductor devices; and a support portion configured to support the respective pick-up tools and move in the XY direction by the XY linear moving device to turn the semiconductor The device is loaded into the unloading plate; and the rotating device rotates the support portion to pick up the semiconductor device and rotate it to reverse the bottom surface of the semiconductor device toward the lower side.

The semiconductor device detecting device and the semiconductor device detecting method of the present invention have an advantage in that a semiconductor device is picked up by a pair of pick-up portions and the pick-up portions are alternately rotated to be mounted on the test socket and separated from the test socket, so that not only can the execution be performed more quickly Testing of semiconductor devices, but also reducing the size of the device.

Further, the semiconductor device detecting device and the semiconductor device detecting method of the present invention have an advantage that since the heating plate portion for heating the semiconductor device is constituted by a pair of plate members which are alternately moved each other before the test, it is possible to increase the number of the device The size is sufficient to maintain the residence time for heating the semiconductor device.

In particular, there is an advantage that two or more of the pair of plate members are disposed in parallel with each other, thereby providing sufficient residence time for heating of the semiconductor device, and enabling transfer of the semiconductor device can be performed quickly.

Hereinafter, a semiconductor device detecting device and a semiconductor device detecting method of the present invention will be described in detail with reference to the accompanying drawings.

As shown in FIGS. 1 to 6, the semiconductor device detecting device of the present invention has a structure including: a loading portion 100 for loading the semiconductor device 10; a heating plate portion 200 for receiving the semiconductor device 10 from the loading portion 100 for heating; The test unit 300 performs electrical characteristic testing on the semiconductor device 10 heated by the heating plate portion 200. The reverse loading portion 510 inverts the semiconductor device 10 into a semiconductor device before transferring it from the heating plate portion 200 to the test portion 300. The bottom surface of 10 faces the upper side; the reverse unloading portion 520 receives the semiconductor device 10 from the test portion 300 and reverses the bottom surface of the semiconductor device 10 toward the lower side; the unloading plate portion 400 receives the semiconductor device 10 from the reverse unloading portion 520. On the other hand, the unloading unit 600 loads the semiconductor device 10 from the unloading plate unit 400 based on the test result of the test unit 300.

The loading unit 100 is configured to mount one or more trays 20, and the medium tray 20 is loaded with a plurality of semiconductor devices 10, and various structures can be formed according to designs and patterns.

As shown in Fig. 1, an example of the loading unit 100 is configured such that a plurality of trays 20 are appropriately disposed such that the first transfer tool 530 continuously picks up the semiconductor device 10 for transfer, and the semiconductor device 10 is not mounted. The tray 20 and the tray 20 filled with the semiconductor device 10 can be alternated. Here, after the predetermined number of trays 20 are loaded manually or automatically, the first transfer tool 530 can be automatically transferred to a position where the semiconductor device 10 can be taken out.

At this time, the empty tray 20 from which the semiconductor device 10 has been taken out can be transferred to the unloading unit 600 by the tray transfer unit (not shown), and can be rotated by the tray inverting unit (not shown) before being transferred to the unloading unit 600. To remove the semiconductor device 10 that has not been removed in the tray 20.

Further, a tray buffer portion (not shown) capable of temporarily loading the empty tray 20 can be provided between the loading unit 100 and the unloading unit 600.

The tray 20 can be configured in various configurations such as a configuration in which the housing groove 21 is formed according to a predetermined specification such as 8×16, so that the plurality of semiconductor devices 10 are loaded.

Further, the semiconductor device 10 as a detection object is a semiconductor for storage, such as a non-storage semiconductor of a system LSI. In particular, it is preferable to use a semiconductor device in which a system LSI, in particular, a spherical contact terminal is formed on the bottom surface, as a detection target.

The heating plate unit 200 is configured to receive the semiconductor device 10 from the tray 20 of the loading unit 100 by the first transfer tool 530, and can be configured to have various configurations, and can be configured to pass a predetermined heating time, for example, about 90. The heating time of seconds or more heats the semiconductor device 10 to a predetermined temperature.

As shown in FIG. 1, FIG. 2, and FIG. 3, the heating plate portion 200 can include a plate-shaped plate member 210 having a plurality of loading grooves 211 formed on the upper surface so as to be loaded into the semiconductor device 10; A heating device, disposed inside or on the bottom surface of the board member 210, heats the semiconductor device 10 to a predetermined test temperature. Here, when the semiconductor device 10 is heated to the test temperature, it is heated in consideration of a thermal shock caused by heating or the like for a predetermined period of time, that is, a period of time longer than the heating time.

The plate member 210 can be formed integrally with the heating device or as a separate member, and can form a plurality of loading grooves 211 so as to be loaded into the semiconductor device 10.

Further, the loading grooves 211 of the plate member 210 can be arranged in accordance with the interval of the test socket 311 in order to efficiently take out the reverse loading unit 510, which will be described later. However, in consideration of the overall size of the device, it is preferable to correspond to the tray 20. The intervals of the storage slots 21 are arranged.

Further, the interval between the loading grooves 211 of the plate member 210 is preferably 1/2 of the interval of the pickup tool 511 constituting the reverse loading portion 510, so that the reverse loading portion 510 can be taken out more efficiently.

Here, when the interval formed by each of the loading grooves 211 of the plate member 210 is 1/2 of the interval formed by each of the pickup tools 511 of the reverse loading portion 510, it can be taken out and loaded on the plate member by skipping one. The semiconductor device 10 of each of the loading grooves 211 of 210 does not need to adjust the lateral and longitudinal intervals (pitch) of the respective pick-up tools 511 of the reverse loading portion 510.

At this time, the lateral and longitudinal numbers of the loading grooves of the above-described plate member 210 are preferably a multiple (two times, four times, etc.) of the number of picking tools of the reverse loading portion 510.

On the other hand, the above-described heating plate portion 200 needs to wait for a time longer than the heating time after receiving the semiconductor device 10 from the loading portion 100, so that the test temperature is stably reached, and since the time of transmission to the test portion 300 is affected by the structure of the heating plate portion 200, Therefore, the heating plate portion 200 is preferably loaded with as many semiconductor devices 10 as possible.

However, as the semiconductor device 10 having a larger number of loads is loaded, the size of the heating plate portion 200 becomes larger, eventually causing a problem that the installation space of the device becomes large due to the increase in the size of the device.

Therefore, the above-described heater board portion 200 needs to be configured to be able to load a larger number of semiconductor devices 10, so that the residence time of the semiconductor device 10 is sufficiently ensured without increasing the size of the device.

As shown in FIG. 1, FIG. 2, and FIG. 3, the above-described heating plate portion 200 includes a pair of plate members 210 that are alternately movable.

As shown in FIG. 2, the pair of plate members 210 are provided to alternately move the loading position at which the semiconductor device 10 can be received from the tray 20 of the loading unit 100 and the transfer position at which the reverse loading unit 510 can take out the semiconductor device 10.

Here, the loading position is a position adjacent to the loading unit 100 based on the operation route (Y axis) of the connection loading unit 100 and the reverse loading unit 510, and the transmission position is adjacent to the reverse loading unit 510. position.

In particular, the heating plate portion 200 can be disposed in parallel with each other by the pair of plate members 210, and is composed of four plate members 210 so that the semiconductor device 10 can stay in a sufficient heating time.

On the other hand, as shown in Fig. 3, the pair of plate members 210 are disposed to be spaced apart from each other so as not to hinder mutual movement, and include one or more guiding members 221 for guiding linear movement of the plate member 210 and for driving Linear drive 222 for linear movement of the above plate members.

In the case of constituting the hot plate portion 200 as described above, the residence time of the semiconductor device 10 can be sufficiently maintained without increasing the size of the device.

Further, since the reverse loading portion 510 can more easily take out the semiconductor device 10 from the hot plate portion 200, there is an advantage that the processing speed of the device is remarkably improved.

In the heating plate portion 200 having the structure shown in Figs. 1 and 2, the plate member 210 at the loading position is loaded with the semiconductor device 10 from the loading portion 100 by the first transfer tool 530 while the plate member at the transfer position The semiconductor device 10 is taken out by the reverse loading portion 510. Here, the plate member 210 is continuously heated by applying a predetermined amount of heat until the semiconductor device 10 is taken out after being loaded.

On the other hand, when the board member 210 at the loading position is filled with the semiconductor device 10, and the semiconductor device 10 is emptied from the board member 210 at the transfer position, the pair of board members 210 will be interchanged with each other to perform the loading of the semiconductor device 10. And the removal process.

In particular, when the pair of plate members 210 are arranged in parallel with each other and are configured by a total of four plate members 210, since the semiconductor device 10 can be loaded and removed continuously, the size of the device can be increased and the semiconductor can be remarkably improved. The detection speed of device 10.

The reverse loading unit 510 is configured to take out the semiconductor device 10 from the heating plate unit 200 and transmit the semiconductor device 10 to the test unit 300. Various configurations can be formed depending on the configuration of the heating plate unit 200 and the test unit 300.

The above-described reverse loading portion 510 includes a plurality of pick-up tools 511 for picking up the semiconductor device 10 so as to be able to transfer a plurality of semiconductor devices 10, and a support portion 512 configured to support the respective pick-up tools 511 and to pass along the XY linear motion device The XY direction is moved to take out the semiconductor device 10 from the heater board portion 200.

In consideration of the fact that the lateral direction and the longitudinal interval of the test socket 311 of the heating plate portion 200 and the test portion 300 are different from each other, the respective pick-up tools 511 of the reverse loading portion 510 are configured to be able to adjust the lateral and longitudinal intervals, but can be as shown in FIG. And the lateral and longitudinal spacings are fixed as shown in FIG. 4 to transfer more semiconductor devices 10.

In particular, when each of the pickup tools of the first transfer tool 530 is disposed at 2 × 8 and more semiconductor devices 10 can be transferred, each of the pickup tools 511 of the reverse loading unit 510 can be disposed at 4 × 8.

On the other hand, in order to quickly perform the test of the test unit 300 to be described later, the reverse loading unit 510 picks up the semiconductor device 10 from the hot plate unit 200 and rotates it so that the bottom surface of the semiconductor device 10 faces upward.

The reverse loading unit 510 further includes a rotation moving device 513 that rotates the support portion 512 to pick up the semiconductor device 10 from the heating plate portion 200 and rotate it to be reversed to the bottom surface of the semiconductor device 10. Upper side.

The above test portion 300 is a structure for performing electrical characteristic detection on the semiconductor device 10 heated by the heating plate portion 200, the structure including: a test element 310 having a plurality of test sockets 311 for mounting the semiconductor device 10; a pair of pickups a portion 320 for picking up the plurality of semiconductor devices 10; rotating the moving portion 330 to rotate the pair of pick-up portions 320 between the device replacement position and the device test position; and the linear moving portion 340 to linearly move the pick-up portion 320 to The semiconductor device 10 picked up by the pickup portion 320 is mounted to or detached from the test socket 311.

Here, the device replacement position refers to a position at which the semiconductor device 10 can be replaced with the reverse loading portion 510 and the reverse unloading portion 520, and the device test position means that the semiconductor device 10 picked up by the pickup portion 320 can be mounted to the test socket 311. Or a position separated from the test socket 311.

The above test element 310 is a structure for performing electrical characteristic testing on the semiconductor device 10 heated to the test temperature, is capable of forming various structures according to tests, and includes a plurality of test sockets 311 capable of mounting the semiconductor device 10.

The pair of pickup units 320 include the pickup tools 321 corresponding to the reverse loading unit 510 to receive the semiconductor device 10 from the reverse loading unit 510.

Each of the pick-up tools 321 of the pair of pick-up units 320 can be arranged in various forms. When the first transfer tool 530 is disposed at 2×8, it can be arranged at 4×8 in accordance with the test socket 311.

On the other hand, the pickup unit 320 performs a process of receiving the semiconductor device 10 from the reverse loading portion 510 by a combination of rotation and up-and-down movement, and inserting the semiconductor device 10 into the test socket 311 by rotation and up-and-down movement for testing. Thereafter, the semiconductor device 10 is transferred to the reverse unloading portion 520.

Therefore, the pair of pickup units 320 can be driven by various mechanisms that embody a combination of rotation and up and down movement.

For example, as shown in FIGS. 1 and 4, the test unit 300 includes a rotation moving unit 330, a rotation shaft 331 including a pair of pickup units 320, and a rotation driving device 332 for rotationally driving the rotation shaft 331; And the linear movement unit 340, when any one of the pickup units 320 is positioned above the test socket 311, moves the pickup unit 320 to the lower side to be mounted on the test socket 311, and after performing the test, moves the pickup unit 320 upward. The test socket 311 is separated.

The linear movement unit 340 can form various structures such as a screw jack according to a linear movement method.

On the other hand, as shown in Fig. 1, the above test portion 300 further includes a test chamber 350 that only opens a part of the upper side portion, so that the test element 310 stably performs the test for the semiconductor device 10 and avoids hindering the transfer of the semiconductor device 10. .

The test chamber 350 can be configured to have an arbitrary configuration as long as it can prevent temperature changes to the maximum extent without affecting the test environment of the test component 310.

The reverse inversion unit 520 is configured to receive the semiconductor device 10 that has been tested by the test unit 300 from the pickup unit 320 and invert it, and then transfer it to the unloading plate unit 400, substantially in opposition to the reverse loading unit 510. The structure is the same, and detailed description is omitted.

That is, the above-described reverse unloading portion 520 includes a plurality of pick-up tools 521 for picking up the semiconductor device 10 to transfer the plurality of semiconductor devices 10, and a supporting portion provided to support the respective pick-up tools 521 and to pass the XY linear motion device along the XY The direction is moved to take out the semiconductor device 10 from the heating plate portion 200; and the rotating device rotates the plurality of pick-up tools 521 to reverse.

The above-described unloading plate portion 400 is a structure for temporarily loading the semiconductor device 10 before transferring the semiconductor device 10 to the unloading portion 600 according to the test result of the test portion 300, and the plate member 410 of the unloading plate portion 400 and the semiconductor device 10 need to stay in regulation. The plate member 210 of the heating plate portion 200 having a residence time longer than the time is different and is not limited by the residence time. Therefore, it is possible to include one or more of the appropriate number of the respective loading grooves 411 in consideration of the transfer speed of the semiconductor device 10 or the like. Plate member 410.

On the other hand, the plate member 410 can also be provided with a cooling device for cooling the heated semiconductor device 10, and the plate member 210 can be formed integrally with the cooling device or as an independent member.

On the other hand, as shown in FIGS. 1 and 2, the transfer of the semiconductor device 10 between the reverse loading unit 510 and the test unit 300 and between the test unit 300 and the reverse unloading unit 520 can pass the third and The fourth transfer tool 550, 560 performs.

The third transfer tool 550 picks up the semiconductor device 10 inverted from the reverse loading portion 510 to the upper side, transfers it to the pickup portion 310 of the test portion 300 at the device replacement position, and the fourth transfer tool 550 ends the test and is located in the device. The pickup unit 310 of the test portion 300 of the replacement position picks up the semiconductor device 10 and transfers it to the reverse unloading portion 520 in a state where the upper side is reversed.

The third transfer tool 550 and the fourth transfer tool 560 include: a plurality of pick-up tools 551, 561 capable of picking up the semiconductor device 10; and a moving device configured to support the pick-up tools 551, 561 and to make the pick-up tools 551, 561 Move.

Further, in consideration of the fact that the lateral direction and the longitudinal interval of the test socket 311 of the heating plate portion 200 and the test portion 300 are different from each other, the plurality of pick-up tools 551 and 561 constituting the third transfer tool 550 and the fourth transfer tool 560 are configured to be capable of The lateral and longitudinal spacing structures are adjusted, but as shown in Figures 1 and 4, the lateral and longitudinal spacings are fixed to enable the transfer of a greater number of semiconductor devices 10.

Further, in consideration of the fact that the semiconductor device 10 picked up by the third transfer tool 550 is loaded after the semiconductor device 10 is taken out from the pickup unit 320 by the fourth transfer tool 560, the third transfer tool 550 and the fourth transfer tool 560 can be interlocked with each other. The movement is performed, in particular, the moving device supporting each of the pickup tools 551, 561 can be formed into one.

The unloading unit 600 sorts the semiconductor device 10 loaded in the unloading plate unit 400 by the second transfer tool 540 based on the test result of the test element 310 of the test unit 300.

The configuration of the unloading unit 600 is similar to that of the loading unit 100. As an example, as shown in Fig. 1, an appropriate number of trays 20 are disposed according to a classification standard based on test results, and are configured as a tray filled with the semiconductor device 10. 20 can alternate with the empty tray 20 in an automatic or manual manner.

On the other hand, as described above, the empty tray 20 is an empty tray 20 that is emptied in the loading unit 100, and can be transferred by a tray transfer unit (not shown).

On the other hand, each of the pick-up tools 511 constituting the reverse loading unit 510, the reverse unloading unit 520, the first transfer tool 530, the second transfer tool 540, the third transfer tool 550, the fourth transfer tool 560, and the pickup unit 320 521, 531, 541, 551, 561, 321 can be configured as a pick-up tool having a suction head that adsorbs the semiconductor device 10 by vacuum pressure.

The transfer process from the reverse loading portion 510 having the above configuration to the reverse unloading portion 520 will be described below with reference to FIGS. 4 to 6 as follows.

First, the reverse loading unit 510 picks up the semiconductor device 10 from the hot plate unit 200 and then inverts it to a state as shown in Fig. 6 .

When the reverse loading unit 510 picks up the semiconductor device 10 and is in the state shown in FIG. 6, as shown in FIG. 4, the third transfer tool 550 and the fourth transfer tool 560 move to the reverse loading in conjunction with each other. The upper portion of the portion 510 and the upper portion of the pickup portion 320.

Moreover, as shown in FIG. 5, the third transfer tool 550 and the fourth transfer tool 560 respectively pick up the semiconductor device 10, so that the third transfer tool 550 loads the semiconductor device 10 into the pickup unit 320, and the fourth transfer tool 560 The semiconductor device 10 is loaded to the reverse unloading portion 520.

On the other hand, as shown in FIG. 6, the semiconductor device 10 of the end test is picked up by the fourth transfer tool 560, and when the semiconductor device 10 to be tested is loaded by the third transfer tool 550, the pickup portion 320 and the pass-through moving portion are passed. The rotation of 330 alternates toward the pickup portion 320 of the test socket 311. At this time, the third transfer tool 550 and the fourth transfer tool 560 move in order to pick up and load the semiconductor device 10.

Further, as shown in FIG. 4, when the pickup portion 320 of the semiconductor device 10 to be tested is placed in the state toward the test socket 311, the semiconductor device 10 loaded in the pickup portion 320 is attached to the test socket 311 by the linear movement portion 340. And was tested.

At this time, the pickup unit 320 facing the upper side performs the transfer of the semiconductor device 10 as described above.

On the other hand, as shown in Fig. 6, the reverse unloading portion 520 of the semiconductor device 10 that has received the end test transmits the semiconductor device 10 that has finished testing to the unloading plate portion 400 after the inversion.

The semiconductor device detecting apparatus of the present invention having the above structure can perform detection for a semiconductor device by a detecting method including the following steps.

That is, the semiconductor device detecting method of the present invention includes the steps of: a device loading step of loading more than one tray in which a plurality of semiconductor devices are loaded; and a heating step of loading the semiconductor device from the device by the first transfer tool The tray is heated to be received by the heating plate; the first inverting step picks up the semiconductor device heated in the heating step and reverses it to the upper side of the semiconductor device toward the upper side; the test step passes through the pair of pickup portions at the device replacement position Any one of the semiconductor devices reversed by the first inversion step to be mounted on the test element after the semiconductor device picked up by the pickup portion is rotated from the device replacement position to the device test position by the state picked up by the pickup portion Testing the socket while picking up the semiconductor device to the remaining pickup portion at the device replacement position by the rotation of the pickup portion, receiving the semiconductor device inverted by the first inversion step, and ending the semiconductor device from the test socket after the end of the test Separate and rotate from device test position to device a second inversion step of receiving, from the pickup portion, the semiconductor device that is tested at the end of the test step, causing it to be reversed to be transferred toward the lower side in the picked-up state; the first unloading step, which will be in the second reverse The semiconductor device picked up by the turning step is loaded to the unloading plate; and the second unloading step is loaded by classifying the semiconductor device loaded in the unloading plate portion by the second transfer tool according to the test result of the test element.

The above description is only a part of the preferred embodiment of the present invention, and it should be noted that the scope of the present invention is not limited to the above embodiments, and the technical principles of the present invention and the technical ideas having equivalent meanings as described above should be considered. It is the scope of protection of the present invention.

10. . . Semiconductor device

20. . . tray

twenty one. . . Storage slot

100. . . Loading department

200. . . Heating plate

210, 410. . . Board component

211, 411. . . Loading slot

221. . . Guide part

222. . . Linear drive

300. . . Testing Division

310. . . Test component

311. . . Test socket

320. . . Picking department

321, 511, 521, 551, 561. . . Pickup tool

330. . . Rotating moving part

331. . . Rotary axis

332. . . Rotary drive

340. . . Linear movement

350. . . Test room

400. . . Unloading board

510. . . Reverse loading section

512. . . Support

513. . . Rotary mobile device

520. . . Reverse unloading department

530. . . First transfer tool

540. . . Second transfer tool

550. . . Third transfer tool

560. . . Fourth transfer tool

600. . . Unloading department

Figure 1 is a plan view showing a semiconductor device detecting device of the present invention;

Fig. 2 is a plan view showing an example of a heating plate of the semiconductor device detecting device of Fig. 1;

Figure 3 is a cross-sectional view of the heating plate of Figure 2;

4 to 6 are side views showing the operation of the semiconductor device detecting device of Fig. 1 from the reverse loading unit to the reverse unloading unit.

10. . . Semiconductor device

20. . . tray

twenty one. . . Storage slot

100. . . Loading department

200. . . Heating plate

210, 410. . . Board component

300. . . Testing Division

310. . . Test component

311. . . Test socket

320. . . Picking department

350. . . Test room

400. . . Unloading board

411. . . Loading slot

510. . . Reverse loading section

511, 521. . . Pickup tool

512. . . Support

513. . . Rotary mobile device

520. . . Reverse unloading department

530. . . First transfer tool

540. . . Second transfer tool

550. . . Third transfer tool

560. . . Fourth transfer tool

600. . . Unloading department

Claims (19)

A semiconductor device detecting apparatus comprising: a loading portion for loading one or more trays, wherein a plurality of semiconductor devices are loaded in the tray; and a heating plate portion receiving a semiconductor device from a tray of the loading portion by a first transfer tool And heating, reversing the loading portion, picking up the semiconductor device from the heating plate portion, and inverting the bottom surface of the semiconductor device toward the upper side; the test portion having the test element, the pair of picking portions, the rotational moving portion, and the linear moving portion The test element has a test socket for mounting a semiconductor device to detect electrical characteristics with respect to a semiconductor device heated by the heater plate portion; the pickup portion is for picking up a plurality of bundles of semiconductor devices; the rotary moving portion makes the one Rotating the picking portion between the device changing position and the device testing position; the linear moving portion linearly moving the picking portion such that the semiconductor device picked up by the picking portion is mounted to or detached from the test socket a third transfer tool that transfers the semiconductor device from the reverse loading portion to the replacement device The picking portion; the fourth transfer tool picks up the semiconductor device that ends the test from the picking portion at the device replacement position; reverses the unloading portion, receives the semiconductor device from the fourth transfer tool, and picks up the semiconductor device Reversing in the state and moving toward the lower side; transferring the plate portion for loading the semiconductor device picked up by the reverse unloading portion; and unloading portion, according to the result of the test element, by the second transfer tool pair The semiconductor device loaded in the unloading plate portion is sorted and loaded. The semiconductor device detecting device according to claim 1, wherein the heating plate portion includes: a plate member having a plate shape, a plurality of loading grooves formed on an upper surface thereof to load the semiconductor device; and heating A device disposed on an interior or a bottom surface of the board member for heating the semiconductor device to a predetermined test temperature. The semiconductor device detecting device according to claim 2, wherein the board member Each of the loading slots is configured according to the interval of the test sockets or at an interval corresponding to the interval of the receiving slots of the tray. The semiconductor device detecting device according to claim 2, wherein an interval of each of the loading grooves of the plate member is 1/2 of an interval of each of the pick-up tools of the reverse loading portion. The semiconductor device detecting device according to claim 2, wherein the heating plate portion includes a pair of plate members that are alternately movable. The semiconductor device detecting device according to claim 5, wherein the pair of plate members are disposed to be capable of receiving a semiconductor device from a loading position of the tray of the loading portion, and the reverse loading portion is capable of taking out the semiconductor device The transfer positions alternate between each other. The semiconductor device detecting device according to claim 5, wherein the pair of plate members are disposed to be spaced apart from each other so as not to hinder mutual movement, and the plate member includes one or more of linear movements for guiding the plate member. Guide member and linear drive for driving linear movement of the plate member. The semiconductor device detecting device according to claim 1, wherein the reverse loading portion includes: a plurality of pick-up tools for picking up the semiconductor device to transfer the plurality of semiconductor devices; and a support portion configured to support the Each of the pick-up tools is moved in the XY direction by the XY linear motion device to take out the semiconductor device from the heater board portion. The semiconductor device detecting device according to claim 8, wherein the reverse loading unit further includes a rotary moving device that rotates the support portion to pick up the semiconductor device from the heating plate portion and The rotation thereof is reversed so that the bottom surface of the semiconductor device faces the upper side. The semiconductor device detecting device according to claim 1, wherein the reverse unloading portion includes: a plurality of pick-up tools for picking up the semiconductor device to transfer the plurality of semiconductor devices; and a support portion configured to support the Each pick tool is moved in the XY direction by an XY linear moving device to load the semiconductor device to the unloading plate. The semiconductor device detecting device according to claim 10, wherein the reverse unloading portion further includes a rotary moving device that rotates the support portion to pick up The semiconductor device is taken and rotated to be inverted so that the bottom surface of the semiconductor device faces the lower side. The semiconductor device detecting device according to the first aspect of the invention, wherein the third transfer tool and the fourth transfer tool are moved in conjunction with each other by a moving device. A semiconductor device detecting method comprising the steps of: loading a device by loading more than one tray through a loading portion, loading a plurality of semiconductor devices in the tray; and heating step of transferring the semiconductor device from the device through the first transfer tool The tray of the loading step is heated to the heating plate portion; the first inverting step picks up the semiconductor device heated in the heating step, and reverses the loading portion to reverse the bottom surface of the semiconductor device toward the upper side; the test step is The device replacement position receives the semiconductor device inverted by the first inversion step by any one of the pair of pickup portions, and is rotated by the pickup portion to the device test position after being picked up from the device replacement position The semiconductor device picked up by the pick-up portion is mounted on the test socket of the test component for testing, and the semiconductor device is picked up by the rotation of the pick-up portion to the remaining pick-up portion located at the device replacement position, and the first pass is received. Inverting the step of inverting the semiconductor device and ending the test after the semiconductor device Separating from the test socket and rotating from the device test position to the device replacement position; and a second inverting step of receiving, from the pick-up portion, the semiconductor device tested at the end of the test step, inverting to pass through the reverse loading portion Transfer in a picked-up state toward the lower side; a first unloading step of loading the semiconductor device picked up in the second inversion step to the unloading plate portion; and a second unloading step based on the test result of the test element Loading the semiconductor device loaded in the unloading plate portion by the second transfer tool. The semiconductor device detecting method according to claim 13, wherein the heating plate portion includes: a plate member in a plate shape, a plurality of loading grooves are formed on an upper surface thereof to load the semiconductor device; and heating a device disposed on an inner or bottom surface of the board member for heating the semiconductor device to a predetermined Test temperature. The semiconductor device detecting method according to claim 14, wherein an interval of each of the loading grooves of the plate member is 1/2 of an interval of each of the pickup tools of the reverse loading portion. The semiconductor device detecting method according to claim 14, wherein the heating plate portion includes a pair of plate members that are movable alternately with each other. The semiconductor device detecting method according to claim 16, wherein the pair of plate members are disposed to be capable of receiving a semiconductor device from a loading position of the tray of the loading portion, and the reverse loading portion is capable of taking out the semiconductor device The transfer positions alternate between each other. The semiconductor device detecting method according to claim 13, wherein the reverse loading portion includes: a plurality of pick-up tools for picking up the semiconductor device to transfer the plurality of semiconductor devices; and a support portion configured to support the Each of the pick-up tools is moved in the XY direction by the XY linear moving device to take out the semiconductor device from the heating plate portion; and the rotating device is rotated to rotate the support portion to pick up the semiconductor device from the heating plate portion The bottom surface of each of the conductor devices is rotated and reversed toward the upper side. The semiconductor device detecting method according to claim 13, wherein the reverse unloading portion includes: a plurality of pick-up tools for picking up the semiconductor device to transfer the plurality of semiconductor devices; and a support portion configured to support the Each picking tool is moved in the XY direction by the XY linear moving device to load the semiconductor device to the unloading plate; and the rotating device is rotated to rotate the supporting portion to pick up the semiconductor device and rotate it to be inverted The bottom surface of the semiconductor device faces the lower side.